An injection-moulding device is disclosed, comprising at least first and second mould parts, defining a mould cavity, wherein at least one of the mould parts comprises heating means, for heating the mould part in the vicinity of a mould cavity surface, said heating means comprising an inductive coil having a plurality of windings and being powered by an oscillator. The mould part comprises a top member, at the mould cavity surface, and, beneath the top member, a carrier member comprising grooves for taking up said coil windings, wherein the top member resistivity is lower than 1.5*10−6 Ωm, the top member relative magnetic permeability is lower than 10, the carrier member resistivity is higher than 20*10−6 Ωm, and the carrier member relative magnetic permeability is higher than 50.