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Polishing agent for synthetic quartz glass substrate

a technology of synthetic quartz glass and polishing agent, which is applied in the direction of lapping machines, chemical processes, aqueous dispersions, etc., can solve the problems of generating defects up to 0.5 m in size, reducing the yield of manufacture, and reducing the size of features

Inactive Publication Date: 2010-09-30
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0021]In the manufacture of synthetic quartz glass such as synthetic quartz glass substrates for forming photomasks to be used in the photolithography that is important in the manufacture of IC or the like, according to the invention, the formation of defects on the surface of synthetic quartz glass substrates which are detectable by the high-sensitivity defect inspector is inhibited, an increase in the yield of manufacture of semiconductor devices or the like is expectable, and a further reduction of feature size in the semiconductor industry is achievable.
[0022]Also, for photomask-forming synthetic quartz glass substrates with end faces having a certain thickness used in display-related materials, the invention inhibits the formation of defects during polishing and improves the yield of manufacture.

Problems solved by technology

This leads to a delay in the substrate quality improving approach.
While JP-A S64-40267 (Patent Document 3) describes a process of polishing a glass substrate with colloidal silica to produce a precise mirror finish surface, this was found unsatisfactory as the microscopic defect controlling process because an analysis of surface defects by said high-sensitivity defect inspector demonstrated the presence of microscopic raised / recessed defects.
However, when synthetic quartz glass substrates are polished in the above-described concentration range, numerous defects with a size of up to 0.5 μm are generated.
It is then undesirable as the polishing slurry for photomask-forming glass substrates.
In fact, it is impossible to use such colloidal silica in the neutral range in a consistent manner because even those high purity products having minimal contents of metals and other impurities tend to gel or thicken or change the particle size distribution of abrasive grains with iteration of polishing.
Accordingly, such a process has a serious issue that recycling of the polishing slurry for repeated use is difficult, and inevitably the polishing slurry has to be utilized as a one-way stream, which is unfavorable in economical and environmental aspects.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0064]A silica synthetic quartz glass substrate stock as sliced (6 inches) was lapped, after which rough-polishing and final precision polishing were carried out by a double-side polisher. A soft suede-type polishing pad was used and a polishing slurry was used comprising a colloidal silica water dispersion having a SiO2 concentration of 40% by mass (Fujimi Inc., primary particle size 78 nm) to which 0.5% by mass of sodium polyacrylate (weight average molecular weight 250,000-700,000, Wako Pure Chemical Industries Ltd.) was added and diethanolamine was added to adjust to pH 10.0. Polishing was done under a load of 100 gf while the polishing allowance was an amount sufficient to remove the flaws introduced in the rough-polishing step (at least about 1 μm).

[0065]The polishing was followed by cleaning and drying, after which defect inspection was carried out using a laser conforcal optical system high-sensitivity defect inspector (Lasertec Corp.). The number of defects with a size of a...

example 2

[0066]Defect inspection was done as in Example 1 except that sodium polymaleate (weight average molecular weight 1,000, Toa Gosei Co., Ltd.) was used instead of the sodium polyacrylate in Example 1. The number of defects was 7.1 on the average.

example 3

[0067]Defect inspection was done as in Example 1 except that an acrylic acid / maleic acid copolymer (weight average molecular weight 60,000, Nippon Shokubai Co., Ltd.) was used instead of the sodium polyacrylate in Example 1. The number of defects was 4.4 on the average.

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Abstract

Disclosed is a polishing agent for synthetic quartz glass substrates, which is characterized by containing a colloidal solution of a colloidal silica or the like having a colloid concentration of 20-50% by mass, and a polycarboxylic acid polymer, an acidic amino acid, a phenol or a glycosaminoglycan.

Description

TECHNICAL FIELD[0001]This invention relates to a polishing slurry for use with synthetic quartz glass substrates for main use in semiconductor-related electronic materials, nano-imprint-related materials, and display-related materials, especially synthetic quartz glass substrates for use in the advanced semiconductor-related electronic materials and liquid crystal-related materials.BACKGROUND ART[0002]Qualities of synthetic quartz glass substrates include the size and density of defects on substrates, flatness, surface roughness, photochemical stability of material, and surface chemical stability. Of these, the quality relating to defects on substrates encounters increasingly rigorous requirements in accordance with the trend of IC technology toward finer feature size processing and of display panels toward larger size.[0003]While improvements in the defective quality of synthetic quartz glass substrates have been continuously made, the substrates used so far in the semiconductor te...

Claims

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Application Information

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IPC IPC(8): C09K13/02C09K13/00B24B37/00
CPCB24B37/00C03C19/00C09K13/02C03C15/02C09G1/02B24B1/00B24B37/0056C09G1/04C09K3/1454C09K3/1463C09K13/06
Inventor HARADA, DAIJITSUTAKEUCHI, MASAKISHIBANO, YUKIOUEDA, SHUHEIWATABE, ATSUSHI
Owner SHIN ETSU CHEM IND CO LTD
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