32results about How to "Large fill factor" patented technology

A MEMS device having a movable plate supported on a substrate by a support structure that is hidden under the plate and yet which can be implemented to enable rotation of the plate with respect to the substrate about a rotation axis lying at the plate surface. As a result, the support structure does not take up any area within the plane of the plate, while enabling rotation of the plate, during which the plate does not substantially move sideways. The latter property reduces potential physical interference between neighboring plates in an arrayed MEMS device and enables implementation of a segmented mirror having relatively narrow gaps between adjacent segments and, thus, a relatively large fill factor, e.g., at least 98%.

A representative embodiment of the invention provides an infrared (IR) detector having a movable plate supported at an offset distance from a substrate by a suspension arm. In response to a temperature difference between the plate and the substrate generated by the incident IR radiation, the suspension arm deforms and changes the offset distance for the plate. In one embodiment, the suspension arm has three rod-shaped bimorph transducers that lie within a plane that is parallel to the substrate. The transducers are also parallel to one another, with the transducer that is attached to an anchor of the suspension arm being located between the two transducers that are attached to the plate.

A support structure extends upwards from a substrate and supports a tiltable platform, the upper surface of which can be a mirror, by means of spaced flexible couplings that enable the platform to tilt relative to the support structure. Respective electrodes associated with the substrate and platform control the platform tilt in response to applied signals. The platform electrodes are preferably spaced below and tilt with the platform, with the platform extending laterally from the support structure further than the platform electrodes. The platform is preferably bulk micromachined, and the support structure surface micromachined.

Systems and methods for thermal sensing and imaging using the electro-optic effect. A thermal detection system comprises a temperature sensing element that includes an electro-optic (EO) material layer having a length axis and characterized by a temperature dependent index of refraction, an electrical mechanism for inducing a chance in the index of refraction, a laser beam propagating lengthwise through EO layer for probing the refraction index change, and a light intensity meter for measuring a laser beam intensity change caused by the temperature dependent refraction index change. Thermal imaging is obtained by using a pixel array of such thermal sensing elements. The intensity reading may be done in either a cross-polarizer or a Mach Zehnder Interferometry reading configuration.

A photodetector focal plane array system, comprising: a substrate comprising a plurality of photosensitive regions; and a microcomponent disposed adjacent to each of the plurality of photosensitive regions operable for receiving incident radiation and directing a photonic nanojet into the associated photosensitive region. Optionally, each of the microcomponents comprises one of a microsphere and a microcylinder. Each of the microcomponents has a diameter of between ˜λ and ˜100λ, where λ is the wavelength of the incident radiation. Each of the microcomponents is manufactured from a dielectric or semiconductor material. Each of the microcomponents has an index of refraction of between ˜1.4 and ˜3.5. Optionally, high-index components can be embedded in a lower index material. The microcomponents form an array of microcomponents disposed adjacent to the substrate.

A light-receiving device includes a light-receiving layer having an undoped multi-quantum well structure; a cap layer disposed on the light-receiving layer, the cap layer including a semiconductor layer doped with a p-type impurity; a mesa structure including the cap layer; a p-type region extending from the p-type semiconductor layer toward the light-receiving layer, the p-type region including the p-type impurity diffused from the semiconductor layer in the mesa structure; a p-n junction formed at an end of the p-type region; and an electrode disposed on the cap layer of the mesa structure. The mesa structure is defined by a trench surrounding the mesa. The trench has a bottom that reaches the vicinity of an upper surface of the light-receiving layer. The p-n junction is located in the light-receiving layer or at the boundary between the light-receiving layer and the cap layer disposed on the light-receiving layer.

A method of making a filled large-format imprinted structure includes providing a substrate, locating a curable layer over the substrate, imprinting the curable layer, and curing the curable layer to form a cured layer including a layer surface and one or more imprinted micro-cavities. Each micro-cavity has a micro-cavity depth and a micro-cavity width and one or more ribs extending from the bottom of the micro-cavity toward the top of the micro-cavity. Each rib has a rib width that is less than one half of the micro-cavity width, a rib height that is less than the micro-cavity depth, and each rib separates the micro-cavity into portions, each portion having a portion width less than or equal to 20 microns. A curable material is located in each micro-cavity and cured to form cured material located in each micro-cavity, thereby defining a filled large-format imprinted structure.

A method of making a filled large-format imprinted structure includes providing a substrate, locating a first curable layer over the substrate, imprinting the first curable layer, and curing the first curable layer to form a first cured layer imprinted with a first micro-cavity. A first curable material of a first color is located in the first micro-cavity and cured to form first cured material in the first micro-cavity. A second curable layer is located on the first cured layer and the first cured material, imprinted, and cured to form a second cured layer imprinted with a second micro-cavity. A second curable material of a second color different from the first color is located in the second micro-cavity and cured to form second cured material, thereby defining a large-format imprinted structure.

A filled large-format imprinted structure includes a cured layer including a cured layer surface having one or more areas and a plurality of micro-cavities imprinted in each area, each of the micro-cavities having a micro-cavity width less than or equal to 20 microns. A rib separates each micro-cavity from an adjacent micro-cavity by a rib width that is less than the micro-cavity width, the rib extending from a bottom of the micro-cavity to the cured layer surface. A common cured material is located in each micro-cavity, thereby defining a filled large-format imprinted structure.

A filled large-format imprinted structure includes a cured layer including a cured layer surface and one or more micro-cavities imprinted in the cured layer, each micro-cavity having a micro-cavity width and a micro-cavity depth. One or more ribs are imprinted in each micro-cavity and extend from the bottom of the micro-cavity toward the top of the micro-cavity, each rib having a rib width that is less than one half of the micro-cavity width, and a rib height that is less than the micro-cavity depth. Each rib separates the micro-cavity into portions, each portion having a portion width less than or equal to 20 microns. A cured material is located in each portion of the micro-cavity and extends over the top of the rib, thereby defining a filled large-format imprinted structure.

A method of making a filled large-format imprinted structure includes providing a substrate, locating a first curable layer over the substrate, imprinting the first curable layer, and curing the first curable layer to form a first cured layer imprinted with a first micro-cavity having a first micro-cavity width less than or equal to 20 microns. A curable material is located in the first micro-cavity and cured to form cured material in the first micro-cavity. A second curable layer is located on the first cured layer and the first cured material, imprinted and cured to form a second cured layer imprinted with a second micro-cavity having a second micro-cavity width less than or equal to 20 microns. The curable material is located in the second micro-cavity and cured to form cured material in the second micro-cavity, thereby forming a large-format imprinted structure.

A method of making a filled large-format imprinted structure includes providing a substrate, locating a curable layer over the substrate, imprinting the curable layer, and curing the curable layer to form a cured layer including a layer surface having one or more areas. Each area has a plurality of imprinted micro-cavities, wherein each micro-cavity has a micro-cavity width less than or equal to 20 microns. A rib separates each micro-cavity from an adjacent micro-cavity by a rib width that is less than the micro-cavity width, the rib extending from a bottom of the micro-cavity to the layer surface. A common curable material is located in each micro-cavity and cured to form common cured material in each micro-cavity, thereby defining a filled large-format imprinted structure.

A filled large-format imprinted structure includes a substrate, a first cured layer located over the substrate, a first micro-cavity imprinted in the first cured layer, and a first cured material of a first color located in the first micro-cavities. A second cured layer is located over the first cured layer and a second micro-cavity is imprinted in the second cured layer. A second cured material of a second color is located in the second micro-cavities. A third cured layer is located over the second cured layer and a third micro-cavity is imprinted in the third cured layer. A third cured material of a third color is located in the third micro-cavities, thereby defining a large-format imprinted structure.

A filled large-format imprinted structure includes a substrate and a first cured layer located over the substrate. One or more first micro-cavities are imprinted in the first cured layer, each first micro-cavity having a first micro-cavity width less than or equal to 20 microns. A second cured layer is located over the first layer and the one or more first micro-cavities. One or more second micro-cavities are imprinted in the second cured layer, each second micro-cavity having a second micro-cavity width less than or equal to 20 microns. A common first cured material is located in the first micro-cavity and in the second micro-cavity, thereby defining a filled large-format imprinted structure.

A filled large-format imprinted structure includes a substrate, a first cured layer located over the substrate, a first micro-cavity imprinted in the first cured layer, and a first cured material of a first color located in the first micro-cavities. A second cured layer is located over the first cured layer and a second micro-cavity is imprinted in the second cured layer. A second cured material of a second color is located in the second micro-cavities. A third cured layer is located over the second cured layer and a third micro-cavity is imprinted in the third cured layer. A third cured material of a third color is located in the third micro-cavities, thereby defining a large-format imprinted structure.