A device and a method for determining the extent of an at least locally lateral
undercut of a structured
surface layer on a sacrificial layer. The structured
surface layer for this purpose locally has at least one passive
electronic component, using which a physical
measured quantity can be determined, which is proportional to the extent of the lateral
undercut. The method for generating this device proposes, initially on the structured
surface layer in a first
etching method, to provide the surface layer at least locally with a structuring having trenches and, in a second
etching method, proceeding from the trenches, to undertake at least locally a lateral
undercut of the structured surface layer. In this context, in the first
etching method on the surface layer, locally at least one passive
electronic component is additionally delineated out, which in response to a subsequent undercutting of the surface layer is also undercut. The physical
measured quantity is determined without contact, preferably by sending an
electromagnetic emission into the passive component.