A room-temperature fast-curing low-stress transparent epoxy resin adhesive

Abstract

The invention belongs to the technical field of adhesives, and in particular relates to a room-temperature fast-curing low-stress transparent epoxy resin adhesive, which is composed of epoxy resin A component and curing agent B component in a volume ratio of 1:1; The epoxy resin A component includes: hydrogenated bisphenol A epoxy resin, bisphenol A glycidyl ether epoxy resin, functional acrylate monomer, acrylate diluent, tackifier and silane coupling agent; The curing agent B component includes: polythiol, tertiary amine accelerator, co-accelerator, stabilizer, curing accelerator 1 and curing accelerator 2. The adhesive prepared by the present invention maintains fast curing for 5 minutes, high transparency and good bonding strength, low exothermic temperature and small stress during curing, good applicability in electronic device assembly, and electrical insulation , Excellent voltage breakdown resistance, impact resistance and aging resistance, greatly expanding the application of mercaptan-epoxy resin adhesives in the manufacture of electronic devices.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to a room-temperature fast-curing low-stress transparent epoxy resin adhesive. Background technique [0002] Due to its high cohesive strength and high crosslinking density, epoxy resin adhesives have excellent bonding performance, electrical insulation performance and chemical resistance to most rigid materials; 5-minute curing epoxy resin with polythiol as curing agent Adhesive, which can be quickly bonded and fixed at room temperature; because polythiol has a sulfur-containing flexible segment, it has high refractive index and light transmittance, and is suitable for fast bonding and fast bonding of transparent rigid plastics such as glass and PC and electronic components. Packaging, suitable for high-efficiency production line operations, is widely used in modern manufacturing. However, when polythiol reacts with epoxy resin, a large amount of heat is released, an...

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Problems solved by technology

However, when polythiol reacts with epoxy resin, a large amount of heat is released, and the heat release will generate high curing stress, causing stress deformation, cracks and shrinkage, and the electrical insulation performance will decrease. The bonding of precision devices will be affected by high heat and stress. The deformation affects the installation accuracy, and the packaging of chips and components may even be deformed and damaged; compared with other types of elastic sealants, the cured product is hard and brittle, and cannot be repaired, which limits its application in chips, electronic components and precision devices. Applications in Manufacturing

[0003] In the prior art, modified epoxy resins such as carboxyl-terminated (hydroxyl)-based nitrile rubber, polyurethane, and acrylate, or inert substances such as dibutyl phthalate and liquid rubber are used to modify epoxy adhesives, which can effectively improve The toughness of the epoxy resin reduces the elastic modulus of the cured epoxy resin; however, these modification methods usually cause incomplete phase separation due to the rapid curing reaction in the polythiol-epoxy curing system, or due to the phase separation during curing. The separated particles will cause the cured product to lose its transparency, or the cured product will age, yellow, and affect light transmission due to the migration of inert substances, which will lead to these conventional toughening and flexibilization methods in polythiol-epoxy curing The system has little practical significance, and these methods cannot solve the problems of high exothermic temperature and large curing stress in the curing system of polythiol-epoxy resin

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