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31results about How to "Avoid volume increase" patented technology

Pattern matching method and apparatus

When the degree of matching between patterns decreases due to a pattern fluctuation or an appearance fluctuation that has occurred during manufacturing steps, a heavy work burden would be placed on an operator. A data processing unit of a pattern matching apparatus calculates a threshold for determination of matching between a first template image and a partial region of a search target image obtained by capturing an image of the surface of a sample, on the basis of a result of evaluation of a similarity between the search target image and a second template image, the second template image having been captured in a wider range than the first template image.
Owner:HITACHI HIGH-TECH CORP

Content distribution method and relay apparatus

A relay apparatus 30 issues a new sub-address at a timing when mobile phones (10a, 10b) requested content from a CP server apparatuses (20a, 20b), that is, at a timing when a sub-address is required. The content specified by this sub-address is distributed from the CP server apparatuses via the relay apparatus (30) to the mobile phones. In system of the present invention it is possible to utilize the same sub-address many times for different content items. It is therefore possible to avoid increasing the number of digits of the sub-address as well as the complexity of the sub-address structure, in a case where the types of content or the number of content items increases.
Owner:NTT DOCOMO INC

Fluid pump, cooling system and electrical appliance

A fluid pump for circulating the cooling liquid to cool the heat-generating part is disclosed. The fluid pump includes a case including a pump chamber for storing a liquid, a suction port and a discharge port provided on the case so as to communicate with the pump chamber, an impeller having pump vanes and rotatably placed in the pump chamber, which suctions a liquid into the pump chamber via the suction port and discharges the liquid out of the pump chamber via the discharge port by rotation, a motor for driving the impeller, installed in the case and having a stator and a rotor to which the impeller is integrally attached for rotating together, a reserve tank for storing spare liquid located and formed in the case but outside the pump chamber, a fluid path forming member arranged inside the reserve tank, including a discharge path communicating between the discharge port and the pump chamber, and a communication hole formed in the fluid path forming member so as to communicate between the discharge path and inside of the reserve tank.
Owner:KK TOSHIBA

Semiconductor device, method of manufacturing the same, and phase shift mask

A main wall part is provided so as to surround an integrated circuit part. A sub-wall part which is in “L” shape is provided between each corner of the main wall part and the integrated circuit part. Therefore, even if the stress is concentrated due to heat treatment or the like, the stress is dispersed to the main wall part and the sub-wall part, and hence peeling between layers and a crack are unlikely to occur, as compared with the conventional art. Further, even if the crack and the like occur at the corner, moisture from the outside hardly reaches the integrated circuit part when the main wall part and the sub-wall part are coupled to each other. For this reason, it is possible to ensure an extremely high moisture resistance.
Owner:FUJITSU SEMICON LTD

CORROSION RESISTANT CuZn ALLOY

The present invention provides a corrosion-resistant CuZn alloy, the alloy having a Zn content of from 15 to 55% by mass, the balance being Cu and inevitable impurities, wherein a total content of Zn and Cu is 99.995% by mass or more, and wherein a number of pores is 1 / cm2 or less based on optical microscopic observation.
Owner:JX NIPPON MINING& METALS CORP

Silicon-on-insulator (SOI) structures with step-type buried oxide layers

The invention provides two types of silicon-on-insulator (SOI) structures with step-type buried oxide layers. The first type of SOI structure comprises a P-type semiconductor substrate, a gate insulation layer formed above a P-type channel, a grid electrode formed above the gate insulation layer and a side wall which covers the grid electrode and the side edge of the gate insulation layer, wherein an N-type source region, an N-type drain region, the step-type buried oxide layers positioned in the N-type source region and the N-type drain region and below the P-type channel are formed on the semiconductor substrate; the thicknesses of the buried oxide layers positioned in the N-type source region and the N-type drain region are respectively greater than that of the buried oxide layer positioned below the P-type channel; and a P-type element heavily doped region is arranged in the P-type semiconductor substrate below the corresponding thinner buried oxide layer below the side wall adjacent to one side of the N-type drain region. Different from the first type of SOI structure, the second type of SOI structure is characterized in that the top of the substrate is provided with the N-type doped region, and the source region and the drain region are P-type. By utilizing the technical scheme of the invention, the short channel effect of the existing SOI structures can be solved.
Owner:SHANGHAI HUAHONG GRACE SEMICON MFG CORP

Manufacturing method for silicon-on-insulator (SOI) structure provided with stepped oxidization buried layer

The invention provides two methods for forming a silicon-on-insulator (SOI) structure provided with a stepped oxidization buried layer. The first method comprises the following steps of: providing a first region and a third region used for forming a source region and a drain region respectively, and a P-type semiconductor substrate of a second region on which a grid electrode, a grid electrode insulating layer and a hard mask layer are formed, wherein a BOX layer is arranged in the substrate, and a P-type element heavily-doped region corresponding the drain region is formed below the BOX layer; forming a side wall for covering the hard mask layer, the grid electrode and the grid electrode insulating layer; forming an N-type source region and an N-type drain region; performing oxygen ion implantation on the substrate positioned below the BOX layer corresponding to the source region and the drain region except the side wall; and performing high-temperature annealing to form an oxygen ion implantation region and the BOX layer into a stepped oxidization layer. The other method comprises the following steps of: forming an N-type doped region on the top layer of the substrate; and forming the source region and the drain layer in the doped region. Due to the adoption of the technical scheme provided by the invention, the short-channel effect of an existing SIO structure can be avoided.
Owner:SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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