The invention discloses a photoconductive switch with electrodes pre-prepared with solder, which comprises a silicon carbide substrate and two electrodes, the two electrodes are arranged on the first surface and or the second surface of the silicon carbide substrate, and the electrodes include sequentially stacked Ni layer, TiW layer, Pt layer, first Au layer, second Au layer and Sn layer, and the Ni layer is located on the side close to the silicon carbide substrate, wherein the second Au layer and the Sn layer form a eutectic solder layer, the traditional solder There is poor placement accuracy in the sheet melting welding method. The solder sheet is thicker, and it is easy to form a bump after soldering, resulting in charge concentration. By presetting the solder film layer on the electrode, the positioning of the solder can be precisely controlled, and the thickness and shape of the solder can be effectively controlled. , improve the electrode connection reliability of the photoconductive switch, thereby improving the withstand voltage capability and reliability of the photoconductive switch.