A resin paste for
die bonding that can be supplied and applied easily by a printing method. The resin paste for
die bonding of the present invention comprises: a
polyimide resin (PI), which is obtained by reacting a tetracarboxylic dianhydride (A) comprising a tetracarboxylic dianhydride represented by the formula (I) shown below: (wherein, n represents an integer from 2 to 20), with a
diamine (B) comprising a
siloxane-based
diamine represented by the formula (II) shown below: (wherein, Q1 and Q2 each represent, independently, an alkylene group of 1 to 5 carbon atoms or a
phenylene group, Q3, Q4, Q5 and Q6 each represent, independently, an
alkyl group of 1 to 5 carbon atoms, a
phenyl group, or a phenoxy group, and p represents an integer from 1 to 50); a filler (F); and a printing
solvent (S), wherein the resin paste has been adjusted to have a
solid fraction from 20 to 70% by weight, a thixotropic index from 1.5 to 8.0, and a
viscosity (25° C.) from 5 to 1,000 Pa·s.