114results about "Standard structures" patented technology

Housings for electrical or electronic components made using braid or woven fabric sheets having multiple sections treated with different materials as well as processes and materials for making such housings are disclosed.

An avionics chassis comprises a housing having a substantially thermally non-conductive frame comprising a composite of carbon fibers laid up in an epoxy matrix. The housing also includes at least two walls, at least one of which is a thermally conductive wall comprising a composite of carbon fibers in a carbonized matrix, and a plurality of spaced, thermally-conductive, card rails provided on the at least two walls. The at least two walls are mounted to the frame in opposing relationship such that corresponding card rails on the walls define an effective slot therebetween in which a printed circuit board may be received and the card rails and the at least one thermally conductive wall form a thermally conductive path from the interior to the exterior.

A rack-based information handling system (RIHS) includes: a rack chassis having a plurality of interconnected panels forming a volumetric space having a front section and a rear section, both with opposing side panels forming a front access space and a rear access space, respectively, between corresponding opposing side panels; one or more IT gear sleds that are inserted into the front section of the rack chassis; and a pair of front expansion panels that are added to the rack chassis and which extend past an end of the opposing side panels at the front section of the rack chassis to provide a deeper IT bay within the front section and enable insertion of longer-than-standard depth IT gear within the rack chassis. The front expansion panels are cable management panels that include at least one strap that is utilized to secure one or more cables extending from one or more IT gear inserted into the rack chassis.

An improved carrier comprises a tray, an EMC component, and a bezel. The EMC component comprises a top spring set and a bottom spring set. Each spring set comprises a plurality of spring biased contacts connected by a plate and a bar so that each spring set moves in unison when depressed or released. Each tray has a first flange and a second flange and each of the flanges has a cut out portion. When an improved carrier is moved out of an array enclosure, the flanges depress the top spring of the EMC component of the carrier below. When the improved carrier is moved into the array enclosure, the flanges depress the top spring set of the carrier below until the top spring set of the carrier below is released by the cut-out portions of the flanges. When released, the top spring set of the carrier below contacts the bottom spring set of the carrier above to form a continuous EMC shield.

An enclosure or containment system for expansion cards includes first and second sub-enclosures that interengage to form an enclosure assembly that substantially surrounds the major surface areas of the expansion card while providing support along some of the edges thereof to provide a protected volume that physically protects and shields the electronic and electrical components on the expansion card while providing enhanced heat transfer therefrom.