An integrated packaging device for patch diodes, comprising: a conveying mechanism; a glue tank disposed on one side of the conveying mechanism in the length direction; a chip carrying mechanism comprising a first bracket and two sets of first four-way limiters formed on the first bracket A chip template is installed between each group of first four-way limit plates; the first stroke mechanism is located at one end of the glue tank, including the first lifting mechanism, the first horizontal linear mechanism, and the sticky core board; the jumper carrying mechanism , comprising a second bracket, two sets of second four-way limiting plates formed on the second bracket, a jumper template is installed between each group of second four-way limiting plates; the second stroke mechanism includes a second lifting Mechanism, second horizontal linear mechanism, pneumatic suction cup. Through the setting of the core and jumping film mechanism along the lead frame conveying line, not only the step-by-step continuous conveying of the lead frame can be realized, but also the gluing, core sticking and core loading can be completed efficiently, and then the sticking and jumping can be completed during the transportation sheet, which greatly improves the process efficiency.