An
integrated circuit device (300) includes a functional
integrated circuit (IC) die (310) having a top IC surface with IC non-contact regions (313) and a plurality of
electrically conductive bump pads (311, 312, 313) at pad locations. In the IC (310), at least one of the bump pads (311, 312, 313) extends outward from beyond the IC non-contact regions (313). The
integrated circuit device (300) can also include a workpiece (305) having a top workpiece surface comprising at least one die attach area (319) for attaching the IC die (310). The die attach area (319) can include non-contact regions (316) and a plurality of
electrically conductive contact pads (317) recessed relative to the non-contact regions (316), where the contact pads (317) face the top IC surface and match the pad locations (312). In the die attach area (319), at least one of the contact pads (317) includes
electrically conductive pedestal features (321) extending towards the top IC surface, where the extending bump pads (311) physically contact one of the pedestal features (321) and electrically connect the IC die (310) to the workpiece (305). In the integrated circuit device (300), the pedestal features (321) increase a gap between the IC (310) and the workpiece top surfaces to be filled with an underfill
dielectric material (332).