The invention relates to the technical field of heat dissipation auxiliary devices, in particular to an
electronic chip heat dissipation device, which improves the heat dissipation effect, provides asuitable temperature environment for the operation of the
electronic chip, ensures the service life of the
electronic chip, improves the practicability, can clean dust attached to an electronic
chip,and improves the reliability of usage. The electronic
chip heat dissipation device comprises a casing, an endothermic
silica gel plate, a front supporting plate, a rear supporting plate, an electronicchip, a plurality of sets of radiating fins, a fan, a rotating shaft, a left baffle plate, a right baffle plate, a connecting plate, a tension spring group, a traction line, a front
ball bearing, a rear
ball bearing, a front gear, a rear gear, a front rack, a rear rack and flexible bristles, wherein a placement cavity is formed in the casing, the left end of the casing is provided with an air inlet, the right end of the casing is provided with an air outlet, a front sliding groove is formed in the top part of the front side wall of the placement cavity, a rear sliding groove is formed in thetop part of the rear side wall of the placement cavity, a front sliding block is slidably mounted in the front sliding groove, and a rear sliding block is slidably mounted in the rear sliding groove.