336results about "Small component housings" patented technology

A handheld computing device that includes an enclosure having structural walls formed from a glass material that can be radio-transparent. The enclosure can be formed from a hollow glass tube or two glass members bonded together. A laser frit bonding process may be used to hermetically seal the two glass members together to create a water resistant electronic device.

A light emitting device includes a base body forming a recess defined by a bottom surface and a side wall thereof, a conductive member whose upper surface being exposed in the recess and whose lower surface forming an outer surface, a protruding portion disposed in the recess, a light emitting element mounted in the recess and electrically connected to the conductive member, and a sealing member disposed in the recess to cover the light emitting element. The base body has a bottom portion and a side wall portion integrally formed of a resin, an inner surface of the side wall portion is the side wall defining the recess and has a curved portion, and the protruding portion is disposed in close vicinity to the curved surface. With this arrangement, a thin and small-sized light emitting device excellent in light extraction efficiency and reliability can be obtained.

A multi-purpose product packaging (100, 200) for an electronic host product (250) having its own casing can include an apparatus casing (110, 210) for removably and substantially encasing the electronic host product, circuitry (240) within the apparatus casing for providing at least one function to the electronic host product, and an interface (255) on the apparatus casing for enabling the at least one function to operate in conjunction with the electronic product. The apparatus casing can be made of recyclable products and the interface can form a portion of the circuitry within the apparatus casing. In one embodiment, the electronic host device can be a phone and the circuitry can provide any number of functions including the function of charging a power source within the phone.

A chip card holder includes a housing, a receiving frame, an ejecting member, a tray, a protective cover, and two sliders. The housing defines a through hole and two latching grooves. The receiving frame is mounted on the housing. The ejecting member is positioned at one end of the receiving frame. The tray is slidably received in the receiving frame and abutted by the ejecting member. The protective cover is mounted to the tray and received in the through hole. The two sliders are slidably positioned on the protective cover and releasbly received in the latching grooves. When the two sliders slide relative to the protective cover and are unlocked from the housing, the ejecting member ejects the tray from the housing.

A manufacturing method of a packaging structure of electronic components includes the steps of: providing a substrate including a plurality of electronic components; covering the electronic components disposed on the substrate with a molding body; forming a plurality of pre-cut grooves on the molding body so as to define a plurality of molding units on the molding body; forming an electromagnet barrier layer covering the molding units on the molding units and the pre-cut grooves; and cutting along at least one of the pre-cut grooves deeply down to break the substrate so as to form separately a plurality of packaging structures of the electronic components.

A circuit module pertaining to an embodiment of the present invention has a board, multiple electronic components, a shield member, sealing layer, and cover layer. The board has a mounting surface that includes a first area and second area in which the multiple electronic components are mounted. The shield member is constituted by conductive material and placed between the first area and second area on the mounting surface. The sealing layer has on its top surface a groove having its bottom face including an upper end face of the shield member, is formed on the mounting surface, and is constituted by an insulator that covers the multiple electronic components. The cover layer is constituted by conductive material and has a first cover part that fills the groove as well as a second cover part that covers the first cover part and sealing layer.

A solid state power controller (SSPC) includes a support structure, and a first solid state power switch die arranged relative to the support structure, the solid state power switch die including a solid state power switch having an input terminal for connecting to a power source and an output terminal for providing power to an electrical component. A first gate driver is electrically coupled to the first solid state power switch die, and a control module is operatively coupled to the first gate driver. A hermetic enclosure surrounds at least the first solid state power switch die.

A chip package structure with a shielding cover includes a substrate, a chip, a pair of first passive components, a pair of second passive components, and a shielding cover. The chip, the pair of first passive components, the pair of second passive components, and the shielding cover are disposed on the substrate. The chip is electrically connected to the substrate. The shielding cover covers the chip and has leads connected to the substrate. The leads include a first lead and a second lead. The first lead connected to a portion of the substrate is located between the pair of first passive components and arranged along a first axis with the pair of first passive components. The second lead connected to a portion of the substrate is located between the pair of second passive components and arranged along a second axis with the pair of second passive components.

A package embodying the invention includes a base plate for receiving an electronic device having input/output points to be connected to an external system. Side walls mounted on the base plate enclose the electronic device. Selected side walls have a plurality of hermetically sealed openings through which are passed conductive leads which extend from within the package to outside the package for connecting the electronic device to the external system. A ceramic insert is mounted on the inside of at least one of the side walls. The ceramic insert has a first set of holes (terminals) for the direct contacting and connection thereto of selected conductive leads. The ceramic insert also has a second set of terminals whose layout is customized for optimally connecting selected ones of the second set of terminals to selected input/output points of the electronic device. The ceramic insert also includes a custom designed conductive pattern interconnecting selected ones of the first and second set of terminals.

A device housing package includes a base body (1) including, at its upper surface, a placement portion (1a) of a semiconductor device (9); a frame body (2) disposed on the base body (1) surrounding the placement portion (1a), including a notch (2b) formed by cutting a side wall thereof; an input-output terminal (3) attached to the notch (2b), including a wiring conductor layer (3a) electrically connected to the semiconductor device (9); and a sealing ring (5) disposed on an upper portion of the frame body (2). Moreover, side walls of the frame body (2) have, when seen in a plan view, an outer corner (2c) of adjacent side walls having a curved surface, the outer corner (2c) lying within a region overlapping the sealing ring (5) as seen in a plan view.

Injection molding encapsulation processes for packaging an object or objects in microcellular foamed material, comprising the steps of providing a mold having a mold cavity, positioning at least one object in the mold cavity, providing a packaging material, introducing a fluid into the packaging material under conditions sufficient to produce a supercritical fluid-packaging material solution, introducing the solution into the mold cavity, and converting the solution into a microcellular foamed material. Such processes are advantageously employed in encapsulation of electronic or electrical components. Packaged objects produced therefrom may be completely or partially encapsulated.

A power module with multiple equalized parallel power paths supporting multiple parallel bare die power devices constructed with low inductance equalized current paths for even current sharing and clean switching events. Wide low profile power contacts provide low inductance, short current paths, and large conductor cross section area provides for massive current carrying. An internal gate & source kelvin interconnection substrate is provided with individual ballast resistors and simple bolted construction. Gate drive connectors are provided on either left or right size of the module. The module is configurable as half bridge, full bridge, common source, and common drain topologies.

The chip part of the present invention includes a substrate, an electrode on the substrate and having a front surface in which a plurality of recessed portions are formed toward the thickness direction thereof, and an element region having a circuit element that is electrically connected to the electrode.

An electronic component has a casing having a resin injecting section having at least one wall. At least one circuit board is housed in the casing, next to the resin injecting section via the wall. At least one lead terminal is provided in the casing. The lead terminal has a first end and a second end, and a middle section connected between the first and second ends. The first end of the lead terminal is connected to the circuit board in a way that the middle section of the lead terminal is provided as straddling the wall of the resin injecting section. Also provided is at least one lead wire having a third end and a fourth end. The third end of the lead wire is connected to the second end of the lead terminal in the resin injecting section. The fourth end of the lead wire is pulled out from the casing. The third end of the lead wire and the second end of the lead terminal connected to each other are embedded in resin injected in the resin injecting section whereas the middle section of the lead terminal straddling the wall of the resin injecting section is not embedded in the resin. Instead of straddling the wall of the resin injecting section, the middle section of the lead terminal may be inserted into an opening provided on the wall and connected to the circuit board.

Disclosed is a wireless wearable electronic device having an antenna that communicatively couples the wearable electronic device to another wearable electronic device and to a remote, portable device. The antenna is generally shaped like a loop or ring, has a bow with respect to the plane of the loop or ring and operates in conjunction with the ground planes of the printed circuit boards in proximity to the antenna to form a principal omni-directional lobe about the ear of the user and a secondary lobe downwardly directed from the head of the user to communicate with the remote device.

Integrated internal power supply with a power inlet connector arranged to protrude through a housing of an end-use equipment, and having internal circuitry potted in a thermally conducting material. A vent path is provided so that a component such as a large capacity electrolytic capacitor can vent surplus fluid, e.g. electrolyte and/or gas. The power supply has a standardized ‘footprint’ and may be mounted directly onto a circuit board in the end-use equipment. The supply is preferably assembled by mounting a board holder on an internal circuit board, mounting a clip on the power inlet connector, mounting the internal circuit board in a case, plugging a vent hole in the internal circuit board, filling the case with potting compound, baking the power supply, preferably at 100° C. for 10 minutes, and then unplugging the vent hole.