69results about How to "Increase heat dissipation structure" patented technology

The invention provides a soft robot based on shape memory alloy driving. The soft robot has the characteristics of being simple in structure, capable of moving in multiple poses, good in environmental adaptation and the like. A single chip microcomputer is controlled to sequentially power on shape memory alloy wires embedded in the robot, the six shape memory alloy wires are arranged in a robot body, and an alloy wire overlapping structure is used for driving the robot to move forwards and backwards. The robot is provided with four feet, each foot comprises two shape memory alloy wires, the forward moving direction of the robot is changed by means of flexibility of the alloy wires, and multi-pose movement is achieved. A top heat dissipation structure can increase the movement speed of the root. A bottom tooth-shaped structure is beneficial to jacking up a silica gel outer shell in the mode that the alloy wires are powered on to retract. Supporting structures on the front side and the rear side serve as contact points of a supporting surface in movement, and friction force with the surface can be reduced in movement.

A heat dissipation structure of an intelligent power module includes a chassis base, a drive circuit board arranged on the chassis base, an intelligent power module arranged at a side of the drive circuit board, the intelligent power module comprising a plurality of circuit devices, a first heat dissipater having one surface contacting a surface of the intelligent power module, the first heat dissipater being adapted to dissipate heat generated by operation of the plurality of circuit devices, and a second heat dissipater having one side arranged in contact with another surface of the first heat dissipater and another side arranged to contact a surface of the chassis base.

An optical head includes a fixed part, a movable part movably held by a plurality of wires fixed on the fixed part, and magnets fixed to the fixed part. The movable part includes a movable-part housing, a heatsink held by the movable-part housing, a light emitting element and a light receiving element both mounted on the heatsink, magnets provided to both sides of the movable-part housing to contact the heatsink, an objective lens held by the movable-part housing to allow an emitted laser beam from the light emitting element to focus, and a diffraction grating provided between the objective lens and the light emitting element and between the objective lens and the light receiving element. The gap between each coil and the adjacent magnet is filled with ferrofluid having a higher thermal conductivity than the atmosphere.

A spherical lamp with easy heat dissipation comprises: a lower substrate and an upper substrate, in each of which a plurality of LEDs are embedded; a substrate support portion having a plate shape, to which the lower and upper substrates are coupled and fixed to lower and upper portions thereof, respectively; lower and upper covers, which are fixed to lower and upper portions of the substrate support portion, respectively, and each of which has a semi-spherical shape; a support portion, which is connected to an upper center portion of the substrate support portion and is exposed to the exterior through a center portion of the upper cover; and a heat dissipation plate which is formed on a rear surface of the heat dissipation plate and provided with a coupling portion into which an end of the support portion is inserted and fixed.

A lighting device includes a light source module and a housing mated to a heat sink and covered by a cover. The housing has a first shell portion encircled by an inner sidewall of the heat sink. Alternatively, the housing may further has a second shell portion arranged between the first shell portion and the inner sidewall of the heat sink. The respective ends of the first and second shell portions are covered by a first plate portion and a connecting portion. A cavity is defined by the first shell portion and the first plate portion for accommodating the light source module. A plurality of first thru-holes, second thru holes, third thru holes, fourth thru-holes, and fifth thru holes are formed on the circuit board, the connecting portion, the cover, the first shell portion, and the first plate portion, respectively.