148results about "Liquid processing circulation" patented technology

An apparatus for processing a substrate comprising a substrate holding mechanism for holding the substrate substantially horizontally, a chemical solution discharge / suction mechanism having a chemical solution discharge / suction portion which has a chemical solution outlet for discharging a chemical solution onto the substrate and chemical solution inlets for sucking up the chemical solution present on the substrate, and a chemical solution supply / suction system for supplying the chemical solution to the chemical solution discharge / suction mechanism simultaneously with sucking the chemical solution by the chemical solution supply / suction mechanism.

In order to compensate the reduction of a developing activity during working and / or stopped period, a replenisher and / or a diluent is added to the developer according to predetermined replenishing conditions, and also in order to compensate the reduction of the developing activity caused by processing photosensitive materials, the replenisher and / or the diluent is added to the developer. Then, in cases where the electric conductivity of the thus replenished developer exceeds a predetermined target value, the diluent is replenished to the developer tank until the electric conductivity of the developer falls below the target value.

Rinsing nozzles 310a to 310e are moved on a wafer W while they are discharging rinsing solution 326. At that point, discharging openings 317a to 317e are contacted to developing solution 350 coated on the wafer W or rinsing solution 326 on the wafer W. Thus, the impact against the wafer W can be suppressed. As a result, pattern collapse can be prevented. In addition, a front portion of the developing solution 350 can push away the developing solution 350.

When a developing process is performed, a mixture of developing solution and pure water is supplied while the ratio of developing solution and pure water is gradually increased from pure water to developing solution. Thus, a developing solution component and a resist component gradually react. Even if a resist component dissolves in the mixture of pure water and developing solution, the equality of the concentration of the developing solution can be maintained. Thus, the developing process can be suppressed from being unequally performed. When a rinsing process is performed, a mixture of developing solution and pure water is supplied while the ratio of developing solution against pure water is gradually decreased from developing solution to pure water. Consequently, the substitution from developing solution to pure water can be gradually performed. As a result, particles due to the solidification of unsolved resist can be prevented.

A coating apparatus includes a liquid film forming mechanism configured to form a liquid film of a process liquid for preventing a contaminant derived from a coating liquid from being deposited or left on a back side peripheral portion of a substrate. The liquid film forming mechanism includes a counter face portion facing the back side peripheral portion of the substrate and a process liquid supply portion for supplying the process liquid onto the counter face portion. The coating apparatus further includes a posture regulating mechanism disposed around the substrate holding member and configured to damp a vertical wobble of the peripheral portion of the substrate being rotated. The posture regulating mechanism includes delivery holes arrayed in a rotational direction of the substrate and configured to deliver a gas onto a back side region of the substrate on an inner side of the peripheral portion.

A method and an apparatus for removing an organic film, such as a resist film, from a substrate surface are provided wherein a treatment liquid containing dissolved ozone, and preferably formed from liquid ethylene or propylene carbonate, or both, is contacted with the substrate having the organic film, and the organic film removed, wherein the apparatus contains (A) a treatment liquid delivery device, (B) a film contact device, (C) a liquid circulation device and (D) an ozone dissolution device.

There is disclosed a substrate treating method comprising supplying a treating solution onto a substrate, and continuously discharging a first cleaning solution to the substrate from a first discharge region disposed in a nozzle, while moving the nozzle and substrate with respect to each other in one direction, wherein a length of a direction crossing at right angles to the direction of the first discharge region is equal to or more than a maximum diameter or longest side of the substrate, the nozzle continuously spouts a first gas to the substrate from a first jet region, and the length of a direction crossing at right angles to the direction of the first jet region is equal to or more than the maximum diameter or longest side of the substrate.

A substrate (SW) is rotatably held in an approximately horizontal position by a wafer holding and rotation mechanism (810). One end of a rinsing liquid supply nozzle (840) is rotatably supported by a rinsing liquid supply nozzle rotation supporting mechanism (850) to pass over the substrate (SW). In response to rotation of the rinsing liquid supply nozzle (840), the rotation axis of the rinsing liquid supply nozzle (840) moves in a direction closer to or away from the rotation axis of the substrate (SW), whereby the amount of projection of a tip portion of the rinsing liquid supply nozzle (840) is reduced.

The temperature of a developing solution is varied depending on the type of resist or the resist pattern. The developing solution is applied while scanning a developer nozzle having a slit-shaped ejection port that has a length matching the width of the effective area of the substrate. After leaving the substrate with the developing solution being coated thereon for a predetermined period of time, a diluent is supplied while scanning a diluent nozzle, thereby substantially stopping the development reaction and causing the dissolved resist components to diffuse. A desired amount of resist can be quickly dissolved through the control of the developing solution temperature, while the development can be stopped before the dissolved resist components exhibit adverse effect through the supply of the diluent a predetermined timing, whereby achieving a pattern having a uniform line width and improved throughput.

A cartridge for photographic processing agents, which is formed of containers for photographic processing agents and a storage box for housing the containers in any selected dispositions in the box, in which at least one of the containers is provided with at least one recess on an outer side thereof, and at least one opening is formed on the storage box corresponding to the recess of the container housed in the storage box, and in which the cartridge having the recess in the container and the opening corresponding to recess in the storage box prevents the cartridge from being erroneously loaded to an automatic photo-processor; and a container for a photographic processing agent usable in the cartridge.

A coating apparatus includes a liquid film forming mechanism configured to form a liquid film of a process liquid for preventing a contaminant derived from a coating liquid from being deposited or left on a back side peripheral portion of a substrate. The liquid film forming mechanism includes a counter face portion facing the back side peripheral portion of the substrate and a process liquid supply portion for supplying the process liquid onto the counter face portion. The coating apparatus further includes a posture regulating mechanism disposed around the substrate holding member and configured to damp a vertical wobble of the peripheral portion of the substrate being rotated. The posture regulating mechanism includes delivery holes arrayed in a rotational direction of the substrate and configured to deliver a gas onto a back side region of the substrate on an inner side of the peripheral portion.

A dynamic fluid control system and method capable of reducing dynamic forces from the fluid on the last optical element (20) and substrate stage (14) caused by the motion of the immersion fluid. The system includes an imaging element (12) that defines an image and a stage (14) configured to support a substrate (16). An optical system (18) is provided to project the image defined by the imaging element onto the substrate. The optical system (18) includes a last optical element (20). A gap (22) filled with immersion fluid is provided between the substrate (16) and the last optical element (20). A dynamic force control system (34) is provided to maintain a substantially constant force on the last optical element and the stage (14) by compensating for dynamic changes of the immersion fluid caused by the motion of the immersion fluid through the gap and / or movement of the stage.

In a liquid processing apparatus a spin chuck holds a wafer having a surface supplied with a liquid to be applied through a nozzle receiving the liquid through a feed path and whether the liquid passing through the feed path has fluctuation is detected by a fluctuation detection device. Thus the liquid's condition in the feed path can be determined significantly accurately. Supplying the substrate with the liquid without fluctuation allows the substrate to receive the liquid in an optimal condition. A satisfactory liquid process can thus be performed.

In a developing processing of a wafer having a resist film low in the dissolving rate in a developing solution formed thereon and subjected to an exposure treatment, a developing solution of a low concentration is supplied first onto a wafer and the wafer is left to stand for a prescribed time to permit a developing reaction to proceed, followed by further supplying a developing solution having a concentration higher than that of the developing solution supplied first onto the wafer, leaving the substrate to stand and subsequently rinsing the wafer, thereby improving the uniformity of the line width in the central portion and the peripheral portion of the wafer.

A developing apparatus, a developing processing method, a developing processing program, and a computer readable recording medium recording the program, which can reduce the consumption amount of the developing solution and the developing processing time irrespective of the type of resist materials or the shape of resist patterns, are provided. A step of horizontally holding a substrate and rotating the substrate around a vertical axis at a prescribed rotation rate, and a step of intermittently supplying a developing solution to a center of the substrate from a discharge port of a developing solution nozzle arranged opposing to the surface of the substrate are executed. In the step of intermittently supplying the developing solution to the center of the substrate, an intermittence time and a substrate rotation rate in the intermittence time are set to prevent the developing solution supplied to the substrate from drying.

The present invention relates to a method for developing a photoresist pattern. The method consists of mixing a concentrated chemical solution with a solvent to obtain a diluted chemical solution of a predetermined concentration. In this method, the mixing is done in a fabrication facility where the substrates are processed. The diluted chemical solution is then applied onto the photoresist pattern. Analysis of the pattern is then carried out to detect any defects or pattern collapse on the substrate. In the event that defects and / or pattern collapse occur, the predetermined concentration is adjusted to reduce the phenomenon.

In an electric conductivity-based replenishing system, a developer replenishing method for a photosensitive lithographic printing plate is provided which is capable of minimizing the fluctuations in sensitivity of a developer with respect to the changes in development treatment conditions. An electric conductivity value of the developer is measured in a predetermined given cycle, when the measured electric conductivity value of the developer is lower than the target electric conductivity value, the developer is replenished with a predetermined amount of a developer replenisher, the time interval between the previous supply of the developer replenisher and the present supply of the developer replenisher is measured, a target electric conductivity arithmetic expression is selected based on the measured replenishment time interval and the replenishment time interval threshold value. Using the selected target electric conductivity value arithmetic expression and the measured replenishment time interval, the target electric conductivity value is updated.

A substrate processing apparatus discharges a hydrofluoric acid solution from discharge nozzles toward grooves formed in side walls of an inner bath. The hydrofluoric acid solution discharged from the discharge nozzles impinges upon the grooves to diffuse, thereby moving toward a top portion of the inner bath in the form of low-speed uniform liquid flows. Thus, a metal component and foreign substances generated in the inner bath float up toward the top portion of the inner bath without being agitated within the inner bath, and are rapidly drained to an outer bath together with the hydrofluoric acid solution.

In a substrate processing apparatus of the present invention, a buffer bath is provided at any point in a supplying passage of a processing solution supplying part, and a micro bubble generator is provided in the buffer bath. When a substrate is processed, large quantities of micro bubbles can be generated and stored in the buffer bath, and the micro bubbles can be supplied from the buffer bath to a processing bath. This enables the large quantities of micro bubbles to be supplied to the surrounding of the substrate, while the use of the small micro bubble generator avoids an increase in the size of the substrate processing apparatus.

A developing method comprises determining in advance the relation of resist dissolution concentration in a developing solution and resist dissolution speed by the developing solution, estimating in advance the resist dissolution concentration where the resist dissolution speed is a desired speed or more from the relation, and developing in a state in which the resist dissolution concentration in the developing solution is the estimated dissolution concentration or less.

A cartridge for photographic processing agents, which is formed of containers for photographic processing agents and a storage box for housing the containers in any selected dispositions in the box, in which at least one of the containers is provided with at least one recess on an outer side thereof, and at least one opening is formed on the storage box corresponding to the recess of the container housed in the storage box, and in which the cartridge having the recess in the container and the opening corresponding to recess in the storage box prevents the cartridge from being erroneously loaded to an automatic photo-processor; and a container for a photographic processing agent usable in the cartridge.

Rinsing nozzles 310a to 310e are moved on a wafer W while they are discharging rinsing solution 326. At that point, discharging openings 317a to 317e are contacted to developing solution 350 coated on the wafer W or rinsing solution 326 on the wafer W. Thus, the impact against the wafer W can be suppressed. As a result, pattern collapse can be prevented. In addition, a front portion of the developing solution 350 can push away the developing solution 350.

There is provided an apparatus including: a processing cup having an opening opened upward to allow a substrate to be loaded and unloaded, an exhaust port for exhausting an unnecessary atmosphere produced in forming a film applied on the substrate, and an aspiration port for aspirating external air; and an aspiration device aspirating the unnecessary atmosphere through the exhaust port, wherein when the substrate is accommodated in the opening of the processing cup, the substrate has a perimeter spaced from the opening by a predetermined gap, and below the substrate accommodated in the processing cup there is formed an exhaust flow path extending from the aspiration port to the exhaust port.

The present invention provides a system and method for replenishing a lithographic printing plate developer. The system includes a developer unit containing a seasoned developer and adapted to deliver the seasoned developer into a mixing unit, a replenisher unit containing a replenisher and adapted to deliver the replenisher into the mixing unit, and the mixing unit is in fluid communication with the developer unit and the replenisher unit and is adapted to hold a mixture of an equal volume of the replenisher and the seasoned developer. The mixture of an equal volume of the replenisher and the seasoned developer is then delivered to the developer unit.

There is provided an apparatus including: a processing cup having an opening opened upward to allow a substrate to be loaded and unloaded, an exhaust port for exhausting an unnecessary atmosphere produced in forming a film applied on the substrate, and an aspiration port for aspirating external air; and an aspiration device aspirating the unnecessary atmosphere through the exhaust port, wherein when the substrate is accommodated in the opening of the processing cup, the substrate has a perimeter spaced from the opening by a predetermined gap, and below the substrate accommodated in the processing cup there is formed an exhaust flow path extending from the aspiration port to the exhaust port.

An automatic processing method by developing a plural number of exposed photosensitive lithographic printing plates with a developer, which comprises the previously calculating step, the measuring step and the replenishing step as defined herein, wherein during a period from immediately after start of operation of an automatic processing apparatus until the measured electric conductivity value of the developer exceeds the target electric conductivity value, the target electric conductivity value is corrected using a first operation expression as previously defined for every replenishment of the developer replenisher; and after the measured electric conductivity value of the developer first exceeds the target electric conductivity value after start of operation of the automatic processing apparatus, the target electric conductivity value is corrected using a second operation expression for every replenishment of the developer replenisher.

An apparatus for removing a photoresist film includes a substrate cassette for fixing a substrate having a surface covered with a photoresist film, an ozone feed tube for supplying ozone, a liquid feed tube for supplying a liquid photoresist film removing solution, and a processing tank for recovering and processing at least one of ozone and the liquid photoresist film removing solution, wherein the liquid photoresist film removing solution is supplied through the liquid feed tube as a liquid or mist, at least one of ozone and the photoresist film removing solution being continuously supplied.

A substrate processing apparatus discharges a hydrofluoric acid solution from discharge nozzles toward grooves formed in side walls of an inner bath. The hydrofluoric acid solution discharged from the discharge nozzles impinges upon the grooves to diffuse, thereby moving toward a top portion of the inner bath in the form of low-speed uniform liquid flows. Thus, a metal component and foreign substances generated in the inner bath float up toward the top portion of the inner bath without being agitated within the inner bath, and are rapidly drained to an outer bath together with the hydrofluoric acid solution.

A method and apparatus for developing a resist on a substrate in which a sacrificial surfactant-containing liquid is first applied to a resist as a pretreatment to reduce developing process defects and to improve the development process time and the uniformity of the resist. The pretreatment is followed by supplying a developing solution to the resist and thereafter developing the resist.