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33 results about "Electron attachment" patented technology

Electron attachment. The combination of an electron with a neutral atom or molecule to form a negative ion.

Removal of surface oxides by electron attachment for wafer bumping applications

The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy to the first and / or the second electrode to generate electrons within the target area wherein at least a portion of the electrons attach to a portion of the reducing gas and form a negatively charged reducing gas; and contacting the substrate with the negatively charged reducing gas to reduce the metal oxides on the surface of the substrate.
Owner:AIR PROD & CHEM INC

Removal of Surface Oxides by Electron Attachment

Described herein are a method and an apparatus for removing metal oxides from a substrate surface within a target area. In one particular embodiment, the method and apparatus has an energizing electrode which has an array of protruding conductive tips that are electrically connected by a conductive wire and separated into a first electrically connected group and a second electrically connected group wherein at least a portion of the conductive tips are activated by a DC voltage source that is negatively biased to generate electrons within the target area that attach to at least a portion of a reducing gas that is present in the target area to form a negatively charged reducing gas that contacts the treating surface to reduce the metal oxides on the treating surface of the substrate.
Owner:AIR PROD & CHEM INC

Gas pulse discharge parameter measuring method and device

ActiveCN111880051ARealize measurementFill in the measurement gapsTesting dielectric strengthCapacitanceEngineering
The invention discloses a method and a device for measuring gas pulse discharge parameters, and the method and device are used for realizing accurate measurement of the gas pulse discharge parametersunder an atmospheric pressure condition. According to the invention, the method comprises the steps: adopting a gas pulse discharge parameter measuring device to respectively obtain a pulse voltage and a loop current of gas to be measured in a non-breakdown state and a breakdown state; establishing a numerical simulation model according to the particle control equation and the electric field control equation; according to the numerical simulation model and a preset equation set, adjusting and optimizing the stray capacitance parameter value of the numerical simulation model through the non-breakdown experiment data; according to the optimized numerical simulation model, obtaining the simulated loop current, and then determining gas discharge parameters such as a soup ionization coefficient, an electron adhesion coefficient, a secondary electron emission coefficient, a photoionization coefficient and the like which enable the breakdown experiment data and the breakdown simulation data to take minimum values by adopting a direction acceleration optimization method, and calculating the standard deviation between the breakdown experiment data and the breakdown simulation data.
Owner:XI AN JIAOTONG UNIV

Method for the removal of surface oxides by electron attachment

Described herein are a method and an apparatus for removing metal oxides and / or forming solder joints on at least a portion of a substrate surface within a target area. In one particular embodiment, the method and apparatus to reduce metal oxides and form a solder joint within a substrate comprising a layer having a plurality of solder bumps by providing one or more energizing electrodes and exposing at least a portion of the layer and solder bumps to the energizing electrode.
Owner:AIR PROD & CHEM INC

Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment

Described herein is a method and apparatus for removing metal oxides on a surface of a component via electron attachment. In one embodiment, there is provided a field emission apparatus (10, 500), wherein the electrons attach to at least a portion of the reducing gas to form a negatively charged atomic ions which removes metal oxides comprising: a cathode (20, 520) comprising an electrically conductive and comprising at least one or more protrusions having an angled edge or high curvature surface, wherein the cathode is surrounded by a dielectric material (30, 530) which is then surrounded by an electrically conductive anode (40, 540) wherein the cathode (20, 520) and anode (40, 540) are each connected to an electrical voltage source (60, 560), and the dielectric material (30, 530) between the cathode (20, 520) and anode (40, 540) is polarized, intensifying the electrical field strength and accumulating electrons at the apex of the cathode to promote field emission of electrons from the cathode.
Owner:AIR PROD & CHEM INC

Addition of D2 to H2 to detect and calibrate atomic hydrogen formed by dissociative electron attachment

A method of detecting and calibrating dry fluxing metal surfaces of one or more components to be soldered by electron attachment using a gas mixture of reducing gas comprising hydrogen and deuterium, comprising the steps of: a) providing one or more components to be soldered which are connected to a first electrode as a target assembly; b) providing a second electrode adjacent the target assembly; c) providing a gas mixture comprising a reducing gas comprising hydrogen and deuterium between the first and second electrodes; d) providing a direct current (DC) voltage to the first and second electrodes to form an emission current between the electrodes and donating electrons to the reducing gas to form negatively charged ionic reducing gas and molecules of hydrogen bonded to deuterium; e) contacting the target assembly with the negatively charged ionic reducing gas and reducing oxides on the target assembly. Related apparatus is also disclosed.
Owner:AIR PROD & CHEM INC
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