38results about How to "High precision inspection" patented technology

To provide a wafer inspection device which can realize an efficient configuration for suppressing an increase in footprint and can inspect a wafer with high accuracy.The wafer inspection device has a cassette part 2 and a wafer inspection part 3 including a microscope 6 and an XY stage 7 for moving the wafer 10. The cassette part 2 comprises a cassette 4 for holding the wafer 10 and an elevator 5. The wafer inspection part 3 comprises a carrying arm 18 that is arranged on the XY stage 7 to insert / extract the wafer 10 by arm pieces 181, 182 which can linearly move toward an opening of the cassette 4 and can be inserted between wafers 10 in the cassette 4, and a wafer rotary mounting base 22 which is vertically movable above the XY stage 7 to carry-in / carry-out the wafer to the carrying arm 18 by the vertical movement, a centering means for making the center of the wafer 10 and the rotary center of the wafer rotary mounting base 22 coincide with each other, and a detecting means for detecting the orientation of the wafer. (C)2004,JPO.

The invention provides a detecting method and a detecting device, which can remove the influences of back reflected image and detect the characteristics of surface shape with a high precision by a cheap device structure. The detecting method comprises the steps that: firstly, stripes applicable for a transparent plate-shaped body (3) (a detected object) are determined to be set in a separating manner in image signals which are acquired by photographing reflected images formed on the surface of the transparent plate-shaped body and the reflected images formed on the back surface of the transparent plate-shaped body; then, the determined stripes (1) are used, and the surface shape of the transparent plate-shaped body (3) is evaluated through image analysis only by the reflected images, which are formed on the surface of the transparent plate-shaped body (3), of the stripes (1).

A mura defect inspection apparatus 10 having an illuminating unit 12 which irradiates light onto a photomask 50 having a chip 55 on the surface thereof, the chip is formed with a repeated pattern that a unit pattern is regularly arranged, and a photoreceptor 13 which receives scattered light generated at the edge part of the unit pattern of the repeated pattern on the chip of the photomask and converts it to received light data, wherein the received light data is analyzed to detect a mura defect generated in the repeated pattern, wherein the illuminating unit irradiates light that is emitted from an illumination light source and has a orientation property of the rays almost parallel, the light having a parallelism within an angle of 2°, for example, onto a repeated pattern 51 on the chip 55 of the photomask 50. This application claims foreign priority based on Japanese Patent application No. 2004 - 106462 , filed Mar. 31, 2004 , the contents of which is incorporated herein by reference in its entirety.

A glass substrate defect inspecting device and an inspection method thereof are provided to reduce or remove bouncing phenomenon and steadily perform an inspection by reducing the corrected amount during the inspection. A glass substrate (100) comprises a lifting device, a transfer device, and an optical inspection device. The lifting device lifts up a glass substrate(P) using air. The transfer device transfers the glass substrate to an inspection area where the lifting device is absent. The optical inspection device takes a picture of the glass substrate, thereby performing an inspection. A glass substrate defect inspecting device comprises a reduction device. The reduction device reduces the displacement caused by the bouncing of an end part of the glass substrate toward a transferring direction.

An evaluation apparatus comprising: a supporting unit configured to fix a semiconductor device in place and cause an upper surface and a lower surface of the semiconductor device to be exposed; a first insulating plate provided above the supporting unit; a second insulating plate provided below the supporting unit; a plurality of first probes fixed to the first insulating plate; a plurality of second probes fixed to the second insulating plate; and a probe position inspection apparatus attached to the supporting unit, wherein the probe position inspection apparatus comprises: a casing including a first transparent member on a side of the first insulating plate and a second transparent member on a side of the second insulating plate; an internal prism provided in the casing; a prism rotating unit for rotating the internal prism in the casing; and an imaging unit provided outside the casing to take an image of any of the plurality of first probes contacting the first transparent member and the plurality of second probes contacting the second transparent member through the internal prism.

An irregular flaw inspection method and system, and a fabricating method of a photomask are provided. The subject of the invention is to provide an irregular flaw inspection method capable of efficiently inspect an irregular flaw with high precision. In the irregular flaw inspection method for inspecting the irregular flaw produced in the repeating pattern of a photomask (50) having the repeating pattern wherein a large number of unit patterns are arranged regularly, a region having the repeating pattern becoming the inspection target of the irregular flaw is designated as an inspection area from the whole image of the photomask taken by the imaging camera (21) of a pattern data acquiring device (20) and the pattern data of the repeating pattern is acquired from the image, which is taken by a microscope (22), of the repeating pattern in the inspection area. The inspection condition of the irregular flaw due to an irregular flaw inspection device (10) is determined on the basis of the pattern data and the inspection of the irregular flaw is performed on the basis of the inspection condition by the irregular flaw inspection device.

The invention provides a method and device for inspecting intermittently connected optical fiber tape, and a manufacturing method. In order to inspect an intermittent-connection-type optical fiber tape with high precision despite an increased number of cores in the intermittent-connection-type optical fiber tape. This method for inspecting an intermittent-connection-type optical fiber tape comprises: repeatedly capturing an image of an intermittent-connection-type optical fiber tape along the width direction thereof, the intermittent-connection-type optical fiber tape in which connecting partsfor connecting adjacent optical fibers are intermittently arranged, while moving the optical fiber tape in the longitudinal direction thereof, and accumulating one-dimensional images in the width direction of the optical fiber tape; and arranging the accumulated plurality of one-dimensional images in a first direction in which pixels constituting part of the primary images are arranged and a second direction orthogonal to the first direction, and creating a two-dimensional image of the optical fiber tape.

Whether a component is mounted on a substrate is inspected with high precision by simple processing. An inspection apparatus (60) inspects whether the component is mounted based on a pre-mounting image and a post-mounting image of the component taken before and after the component is mounted on a mounting surface of the substrate. The inspection device comprises a threshold setting section (62) for setting a threshold capable of recognizing the substrate according to the brightness value of the pre-mounting image; and a mask image generating section (63) for generating a mask image masking other than the substrate from the pre-mounting image according to the threshold. The specific areas corresponding to the mounting surface of the substrate of the pre-mounting image and the post-mounting image are compared with each other by employing the mask image, thereby inspecting whether the component is mounted or not.

The invention provides an inspection device and an ink-jet printing device therewith. The inspection device includes a sheet conveying portion, an image reading portion, a timing control portion, a storage portion, a comparing control portion, and a display portion. The image reading portion reads a plurality of images of the same pattern recorded repeatedly with a predetermined pitch on a recording sheet conveyed by the sheet conveying portion. The timing control portion regulates the timing of image reading by the image reading portion. The storage portion stores the plurality of images readby the image reading portion. The comparing control portion takes, out of the plurality of images stored in the storage portion, part of an image continuously recorded on the recording sheet corresponding to the forefront one pitch as a reference image and compares the image data of a comparison image recorded later than the reference image with image data of the reference image to check for image defects.

Provided is an appearance inspection device and inspection method for a component installation state, wherein the inspection device (1) is provided with an image scanner (2), having at least a reading module (5) moving along a guide shaft (21) and making an image reading part (54) towards a lower side to scan an image, and a horizontal supporting member for supporting the reading module (5) horizontally; a conveyor belt (32), conveyed to the lower side of the image reading part (54) of the image scanner (2) as a printing substrate (4) of an inspection object; and a mechanism for processing the image scanned by the reading module (5) and displaying on a monitor (11).

The invention provides a high frequency equipment which has an inexpensive circuit board and can be reliably inspected. In the high frequency equipment, the extension 2b of a circuit board 2 is provided with a mount hole 2c for receiving the projection 1d of a frame 1 thereinto and mounting the circuit board 2 thereto, and with a positioning hole 2d capable of receiving a guide rod 8 therein. Thus, when the device after being assembled is inspected, a probe 9 can be positioned with use of the positioning hole 2d having a wiring pattern 3 provided thereto as a reference, the position of the probe 9 relative to the wiring pattern 3 can be made accurate, and the device can be reliably inspected. Further, upon manufacturing the circuit board, the positioning hole 2d provided in the extension 2b of the circuit board 2 can be used also as a feed hole, a strip-shaped substrate 10 for use in manufacture of the circuit board 2 can be made small, and therefore an expensive circuit board can be obtained.

The purpose of the present invention is to provide an inspection device which, irrespective of the passing position of an inspection target, does not have a dead zone, does not have a change in polarity of a detection signal waveform, and can consecutively perform inspection. The inspection device (100) is provided with: a transport path (101) in which the inspection target is transported at a moving velocity v; a first magnetic detector (111) and a second magnetic detector (112) which detect the magnetism of magnetic foreign matter included in the inspection target (10); an amplifying unit (120) which amplifies each of detection signals from the first magnetic detector (111) and the second magnetic detector (112); and a calculation processing unit (130) which multiplies a signal, obtainedby delaying the detection signal from the first magnetic detector (111), by the detection signal from the second magnetic detector (112). The first magnetic detector (111) and the second magnetic detector (112) respectively have magnetic sensors which are paired. One magnetic sensor MS1 of the first magnetic detector, which has a vertical magnetic field detection direction, is disposed at a height h from the transport surface, and one magnetic sensor MS2 of the second magnetic detector is disposed at a distance d from the magnetic sensor MS1.

The present invention provides a color blur inspection method and the apparatus thereof, which could inspect the existence and level of color blur in high precision without the influence by personal difference and status difference of individual. The present invention could eliminate the Mohr's stripes, adjust the focus of focusing optical system 34, employ a video camera device 35 to capture the substrate 31, and inspect the existence and level of color blur according to the photo data.

An industrial robot which works in a clean room can measure the amount of particles of dust and the like in the clean room with high precision and immediate. A light-scattering type particle counter measures the amount of particles in the clean room. The particle counter is provided on a hand portion of the industrial robot and a counter inlet is arranged on the tip of the hand portion. A laser beam used in the particle counter is formed a belt-shaped.

Provided is a preload inspection method for a wheel bearing device enabling more accurate checking of preload. The invention comprises: a press-fitting step (S02) for press-fitting an inner ring (4) to a small-diameter stepped part (3a); a first bearing preload value calculation step (S03) for calculating a first bearing preload value (P1) on the basis of a first axial direction negative clearance (G1); a first rotating torque measurement step (S05) for measuring a first rotating torque Ta after the press-fitting step; a swaging step (S06) for swaging the small-diameter stepped part to the inner ring after the first rotating torque measurement step; a second bearing preload value calculation step (S07) for calculating a second bearing preload value (P2) on the basis of a second axial direction negative clearance (G2); a second rotating torque measurement step (S08) for measuring a second rotating torque Tb after the swaging step; a third bearing preload value calculation step (S09) for calculating a third bearing preload value (P3) by adding, to the first bearing preload value, a preload change amount (Delta P) based on a differential torque (Delta T) between the first rotating torque and the second rotating torque; and a determination step (S10) for determining the suitability of the preload from the second bearing preload value and the third bearing preload value.

To provide a wafer inspection device which can realize an efficient configuration for suppressing an increase in footprint and can inspect a wafer with high accuracy.The wafer inspection device has a cassette part 2 and a wafer inspection part 3 including a microscope 6 and an XY stage 7 for moving the wafer 10. The cassette part 2 comprises a cassette 4 for holding the wafer 10 and an elevator 5. The wafer inspection part 3 comprises a carrying arm 18 that is arranged on the XY stage 7 to insert / extract the wafer 10 by arm pieces 181, 182 which can linearly move toward an opening of the cassette 4 and can be inserted between wafers 10 in the cassette 4, and a wafer rotary mounting base 22 which is vertically movable above the XY stage 7 to carry-in / carry-out the wafer to the carrying arm 18 by the vertical movement, a centering means for making the center of the wafer 10 and the rotary center of the wafer rotary mounting base 22 coincide with each other, and a detecting means for detecting the orientation of the wafer. (C)2004,JPO.