42results about How to "Minimize warpage" patented technology

A pallet for mounting components on a double sided PCB including a fab (panel) having a frame area surrounding a depression. A shoulder around the depression is dimensioned to support the fab. The fab is laid on the shoulder with the a group of components mounted in a previous reflow operation in the space between the depression and a first area of the fab. The print, pick and place and reflow operations are performed to mount a second group of components on the opposite side of the fab. The first area of the fab is shielded from the heat of the oven so that the first components do not separate from the fab during the second reflow step. Standoffs in the depression prevent sagging of the board. Another area of the pallet has a recessed area with cutouts for wave soldering components located on the third area of the fab.

Methods for minimizing warpage of a welded foil carrier structure used in the packaging of integrated circuits are described. Portions of a metallic foil are ultrasonically welded to a carrier to form a foil carrier structure. The ultrasonic welding helps define a panel in the metallic foil that is suitable for packaging integrated circuits. Warpage of the thin foil can be limited in various ways. By way of example, an intermittent welding pattern that extends along the edges of the panel may be formed. Slots may be cut to define sections in the foil carrier structure. Materials for the metallic foil and the carrier may be selected to have similar coefficients of thermal expansion. An appropriate thickness for the metallic foil and the carrier may be selected, such that the warpage of the welded foil carrier structure is limited when the foil carrier structure is subjected to large increases in temperature. Foil carrier structures for use in the above methods are also described.

A curable casemaking adhesive, books and related articles bound thereby. In one embodiment, a UV curable hot melt adhesive is used to form the case, which is preferably also embossed. In another embodiment, a moisture curable hot melt adhesive is used to form the case, which is preferably also embossed.

A mirror type display apparatus comprises a base substrate having a pixel region and a non-pixel region surrounding the pixel region, a driving device, a display device, a protective substrate and an island-shaped reflective layer disposed on a surface of the protective substrate. The island-shaped reflective layer including the island-shaped reflective layers separated by furrows formed on the protective substrate. The island-shaped reflective layer can minimize a warpage caused by a mismatch of coefficient of thermal expansion (CTE) between the protective substrate and the reflective layer.

Disclosed herein is a printed circuit board capable of implementing slimness by decreasing the number of entire layers through an asymmetrical build-up structure in which an electric device is embedded, the printed circuit board including: a core layer including a cavity formed therein so that an electric device is embedded and a circuit pattern and a pad formed on upper and lower surfaces thereof; a through via formed in the core layer so as to connect the upper and the lower pads of the core layer to each other; a plurality of insulating layers built-up on the core layer and including a plurality of vias so as to be electrically connected to the through via; and a solder resist layer applied onto a lower portion of the core layer so that a lower surface of the through via is partially exposed.

A micro-fluid ejection head assembly having improved assembly characteristics and methods of manufacturing a micro-fluid ejection head assembly. The micro-fluid ejection head includes a fluid supply body having at least one fluid supply port in a recessed area therein. A reinforcing member circumscribes the fluid supply port. A micro-fluid ejection head is attached with an adhesive to the supply body in the recessed area so that cracking of the ejection head during adhesive curing is substantially reduced.

Board assemblies with minimized warpage and systems and methods for making the same are disclosed. A board may be pre-conditioned by designing the board to mount components in selected areas of the board and by selectively copper flooding certain regions of the board. Pre-conditioning of the board may assist in preventing board warpage. A reflow fixture may fix a board during solder pasting and reflow processing thereof. After reflow, an underfill fixture may fix the board during underfill processing. Each of these fixtures may include respective clamp members that may hold various portions of the board to correct and/or prevent warpage of the board.

A bamboo laminated lumber is provided having structural characteristics meeting or exceeding dimensionally equivalent wood based components. The bamboo laminated lumber is formed from bamboo laminated elements laminated and joined together to form dimensional lumber and engineered lumber components. The bamboo laminated lumber element comprises a combination of linear bamboo starter boards being halves of timber bamboo canes pressed flat with the inner pith surfaces laminated together with the grain aligned and skewed bamboo starter boards being halves of timber bamboo canes pressed flat with the inner pith surfaces laminated together with the grain offset from centerline at a specified angle. Top and bottom linear bamboo starter boards are laminated to a central skewed bamboo starter board yielding a bamboo laminated lumber element.

The optical recording medium includes a supporting substrate 2, an information layer 3 formed on a surface of the supporting substrate 2, a first resin layer 4 formed on the information layer 3 and having a thickness of 30 to 200 μm, a moisture-proof layer 5 formed on a rear surface of the supporting substrate 2, a second resin layer 6 formed on the moisture-proof layer 5 and having a thickness of 30 to 200 μm, and a label layer 7 formed on the second resin layer 6. The second resin layer 6 contains a filler and is formed by a screen printing method.

Disclosed is an optical-filter-cell-array structure and a method of manufacturing the same. An optical filter which includes an optical filter layer for blocking light of a specific wavelength formed on an upper side or a lower side of a tempered glass substrate is provided in the form of a cell array. The method includes forming a sheet-cutting part according to the form of a cell array on a mother glass substrate, tempering the mother glass substrate so that a lateral side of the mother glass substrate is tempered through the sheet-cutting part while an upper side and a lower side of the mother glass substrate are tempered, and forming an optical filter layer on the upper side or the lower side of the mother glass substrate.