A chip bonding device and method

A chip bonding and bonding device technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as low accuracy and yield, and achieve the effects of improving yield, saving operating time, and saving plant area.

Active Publication Date: 2020-02-21
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a chip bonding device and method to solve the problems of low precision and yield in the prior art

Method used

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  • A chip bonding device and method
  • A chip bonding device and method
  • A chip bonding device and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] like figure 1 As shown, a chip bonding device includes a chip supply unit 10, a chip pick-up unit 20, a chip measurement unit 30, a chip temporary carrying unit 40 and a chip bonding unit 50 corresponding in sequence, and the chip temporary carrying unit 40 includes a carrying Turntable 41, bonding hands 42 distributed on the carrying turntable 41 along the circumferential direction, the chip pick-up unit 20 picks up the chip on the chip supply unit 10, and after alignment by the chip measurement unit 30, handover to the The bonding hand 42 receives the chip and transfers it to the chip bonding unit 50 for bonding with the substrate carried on the chip bonding unit 50 . Specifically, the chip supply unit 10, the chip pick-up unit 20, the chip measurement unit 30, the chip temporary carrying unit 40 and the chip bonding unit 50 adopt a three-dimensional layout. In this embodiment, the chip supply unit 10 is located at the bottom, and the chip temporary carrying unit 40 ...

Embodiment 2

[0063] like Figure 4 As shown, the difference from Embodiment 1 is that when the chip mark is in a die-down bonding mode, the chip pick-up unit 20 includes a pick-up hand 21, and the pick-up hand 21 picks up the chip from the chip supply unit 10, The rotation reaches the measuring station and the handover station of the temporary chip carrying unit in sequence, and is transmitted to the bonding hand 42 , and the measuring station corresponds to the chip measuring unit 30 . Specifically, the pick-up hand 21 picks up the chip from the chip supply unit 10, and first rotates to the measurement station, and the chip measurement unit 30 aligns the chip, that is, measures and aligns the alignment marks on the chip. After quasi-finishing, the picking hand 21 carries the chip and continues to rotate to the handover station of the chip temporary carrying unit, and handover the chip to the bonding hand 42 .

[0064] The pick-up hand 21 can move vertically between the chip supply unit 1...

Embodiment 3

[0066] like Figure 5As shown, the difference from Embodiment 1 is that when the chip mark is in a die-down bonding mode, the chip pick-up unit 20 includes a pick-up hand 21, a turning hand 22 and a delivery hand 23 arranged in sequence from bottom to top. , the pick-up hand 21 picks up the chip from the chip supply unit 20, rotates and transfers it to the flipping hand 23, and the flipping hand 23 rotates in turn to reach the measurement station and transfer hand transfer station, and the transfer hand 23 absorbs the The chip is handed over to the bonding hand 42 , and the measuring station corresponds to the chip measuring unit 30 . Specifically, the pick-up hand 21 picks up the chip from the chip supply unit 10, and rotates to the turning hand handover station. The turning hand 22 receives the chip and first rotates to the measuring station, and the chip measuring unit 30 checks the chip. Alignment, after the alignment is completed, the turning hand 22 continues to rotate ...

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PUM

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Abstract

The invention discloses a chip bonding device and method. The chip bonding device comprises a chip supply unit, a chip pickup unit, a chip measurement unit, a chip temporary load-bearing unit and a chip bonding unit which are correspondingly arranged in sequence, wherein the chip temporary load-bearing unit comprises a load-bearing rotary table and bonding hands distributed on the load-bearing rotary table along the circumferential direction, the chip pickup unit picks up a chip on the chip supply unit, the chip is subjected to alignment through the chip measurement unit and then transferred to the bonding hand, and the bonding hand receives the chip and transfers the chip to a substrate borne on the chip bonding unit for bonding. The chip bonding device is applicable to a chip mounting mode with the chip facing upwards and a chip mounting mode with the chip facing downwards, and expands the application range of the equipment; the bonding hands are driven to transmit the chips throughthe load-bearing rotary table so as to save the transmission time, and the plurality of bonding hands operate simultaneously so as to improve the production rate; and the chip is aligned through the chip measurement unit, and the chip supply unit is provided with a separation detection system, so that the position of the chip is aligned, and the bonding accuracy is improved.

Description

technical field [0001] The invention relates to the technical field of chip bonding, in particular to a chip bonding device and method. Background technique [0002] The flip chip bonding process is a form of interconnection formed by connecting a chip to a carrier. Due to the development trend of electronic products towards lightness, thinness and miniaturization, the application of chip bonding technology is increasing. Combining chip bonding technology with wafer-level packaging technology can produce smaller package size and higher performance. In addition, if the chip bonding process is combined with the TSV (Through Silicon Vias, through-silicon via) process, a chip structure with more competitive cost and performance can be produced. There are currently three fan-out (fan-out) bonding processes on the market, among which the chip-first-based fan-out bonding process is the mainstream process form that is widely used. The chip First process includes die-up (chip mark ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/603
CPCH01L24/03
Inventor 夏海姜晓玉陈飞彪
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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