76results about How to "Reducing time and cost" patented technology

A method for testing an installed wiring harness is provided. The method comprises providing a signal source testing module at a first node in the wiring harness and a measurement termination testing module at a second node in the wiring harness. A central management module for controlling the testing modules coordinates the testing modules to send testing signals for performing tests and recording test measurements of the installed wiring harness. The testing modules send the test measurements to the management module.

A chip-scale packaged IC is made by bonding one or more singulated die chips (from an IC wafer) to a common substrate, such as a single cap wafer (or a portion thereof) and cutting (singulating) the substrate to yield individual, chip-scale packaged ICs. Alternatively, each die chip is bonded to an individual, pre-cut cap. Electrically conductive paths extend through the cap wafer, between wafer contact pads on the surface of the cap and electrical contact points on the IC wafer. Optionally, the cap wafer contains one or more die. The IC wafer can be fabricated according to a different technology than the cap wafer, thereby forming a hybrid chip-scale packaged IC. Optionally, additional “upper-level” cap wafers (with or without die) can be stacked to form a “multi-story” IC.

A wafer-level packaged IC is made by attaching a cap wafer to the top of an IC wafer before cutting the IC wafer, i.e. before singulating the plurality of die on the IC wafer. The cap wafer is mechanically attached and electrically connected to the IC wafer, then the die are singulated. Electrically conductive paths extend through the cap wafer, between wafer contact pads on the top surface of the cap and electrical contact points on the IC wafer. Optionally, the cap wafer contains one or more die. The IC wafer can be fabricated according to a different technology than the cap wafer, thereby forming a hybrid wafer-level package. Optionally, additional “upper-level” cap wafers (with or without die) can be stacked to form a “multi-story” IC.

An apparatus and method for upgrading a software, including a version comparing unit for comparing a version of a software code and a version of a previously installed software code to determine a newer version and an upgrade processing unit for installing the software by abstracting software data in the software code, can automatically install an upgraded system software in a corresponding apparatus for receiving digital broadcasting by detecting the code of the system software simultaneously included in an advertisement broadcasting and an advertisement broadcasting signal.

This disclosure generally covers systems and methods that provide guidance to create an electronic survey. In some embodiments, the systems and methods identify and provide a suggested survey topic—with a corresponding option to create an electronic survey—based on user input. In some embodiments, the systems and methods identify and provide one or more suggested electronic survey questions based on user input. In such embodiments, the systems and methods provide, for example, components of suggested electronic survey questions, previously composed and benchmarking electronic survey questions, or suggested revisions to electronic survey questions. In addition, the systems and methods can provide entire premade electronic surveys based on receiving user input from a survey administrator.

An automated test method for performing a hi-pot test procedure for an electrical device through the use of a test program installed in a factory information system (FIS) and a test instrument connected to the FIS. The test program sends a control command to the test instrument that in turn executes the hi-pot test for the electrical device. Test results are obtained by the test program from the test instrument and sent to the FIS. The test results are stored in the FIS for future reference.

An air operated double diaphragm pump comprising an air valve mechanism. The air valve mechanism may comprise a single valve system that replaces the two valve system found in conventional air operated double diaphragm pumps. The position of the valve may be determined by the diaphragm motion of the pump up to a stall position. A spring-loaded mechanical actuation may complete the valve action from the stall position to the final or end of stroke position of the pump.

Various methods and systems of statistical data processing and natural-language-processing are disclosed. According to one embodiment, an intelligent, automated KPI-discovery method uses existing machine-learning algorithms and Natural Language Processing (NLP) for extraction and construction of KPIs.

Provided is a cover material for packaging contains for retort sterilization which comes to exhibit excellent sealing strength through low-temperature, short-time heat sealing. The cover material for packaging containers for retort sterilization is constituted of a multilayered laminate obtained by superposing a base layer, an interlayer, and a sealing layer in this order, and is characterized in that the base layer is constituted of a laminated film obtained by laminating a polyethylene terephthalate film or polybutylene terephthalate film to an aluminum foil and the aluminum foil of the base layer has been laminated to the interlayer with a polyurethane-based adhesive or a polyester-based adhesive, and that the aluminum foil has a thickness of 7-40 μm, the polyethylene terephthalate film or the polybutylene terephthalate film has a thickness of 6-18 μm, the interlayer has a thickness of 10-100 μm, and the sealing layer has a thickness of 3-20 μm.

An apparatus and method for testing the physical properties of a material is disclosed. Preferably, the physical properties that may be tested include, but are not limited to, the COR of a material. Accordingly, the apparatus includes a projectile that may be capable of being propelled towards a material sample. The projectile is preferably aimed and fired through a tubular barrel towards the material sample. The tubular barrel preferably comprises a propulsion system that controls pneumatic energy via a pneumatic valve. At least two sensors are placed between the tubular barrel and the material sample in order to detect the passage of the projectile. It is desired that the sensors are placed at precise, discrete positions. As the projectile passes through the field of view of each sensor, the time is recorded to a memory, for example, a counter timer board. The projectile may then impact the material sample, which may preferably be held in place by a fixation device. The fixation device is preferably a holding slot, which may be backed by an infinite mass cylinder. Upon rebounding from the material sample, the projectile passes back through the field of view of the sensors in reverse order, allowing the sensors to capture and record the time of passage to a memory, such as a counter timer board. The physical properties of the material sample may be calculated by a processing device that is operatively connected to at least a portion of the apparatus.

A sensor device for detecting wetting on a windshield includes a light emission element for emitting a light, a first light reception element for receiving the light in a first light path that includes reflective redirection by the windshield, and a second light reception element for receiving the light in a second light path that does not include reflective redirection by the windshield. The sensor device uses a ratio of the amount of the received light by the first light reception element and the amount of the received light by the second light reception element to determine wetting on the windshield.

A multi-link wireless channel sounder is provided. The multi-link wireless channel sounder includes a multi-input multi-output (MIMO) antenna unit, a transmitter (TX) signal processing unit configured to transmit via the MIMO antennas one or more TX wireless channel signals to be transmitted via a wireless channel, a receiver (RX) signal processing unit configured to receive and process one or more RX wireless channel signals that are received from multiple links via the MIMO antenna unit, and a control unit configured to receive an operation mode selection signal that indicates a TX mode or an RX mode from a user and to control the TX signal processing unit or the RX signal processing unit to operate selectively in accordance with the operation mode selection signal.

A dynamically adjustable textile dryer and method of controlling a conveyor belt speed of the textile dryer is provided. The speed of the belt is utilized to more quickly adjust the temperature of the drying chamber.

A carbonaceous material manufacturing apparatus includes a reaction tube and a gas supply portion. An anode and a cathode defining an arc discharge portion is place in the reaction tube, and a capturer is located provided as well to capture carbonaceous materials generated. At the location of the capturer, an RF heater is disposed around the reaction tube. In a carbonaceous material manufacturing method, carbonaceous materials generated in the arc discharge portion are transported from a gas supply portion into the reaction tube by the gas supplied into the reaction tube, then heated by a RF heater in the capturer where the carbonaceous materials are not exposed to the atmospheric air, to thereby promote removal of impurities and growth of single-walled carbon nanotubes.

A machine used for making liquid or semi-liquid food products, specifically ice cream, comprises a container for processing liquid or semi-liquid base products by means of a stirring device driven by a motor. The stirring device comprises an external mixing structure to which a shaft is fixed so that the motor can drive it in rotation. Keyed to the shaft are scraping elements which scrape the product off the inside walls of the processing container.

A calibration device, a display system, and methods thereof, are provided in which a plurality of display apparatuses are photographed in order to calibrate the plurality of display apparatuses. The calibration device may include a communicator configured to communicate with at least one display apparatus from among a plurality of display apparatuses of a display system, and a controller configured to control the communicator to transmit a setup value for the display apparatuses to the at least one display apparatus, and transmit, to the at least one display apparatus, a control command for calibrating the plurality of display apparatuses based on an image of the plurality of display apparatuses displaying an image, received from the an image taking device

A semiconductor product such as an integrated circuit includes a laminar plastic substrate having first and second opposed surfaces and through holes extending through the substrate, electrically and/or thermally conductive material balls inserted in the through holes at the first surface of the substrate, and one or more semiconductor chips mounted at the first surface of the substrate, the semiconductor chip(s) electrically and/or thermally coupled with electrically and/or thermally conductive material balls inserted in the through holes.

A light-emitting diode structure and a manufacturing method thereof are provided. The structure includes a semiconductor substrate, a first type semiconductor layer, a light-emitting layer, a second type semiconductor layer, an electrode contact layer, a positive electrode and a negative electrode. A stacking layer consisting of the first type semiconductor layer, the light-emitting layer, the second type semiconductor layer and the electrode contact layer is formed on the semiconductor substrate, and a first opening penetrates the electrode contact layer and exposes a part of the second type semiconductor layer. The positive electrode is formed in the first opening. A part of the first type semiconductor layer, the light-emitting layer, the second type semiconductor layer and the electrode contact layer is removed to form a platform structure. The negative electrode is formed on the exposed surface of the first type semiconductor layer.