87results about "Electrographic patterning" patented technology

This invention relates generally to uses of novel nanomaterial composition and the systems in which they are used, and more particularly to nanomaterial compositions generally comprising carbon and a metal, which composition can be exposed to pulsed emissions to react, activate, combine, or sinter the nanomaterial composition. The nanomaterial compositions can alternatively be utilized at ambient temperature or under other means to cause such reaction, activation, combination, or sintering to occur.

A process for producing a flexible substrate comprising of a film, an insulating resin layer, and a wiring pattern, said process comprising the steps of: (a) preparing a sheet member comprising, (i) the film, (ii) the insulating resin layer formed on each of a front face of said film and a rear face of said film which face is opposite to said front face, and (iii) a front-sided wiring pattern embedded in said insulating resin layer formed on said front face of said film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on said rear face of said film; and (b) pressing a part of at least one of said front-sided wiring pattern and said rear-sided wiring pattern into the inside of said sheet member so that a part of said front-sided wiring pattern and a part of said rear-sided wiring pattern are jointed to each other to form a junction.

A method of forming electrical devices can include electrophotographically printing a particulate material on a device substrate, and the particulate material can form at least a portion of the electrical device. An optional intermediate transfer member can also be used to improve reliability and performance of the process. Dry or liquid electrophotographic methods can be effectively used to form electronic devices on a wide variety of substrates not conventionally available in device fabrication.

As means for solving a problem of a positional shift of a land and a hole which is caused by an alignment in the formation of an etching resist layer and a plated resist layer in a method of manufacturing a circuit board, there are provided a method of manufacturing a circuit board including the steps of forming a first resin layer on a surface of an insulating substrate having a conductive layer on the surface and an internal wall of a through hole or / and a non-through hole, forming a second resin layer which is insoluble or slightly soluble in a developing solution for the first resin layer on the first resin layer provided on the surface conductive layer, and removing the first resin layer provided over the hole with the developing solution for the first resin layer, and a method of manufacturing a circuit board including the step of uniformly charging a surface of the first resin layer to induce a potential difference to the first resin layer provided over the hole and the first resin layer provided on the surface conductive layer before forming the second resin layer. Moreover, there is provided a circuit board having a hole with a small positional shift and high precision.

A method of forming electrical devices can include electrophotographically printing a particulate material on a device substrate, and the particulate material can form at least a portion of the electrical device. An optional intermediate transfer member can also be used to improve reliability and performance of the process. Dry or liquid electrophotographic methods can be effectively used to form electronic devices on a wide variety of substrates not conventionally available in device fabrication.

A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern embedded in the second insulating resin layer. A surface of the front-sided wiring pattern is flush with a surface of the first insulating resin layer, and a surface of the rear-sided wiring pattern is flush with a surface of the second insulating resin layer. A part of at least one of the front-sided wiring pattern and the rear-sided wiring pattern is dented toward a part of the other of the at least one of the front-sided wiring pattern and the rear-sided wiring pattern such that a portion of the front-sided wiring pattern and a portion of the rear-sided wiring pattern are jointed to each other to form a junction.

A conductive underlayer is formed in an electrophotographic manner using a toner comprising toner particles containing a binder resin containing a green thermosetting resin and conductive particles having an average particle diameter of 0.05 μm to 1 μm, wherein 50% by volume particle diameter of the toner is in a range 4 μm to 12 μm and the ratio of the toner with a size of 4 μm or smaller is 20% by number or less, or a toner including external additives containing hydrophobic-treated small size metal oxide particles having a BET specific surface area of 150 m2 / g to 400 m2 / g and large size metal oxide particles having a BET specific surface area of 10 m2 / g to 70 m2 / g and then a conductive layer is formed thereon by plating.

An apparatus, a method, a planar insulating substrate and a chipset have been presented, comprising at least one module configured to establish a predefined pattern on a planar insulating substrate so that conductive particles can gather according to the predefined pattern. At least one another module is configured to transfer the conductive particles to the planar insulating substrate, wherein the conductive particles are arranged to gather according to the predefined pattern. A sintering module is configured to fuse the conductive particles on the planar insulating substrate, wherein the conductive particles are arranged to fuse according to the predefined pattern to establish a conductive plane on the planar insulating substrate. Embodiment of the invention relate to printable or printing electronics on a fibrous web.

A pattern forming apparatus includes a depressed plate holding patterns by developers, a charging device for charging the depressed plate, a developing device for developing a red pattern, a developing device for developing a green pattern, a developing device for developing a blue pattern, and a stage for holding the charging device and the developing devices and moving them relative to the depressed plate. The charging device, the red developing device, the green developing device and the blue developing device pass along the depressed plate sequentially to perform the charging process, the red developing process, the green developing process and the blue developing process simultaneously.

The present invention provides an article of manufacture using an electrophotographic printer to produce printed electronic circuits by printing a second conductive powder layer and a first thermoplastic layer in registration. The second conductive powder layer is permanently fixed to the first layer before removing conductive powder from portions of the substrate other than that coated with the thermoplastic patterned image.

The present invention discloses an apparatus, a method, a flat insulating substrate and a chip set, comprising at least one module configured to form a predetermined pattern on the flat insulating substrate, so that conductive particles can be aggregated according to the predetermined pattern . At least one other module is configured to transfer conductive particles to a flat insulating substrate, wherein the conductive particles are arranged to aggregate according to a predetermined pattern. The sintering module is configured to melt the conductive particles on the flat insulating substrate, wherein the conductive particles are arranged to melt according to a predetermined pattern to form a conductive plane on the flat insulating substrate. Embodiments of the present invention relate to printable or printable electronic devices on fiberboards.

An image forming apparatus comprises an exposure unit forming an electrostatic latent image on a photoconductor based on image information, a developing unit developing the electrostatic latent image by toner made of formation material of a circuitry layer, and an electrostatic transferring unit transferring a toner image on the photoconductor onto a substrate. The toner image is transferred so as to cover at least a part of a conductor layer formed on the substrate. At this time, excessive charges caused in the conductor layer accompanying the start of the transfer of the toner image are removed. Alternatively, charges of which polarity is reverse to that of the toner are added to the conductor layer. These allow the circuitry layer to be formed to have a desired pattern favorably and securely on the conductor layer.