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Filled large-format imprinted structure

a large-format, imprinted technology, applied in the direction of dielectric characteristics, instruments, photomechanical equipment, etc., can solve the problems of difficult to uniformly fill a large imprinted area, expensive optical alignment equipment, and difficulty in uniform filling a large area, so as to reduce material requirements, improve uniformity and size, and increase manufacturing speed

Inactive Publication Date: 2016-03-03
EASTMAN KODAK CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides improved methods and materials for making color filters and other filled large-format imprinted structures. These methods and structures have better uniformity and size, increased manufacturing speed, and require less material and equipment. Overall, the invention enables faster and more cost-effective production of high-quality color filters and other large-format structures.

Problems solved by technology

This process is expensive and time consuming because it is a subtractive process that is wasteful of etched materials, uses additional, expensive materials such as photoresists and masks, and requires expensive optical alignment equipment.
However, as with the imprinting process itself, it is difficult to uniformly fill a large, imprinted area with a liquid that is subsequently cured.
For example, the coffee-ring effect is widely known to compromise the uniformity of a dried coating because of capillary flow induced by differential evaporation rates over the extent of the coating.
Therefore, because of such imprinting and drying problems, it is difficult to form large fill-factor substrates, such as color filter substrates, using imprint-and-fill processes.

Method used

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Embodiment Construction

[0029]According to various embodiments and methods of the present invention, filled large-format imprinted structures such as color filters having improved uniformity and size are provided by using structures and processes that decrease material requirements, increase manufacturing speed, and require less equipment. As is described more fully below, imprinting processes form relief features or structures such as micro-cavities in a curable layer. Once the curable layer is cured, the micro-cavities are filled with a curable material and dried to form, for example, color filters. Multiple stacked cured layers, arrangements of micro-cavities in the stacked cured layers, and structures formed in the micro-cavities in the cured layers mitigate problems found in structures and methods of the prior art.

[0030]Additive imprinting processes are known to form small features such as micro-cavities in cured layers at a relatively high rate compatible with inexpensive roll-to-roll processes with ...

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Abstract

A filled large-format imprinted structure includes a cured layer including a cured layer surface having one or more areas and a plurality of micro-cavities imprinted in each area, each of the micro-cavities having a micro-cavity width less than or equal to 20 microns. A rib separates each micro-cavity from an adjacent micro-cavity by a rib width that is less than the micro-cavity width, the rib extending from a bottom of the micro-cavity to the cured layer surface. A common cured material is located in each micro-cavity, thereby defining a filled large-format imprinted structure.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]Reference is made to commonly-assigned U.S. Patent Application Serial No. (Docket K001727) filed concurrently herewith, entitled Filled Large-Format Imprinting Method by Cok; to commonly-assigned U.S. Patent Application Serial No. (Docket K001728) filed concurrently herewith, entitled Ribbed Large-Format Imprinted Structure by Cok; to commonly-assigned U.S. Patent Application Serial No. (Docket K001729) filed concurrently herewith, entitled Ribbed Large-Format Imprinting Method by Cok; to commonly-assigned U.S. Patent Application Serial No. (Docket K001730) filed concurrently herewith, entitled Multi-Layer Large-Format Imprinted Structure by Cok; to commonly-assigned U.S. Patent Application Serial No. (Docket K001731) filed concurrently herewith, entitled Multi-Layer Large-Format Imprinting Method by Cok; to commonly-assigned U.S. Patent Application Serial No. (Docket K001732) filed concurrently herewith, entitled Stacked Large-Format Imp...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): G02B5/20G02B5/00
CPCG02B5/201G02F1/133516G02F2001/133519H05K1/092H05K1/111H05K2201/0108B29K2105/24B29C2035/0827B29C59/026B29C59/002B29C35/0805B29K2995/0021B29L2031/3475B29C59/022B29C2059/023G02F1/133514G02B5/003G03F7/0007G02F2201/52G03F7/0002G02F1/133519
Inventor COK, RONALD, STEVEN
Owner EASTMAN KODAK CO
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