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Bonding assembly equipment

A technology for assembling equipment and bonding, applied in mechanical equipment, connecting components, injection devices, etc., can solve problems such as low bonding efficiency, long bonding cycle, and need for repeated positioning, so as to improve bonding efficiency and improve bonding. Accuracy and the effect of saving positioning times

Inactive Publication Date: 2020-12-15
BOZHON PRECISION IND TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the existing bonding and assembly equipment is generally arranged in a production line, and each station involved in the assembly needs to rely on the assembly line to transfer the jigs carrying the workpieces to be bonded, resulting in a long bonding cycle and when the workpieces are transferred to each station. Repeated positioning is required, and the bonding efficiency is low

Method used

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Embodiment Construction

[0070] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.

[0071] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components or the interaction relationship between two ...

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Abstract

The invention belongs to the technical field of automatic assembly, and discloses bonding assembly equipment which is used for bonding assembly of a first workpiece and a second workpiece. The bondingassembly equipment comprises a jig, a first feeding device, a second feeding device, an assembling device and a glue dispensing device. The jig is configured to clamp the first workpiece. The first feeding device is configured to receive the jig input from the outside and can further transfer the jig to an assembling station and a discharging station. The second feeding device is configured to store and output the second workpiece. And the assembling device can be moved to the position among the second feeding device, the assembling station and the glue dispensing mechanism so as to pick up the second workpiece provided by the second feeding device, and after the glue dispensing device coats glue onto the bonding part of the second workpiece, the second workpiece can be bonded and assembled to the first workpiece located at the assembling station. The bonding assembly equipment provided by the invention can be used for efficiently carrying out bonding assembly operations.

Description

technical field [0001] The invention relates to the technical field of automatic assembly, in particular to an adhesive assembly equipment. Background technique [0002] In the production process of electronic equipment, some parts need to be bonded and assembled into the frame of the electronic equipment, for example, the listening / microphone structure bracket of the mobile phone is installed to the corresponding mounting hole on the mobile phone frame. In order to improve production efficiency, the above-mentioned bonding and assembly operations are generally completed by bonding and assembling equipment. [0003] However, the existing bonding and assembly equipment is generally arranged in a production line, and each station involved in the assembly needs to rely on the assembly line to transfer the jigs carrying the workpieces to be bonded, resulting in a long bonding cycle and when the workpieces are transferred to each station. Repeated positioning is required, and th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C5/02B05C13/02B05B15/50F16B11/00
CPCB05C5/0212B05C13/02B05B15/50F16B11/006
Inventor 张志军何难赵文超
Owner BOZHON PRECISION IND TECH CO LTD
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