41results about How to "Does not affect connectivity" patented technology

The invention discloses a power supply connector composed of a plug and a jack, wherein the plug is a cylinder provided with an insulation cylinder core, and at least two electrodes are sheathed on the insulation cylinder core along the direction of a cylinder shaft; the jack is a cylinder-shaped hole, and at least two electrodes are embedded in the insulation hole wall along the direction of the cylinder shaft; the electrodes in the jack correspond to the electrodes on the plug, and the electrodes in the corresponding position thereof form electrical connection after the plug is inserted into the jack. A power supply socket is composed of a housing and jacks, wherein the housing arranges and fixes a plurality of the jacks serving as independent components, and pins in the same position of the jacks are connected in series by leads in the housing. Two or three electrodes of the invention are vertically distributed on the cylinder plug, so that the plug of both two and three electrodes can be inserted into unified jacks with three electrodes, thus overcoming the problem that the traditional plug and socket with two jacks and three jacks can not be used universally.

The invention relates to the field of medical apparatuses, and discloses a portable slipper for operations. The slipper comprises a slipper body by using an EVA texture, the slipper body comprises a slipper top and a slipper sole, and a cushion is fixed to the inside of the shoe sole; the cushion is wrapped with a wearable portion, an inflator is arranged inside a first cavity, and a foot entranceis formed in the top of the slipper body; the foot opening of the slipper body is enclosed by a foot protecting air bag, the foot protecting air bag is communicated with a communicated pipe, and an air inlet pipe is installed on the slipper sole; the air inlet pipe is inserted inside the communicated pipe, the inflator is communicated with a flexible pipe, and the flexible pipe is communicated with the air inlet pipe; a one-way valve is arranged on the air inlet pipe, a limiting opening is formed in the inflator wall, and an inserting hole is formed in the slipper sole, and a limit rod is used for being inserted inside the limiting opening; compared with the prior art, the slipper body adopts the EVA material and is integrally made, water resistance and resistance of sharp device puncturing are achieved by arranging the foot protecting air bag, a better insulation effect is achieved, safety of medical workers is achieved, blood contaminating the slipper is avoided, injuring the humanskin is avoided, and the slipper is applicable to outdoor operations of the medical workers.

The invention discloses a programmable modularized PDMS (Polydimethylsiloxane) microfluidic chip mold system and belongs to the technical field of microfluidics. A plurality of silicon chip mold module mounting areas are arranged on a mold assembling platform; a plurality of bosses are arranged in the middle of the different mounting areas; processed micro structures are arranged on silicon chips;a plurality of silicon chip mold modules with different micro structure patterns are mounted on the mold assembling platform through the bosses. By adopting the system, molds for manufacturing PDMS microfluidic chips are designed and manufactured in a modularization manner, microfluidic chip mold modules with different functions are processed by using the silicon chips, the silicon chips are further arranged and combined by using the mold assembling platform to form a microfluidic chip system mold with complex functions, and finally microfluidic chips are manufactured from PDMS through mold reversing. By adopting the system, the flexibility of the microfluidic chip processing process can be remarkably improved, the chip processing cost can be remarkably reduced, the processing process issimple to operate, and the system is applicable to microfluidic chip manufacturing with single or complex functions on the basis of PDMS materials.

The invention discloses a device packaging structure which has a large effective heat dissipation area and does not generate environmental pollution and consumes less materials. Besides, the invention also discloses a packaging method corresponding to the device packaging structure. According to the invention, the packaging structure comprises a package body, a wafer packaged in the package body, and a pair of leads connected with the wafer and extending out of the package body, the package body is of a cylindrical structure, the leads are led out from the two bottoms of the cylindrical structure respectively; the device packaging structure also comprises a metal shell respectively and correspondingly arranged at two ends of the package body, the connection area is large, the metal shell is electrically connected with the lead at the corresponding end, and is electrically insulated from the metal shell and the lead which are arranged at the opposite side. Based on the structure, the repair and welding of a pin is not necessary when in use, material consumption is small and additional pollution cannot be generated.

The invention discloses an electrowetting device with a spacer and a preparation method thereof. The spacer material is firstly taken, heat-cured under yellow light, and ground to obtain spacer microspheres, and then the spacer microspheres are sprinkled on the coated On the pixel wall material, the pixel wall material is cured again, and then the pixel wall and the spacer are prepared at the same time by one photolithography. The partial structure of the microspheres in the curing area, when the upper substrate and / or the lower substrate are deformed, the spacer is in contact with the upper substrate, which can effectively prevent the internal collapse of the electrowetting device; because the spacer The spacer is obtained by photolithography of microspheres, and the spacer will not affect the connectivity of the polar electrolyte solution; because the pixel wall and the spacer are obtained by one-step photolithography, compared with the preparation of the spacer by two photolithography There is no error chain caused by two lithography alignments, the precision is higher, the process is simpler, and the operation is less difficult.