34results about How to "Efficient and uniform cooling" patented technology

In a battery pack including rechargeable batteries arranged in parallel, a cooling medium path for allowing a cooling medium to horizontally flow be formed between the rechargeable batteries. A cooling medium delivery device for delivering the cooling medium to the cooling medium path is provided so as to reduce a height of the battery pack including a cooling device. The cooling medium delivery device is constituted by a pair of cooling medium introduction ducts provided on both right and left sides of the battery pack, each having delivery ports for delivering the cooling medium alternately in horizontally opposed directions to each of the cooling medium paths, and a cooling medium compression transport device for supplying the cooling medium to both of the cooling medium introduction ducts.

In an engine having a generator mounted thereon, an oil passage is formed within the engine's crankcase to supply oil to an oil jet for cooling one or more pistons. In addition, oil is supplied to an oil jet for cooling the generator, using the oil passage in common with the oil supply for cooling the piston, without requiring a separate, dedicated oil passage for the generator. The cooling oil delivery structure is provided for cooling the generator which is located at one end of the crankshaft. The oil passage for cooling pistons, which includes an oil jet for cooling each respective piston by jetting oil to the piston, is arranged on an axis substantially parallel to the crankshaft. A generator-cooling oil jet is provided on the crankcase at a terminal end of, and in fluid communication with the oil passage for cooling the pistons.

The present invention is directed to a semiconductor thermal processing system and an apparatus for thermally cooling a semiconductor substrate. According to one aspect of the present invention, a semiconductor thermal processing system and associated apparatus and method are disclosed which provides a segmented cold plate situated within a process chamber, wherein a plurality of segments of the cold plate are operable to radially translate between an engaged position and a disengaged position, wherein a substrate holder may pass between the plurality of segments when the segments are in the disengaged position. According to another aspect, an elevator is operable to linearly translate a substrate residing on a substrate holder between a heating position proximate to a heater assembly and a cooling position proximate to the segmented cold plate. According to another aspect, the cold plate comprises a plurality of holes through which one or more gases may flow, wherein an amount or mixture of the one or more gases is controllable via a controller, and wherein one or more temperature sensors are operable to provide temperature feedback at the substrate. According to another aspect the substrate resides within close proximity to the cold plate, wherein when gas is flowed through the holes, the substrate is cooled in the viscous regime, and the amount and / or mixture of gases flowed through the holes is controlled, based, at least in part, on the one or more measured temperatures.

An injection-moulding device is disclosed, comprising at least first and second mould parts, defining a mould cavity, wherein at least one of the mould parts comprises heating means, for heating the mould part in the vicinity of a mould cavity surface, said heating means comprising an inductive coil having a plurality of windings and being powered by an oscillator. The mould part comprises a top member, at the mould cavity surface, and, beneath the top member, a carrier member comprising grooves for taking up said coil windings, wherein the top member resistivity is lower than 1.5*10−6 Ωm, the top member relative magnetic permeability is lower than 10, the carrier member resistivity is higher than 20*10−6 Ωm, and the carrier member relative magnetic permeability is higher than 50.

The invention relates to a battery module having a cooling apparatus, comprising at least one first line and at least one second line, wherein the first line and the second line conduct a fluid and absorb heat from cells of the battery module and transfer said heat to the fluid, wherein the first line and the second line extend perpendicular to the cells of the battery module, the first line and the second line are arranged parallel to one another, a flow direction of the fluid in the first line is opposite a flow direction of the fluid in the second line.

This plasma treatment device is provided with: a wafer transportation tray having a first surface and a second surface opposite the first surface, the wafer transportation tray holding the wafer on the first surface; a cooling unit for cooling the wafer transportation tray; an electroconductive support body for supporting the second surface of the wafer transportation tray; and a double-sided electrostatic suction unit for electrostatically chucking the wafer on the first surface of the wafer transportation tray and electrostatically chucking the support body on the second surface of the wafer transportation tray.

The object of invention is to provide a liquid-cooled food refrigerator, efficiently uniformly cooling antifreeze liquid bath in an antifreeze liquid tank by a modularized piping unit, simplifying assembling and facilitating expansion. This liquid-cooled food refrigerator includes the antifreeze liquid tank 3; a stirring means; a heat exchange piping means; a cooling force-feed means 1 for supplying a refrigerant to the heat exchange piping means; and a carrying means for dipping foot to be refrigerated in an antifreeze liquid bath in the antifreeze liquid tank 3. In the heat exchange piping means, the piping unit 10 is formed by modularizing at least two vertical pipe parts 11, at least two meandering pipe parts 12, an inlet manifold port 13 and an outlet manifold port 14, two or more units are sequentially arranged along the wall surface extending over the whole periphery of the side wall of the antifreeze liquid tank 3, and connected in parallel to the manifold means 15, 16, 17, 18 on the outward side and on the return side, and the manifold means on the outward side and on the return side are connected to the output side and the feedback side of the cooling force-feed means (the so-called refrigerator ) 1.

A coil device with a cooling structure includes: a coil unit that has a core structure having one or more leg parts and one or more coils wound around the one or more leg parts; and a flow-rectifying member having a flat plate portion covering a face of the one or more coils and flow-rectifying ribs inwardly protruding from an inner surface of the flat plate portion, the flow-rectifying ribs extending in a direction parallel to center axes of the one or more coils and being positioned to face side boundaries of the face of the one or more coils. The flat plate portion and the flow-rectifying ribs form a first air cooling channel at a substantially uniform gap outside of the one or more coils along the direction parallel to the center axes thereof, the first air cooling channel passing cooling air to air-cool the one or more coils.

The present invention provides a substrate cooling apparatus for carrying a substrate and synchronously effectively and uniformly cooling the inside of the substrate surface. The periphery of the carrying path of the substrate (W) formed surrounding a roller carrying mechanism (10) is provided with a wind tunnel unit (20) with both ends open, a gas flow path (25) with both end portions open is formed at the inner side cavity unit of the wind tunnel unit (20) through arranging bucket shaped units (50) at both ends of the wind tunnel unit (20), the central portion in the carrying direction of the wind tunnel unit (20) is provided with an exhaust box (70), and at the periphery of the both ends of the gas flow path there is provided a blower nozzle (80). An air flow is formed inside the gas flow path (25) through blowing air the gas flow path (25) from the blower nozzle (80). Through carrying the heated substrate (W) along the gas flow path, the cooling processing is performed.