The invention discloses a light-emitting
assembly, a manufacturing method thereof and a light-emitting device. The light-emitting
assembly comprises an epitaxial substrate, an N-type material layer, a light-emitting layer, a P-type material layer, a
passivation layer, an
anode bonding pad and a
cathode bonding pad, wherein the
anode bonding pad extends from the upper surface of the P-type material layer to the upper surface of the epitaxial substrate along the
passivation layer; and the
cathode bonding pad extends from the upper surface of the P-type material layer to the surface of the N-type material along the
passivation layer and then extends to the upper surface of the epitaxial substrate. On the one hand, the bonding pads are arranged on the side wall and the bottom of the light-emitting layer to form the light-emitting assemblies, color deviation caused by light mixing of different-color light rays emitted by the two adjacent light-emitting assemblies is avoided, and therefore the display quality is improved; on the other hand, the
solder paste is coated on the side wall and the bottom of the bonding pad to form the
solder paste layer, so that the contact area of the
solder paste layer and the bonding pad of the driving substrate is increased, the push-pull resistance of the light-emitting
assembly is improved, the light-emitting assembly is prevented from falling off due to stress, and the display quality is improved.