Solder resist composition and printed-circuit board

A technology for printed circuit boards and compositions, applied in the directions of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of deterioration of white solder mask, reduced reflectivity, deterioration of solder mask, etc., and achieves excellent resolution, improved Acid resistance effect

Inactive Publication Date: 2012-12-26
TAIYO INK MFG
View PDF8 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, the light and heat emitted from the LED on the printed circuit board directly packaged with the LED promotes the deterioration and coloring of the white solder resist layer, causing a decrease in reflectivity
Especially during use, the white solder resist layer is exposed to light and heat emitted by LEDs for a long period of time, so the deterioration of the solder resist layer and the decrease in reflectance due to coloring are significant

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Solder resist composition and printed-circuit board
  • Solder resist composition and printed-circuit board
  • Solder resist composition and printed-circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0082] Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated concretely, this invention is not limited to them at all.

[0083] (A) Synthesis of carboxyl-containing resin

Synthetic example 1

[0085] 900 g of diethylene glycol dimethyl ether as a solvent and 21.4 g of peroxide (2 -Ethylhexanoic acid) tert-butyl (manufactured by NOF Corporation, trade name; PERBUTYL O), heated to 90°C. After heating, 309.9 g of methacrylic acid, 116.4 g of methyl methacrylate, and 109.8 g of lactone-modified 2-hydroxyethyl methacrylate (manufactured by Daicel Corporation., trade name; Placcel FM1) were added dropwise thereto over 3 hours. ) and 21.4 g of bis(4-tert-butylcyclohexyl)peroxydicarbonate (manufactured by NOF Corporation, trade name; PEROYL TCP) as a polymerization initiator. Furthermore, this was aged for 6 hours to obtain a carboxyl group-containing copolymer resin. Here, these reactions were carried out under nitrogen atmosphere.

[0086] Next, 363.9 g of 3,4-epoxycyclohexylmethyl acrylate (manufactured by Daicel Corporation, trade name; Cyclomer-A200), 3.6 g of dimethylbenzyl as a ring-opening catalyst were added to the obtained carboxyl group-containing copolymer res...

Synthetic example 2

[0088] In a flask equipped with a thermometer, a stirrer, a dropping funnel, and a reflux condenser, add diethylene glycol monoethyl ether acetate as a solvent, azobisisobutyronitrile as a catalyst, and heat it to 80 °C under a nitrogen atmosphere. °C, dropwise added monomers in which methacrylic acid and methyl methacrylate were mixed at a molar ratio of 0.40:0.60 over about 2 hours. Furthermore, after stirring this for 1 hour, the temperature was raised to 115 degreeC, it deactivated, and the resin solution was obtained.

[0089] After cooling the resin solution, use tetrabutylammonium bromide as a catalyst, and add butyl glycidyl ether to the carboxyl group of the obtained resin at a molar ratio of 0.40 under the condition of 95~105°C for 30 hours. React and cool.

[0090] Further, tetrahydrophthalic anhydride was added to the OH group of the resin obtained above at a molar ratio of 0.26 at 95 to 105° C. for 8 hours. It was taken out after cooling, and a solution containi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Acid valueaaaaaaaaaa
Acid valueaaaaaaaaaa
Login to view more

Abstract

Disclosed is a solder resist composition with high reflectivity and high resolution that includes (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) melamine or a derivative thereof, (D) a photopolymerizable monomer, (E) rutile titanium dioxide, (F) an epoxy compound, and (G) an organic solvent, and that prevents decreases in reflectivity that are attributable to discoloration and deterioration. Also disclosed is a printed circuit board obtained by forming a solder resist using the solder resist composition.

Description

technical field [0001] The present invention relates to a solder resist composition capable of forming a high-reflectance solder resist layer suitable for use as a permanent mask of a printed circuit board, and the use of the solder resist composition to form a solder resist on the surface of a printed circuit board on which a circuit is formed Patterned printed circuit boards. Background technique [0002] In printed wiring boards, unnecessary portions of copper foil bonded on laminates are usually removed by etching to form circuit wiring, and electronic components are arranged at predetermined positions by soldering. In such a printed wiring board, a solder resist layer formed by coating and curing a base material is used as a protective film for a circuit when electronic components are soldered. [0003] As for this solder resist layer, it prevents solder from adhering to unnecessary parts at the time of soldering, and prevents circuit conductors from being directly exp...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G03F7/038G03F7/004G03F7/029G03F7/031H05K3/28
CPCH05K2201/2054H05K3/287G03F7/029G03F7/038H05K2201/0209G03F7/004G03F7/0045G03F7/0382
Inventor 依田爱子能坂麻美岛宫步宇敷滋
Owner TAIYO INK MFG
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap