76results about "Temperature compensation" patented technology

A capacitor device includes: a film capacitor element that comprises a coiled body in which an insulating layer and an electrification layer are laminated and wound together, and a pair of collector electrodes that are formed upon two opposite end faces of the coiled body; a case that comprises a capacitor housing portion within which the film capacitor element is received; a pair of inserts having insulation properties, one of which is inserted between one of the pair of collector electrodes and one of inner walls of the capacitor housing portion; and a mass of sealing and insulating material that is charged between the film capacitor element and the one of the inner walls of the capacitor housing portion.

A method of production of a multilayer ceramic electronic device having dielectric layers with an interlayer thickness of 5 μm or less and internal electrode layers including a base metal, including the steps of firing, then annealing a stack comprised of a dielectric layer paste and an internal electrode layer paste including a base metal alternately arranged in 100 layers or more under a reducing atmosphere, treating the annealed stack by first heat treatment under a strong reducing atmosphere of an oxygen partial pressure P3 of over 2.9×10−39 Pa to less than 6.7×10−24 Pa at a holding temperature T3 of over 300° C. to less than 600° C. The stack after the first heat treatment is treated by second heat treatment under an atmosphere of an oxygen partial pressure P4 of over 1.9×10−7 Pa to less than 4.1×10−3 Pa at a holding temperature T4 of over 500° C. to less than 1000° C.

The invention relates to a capacitor comprising the following components: a first heating element (1), a first capacitor region, comprising: dielectric layers (3), internal electrodes (4) which are arranged between the dielectric layers, wherein the first heating element and the first capacitor region (2) are connected to each other in a thermally conductive manner.

A capacitor that has the features of heat dissipation and energy conservation comprises a capacitor core, an aluminum shell surrounding the capacitor core, the aluminum shell is covered with rubber that completely covers the top of the capacitor core, then with the use of an extruding machine, the upper orifice of the aluminum shell is extruded and sealed up around the rubber completely; the outer surface of the aluminum is formed with an aluminum oxidized insulating layer after the aluminum shell is processed through an aluminum metal surface transformation treatment, since the aluminum shell is not covered with plastic film (or sleeve), heat dissipation is enhanced; in addition, since plastic film or sleeve is not used, no pollution is occurred, and hence more friendly to the environment; furthermore, since heat generation is low, energy is conserved.

A thin film capacitor with an arbitrary temperature coefficient of capacitance can be obtained by using only tow kinds of dielectric thin film capacitor, wherein the dielectric thin film having a prescribed temperature coefficient of capacitance is formed on the surface of a lower electrode formed on a substrate, a second dielectric film having a different temperature coefficient of capacitance from the temperature coefficient of capacitance of the prescribed temperature coefficient of capacitance is formed so as to cover from the upper edge of the dielectric thin film to the step portion of the dielectric thin film, and an upper electrode is formed so as to cover the dielectric thin film and second dielectric film, and wherein the temperature coefficient of capacitance is determined by adjusting the overlap area of the lower electrode and upper electrode between the lower electrode and upper electrode.

A box-shaped inner case (3) is accommodated in a box-shaped outer case (2), and refrigerant flow passages (27) are formed at five surfaces except opening surfaces (14, 24) by gaps between the inner and outer cases. A Gap of an opening edge of the outer case (2) and an opening edge of the inner case (3) is covered with a frame-shaped cover (6). A capacitor element (4) formed from a film capacitor is placed in the inner case (3), and the inner case (3) is filledwithpottingmaterial (5) having thermal conductivity so that the capacitor element (4) except the terminals (4a, 4b) is embedded. Cooling water flows along a longitudinal direction of the outer case (2) with one of refrigerant pipe connecters (15) being a refrigerant inlet and the other of the refrigerant pipe connecters (15) being a refrigerant outlet.

A multilayer ceramic electronic component that has a multilayer portion having an outer layer portion adjacent region including an area in contact with an outer layer portion that forms a thermal-shock absorbing portion that includes curved ceramic layers and inner electrode layers smoothly varying in thickness from point to point. A region to an inside of the thermal-shock absorbing portion forms a normal multilayer portion that includes ceramic layers with less curvature than the ceramic layers in the thermal-shock absorbing portion and inner electrode layers with less variation in thickness from point to point in a direction along a principal surface of the outer layer portion than the inner electrode layers in the thermal-shock absorbing portion.

Disclosed herein is a multilayer ceramic device, including a device body; an inner electrode arranged in the device body; and an external electrode arranged at outside of the device body and being electrically connected to the inner electrode; wherein the external electrode includes: an inner layer covering the device body; an outer layer covering the inner layer and being exposed to the outside; and an intermediate layer arranged between the inner layer and the outer layer, and made of a mixture of a copper metal and a resin, a surface of the copper metal being coated with an oxide film.

A film capacitor is presented. The film capacitor includes a thermally conductive support. The thermally conductive support includes a core including a first end and a second end. The thermally conductive support further includes a protrusion extending from at least one of the first end and the second end of the core, where at least one of the core and the protrusion includes a phase change material. Further, the film capacitor also includes a plurality of films disposed on at least a portion of the thermally conductive support, where the plurality of films includes a plurality of electrode films and a dielectric film. Further, the thermally conductive support for the film capacitor and a method of forming the film capacitor are also presented.

The invention relates to the technical field of film capacitors for motor controllers, in particular to a film capacitor integrated with a safety filter capacitor and a motor controller. The film capacitor comprises a capacitor shell, the capacitor shell is internally provided with a plurality of capacitor bodies arranged side by side and at intervals; the inner wall of the capacitor shell and each capacitor body are fixed into one body through a packaging and filling rubber block; direct current input copper bars are symmetrically arranged at two ends of the capacitor bodies, and the direct current input copper bars are extended out of the packaging and filling rubber block and are installed on the capacitor shell; and the direct current input copper bars are sleeved with an X / Y capacitorfiltering circuit board and a ferrite common mode inductor. According to the film capacitor integrated with the safety filter capacitor and the motor controller, the direct current input copper barsare symmetrically arranged, any one of the direct current input copper bars can be selected to be connected with the input end of the motor controller so as to improve the adaptability of the product;and moreover, the ferrite common mode inductor and the X / Y capacitor filtering circuit board are integrated to improve the performance reliability of the film capacitor.

Disclosed is a high-voltage AC capacitor for reactive power compensation of 10 kV-35 kV power grid, and in particular to a high-voltage AC capacitor with a high-voltage switching switch provided therein, as well as a structure for prolonging the service life of a thin film metalized high-voltage capacitor and a control method for prolonging the service life of the thin film metalized high-voltage capacitor. The AC capacitor is formed by multiple intelligent switch capacitor units connected in series, and each capacitor unit is formed by a switch contact (K11-Kn1) and a capacitor (C1-Cn) connected in series. If there are N capacitor units, when each switch contact is disconnected, the endurable voltage of each switch contact, the endurable voltage between the switch contact and a coil and the voltage each capacitor withstands are 1 / Nth of the total voltage; when the switch operates, all the contacts operate at the same instant.

The invention relates to a ceramic capacitor which comprises a plastic package body 1, a first metal electrode layer 2, a second metal electrode layer 3, a first metal pin 4, a second metal pin 5 anda single-layer ceramic medium 6. The first metal electrode layer 2 and the second metal electrode layer 3 are respectively attached to the two opposite surfaces of the single-layer ceramic medium 6. The first metal pin 4 and the second metal pin 5 are respectively welded and electrically communicated with the first metal electrode layer 2 and the second metal electrode layer 3. The ceramic capacitor is an SMD package. The electrode layers are arranged on the two sides of the single-layer ceramic medium, and the electrode layers are connected through the pins to generate electric fields on thetwo electrode layers so that the capacitive effect is generated between the two pins. The single-layer ceramic medium and the SMD packaging are selected so that the ceramic capacitor has the advantages of small volume, more standardized product size, high assembling efficiency, high yield and good high frequency performance.

A ceramic electronic component includes a multilayer body, an electronic component main body including first and second outer electrodes on the surface of multilayer body, a first substrate connection terminal bonded to at least one of the first outer electrode and the multilayer body by a bonding material that is electrically insulating, and a first metal terminal electrically connecting the first outer electrode and the first substrate connection terminal, in which, while the first metal terminal maintains an elastically deformed state, a first end portion thereof is bonded to the first outer electrode by an electrically conductive bonding material, and a second end portion thereof is bonded to the first substrate connection terminal by a bonding section with a different melting point from that of the bonding material.