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Epoxy adhesive for OLED frame encapsulation and preparation method of epoxy adhesive

A technology of epoxy glue and adhesive, which is applied in the direction of adhesive, epoxy resin glue, adhesive type, etc., can solve the problems of curing agent residue, volatile matter residue, high curing temperature, etc., and achieve less curing agent residue, volatile The effect of less residue and low curing temperature

Inactive Publication Date: 2018-09-18
SHENZHEN FISHER NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The technical problem to be solved by the present invention is to overcome the problems of traditional single-component epoxy adhesives such as curing agent residue, volatile matter residue, high curing temperature, high energy consumption and low efficiency, and propose an epoxy adhesive for OLED frame packaging and its preparation method, the adhesive is cured by light first and then heated, and its performance characteristics are: viscosity: 100-150Pa.s; UV curing conditions: ≤4J / cm 2 (main wavelength 365nm); heat curing: 80℃*60min; water permeability: 2 *24h(60℃ / 90%RH); shear strength≥15MPa; water boiling resistance≥8h; Cl≤900ppm, Br≤900ppm, and Cl+Br≤1500ppm

Method used

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  • Epoxy adhesive for OLED frame encapsulation and preparation method of epoxy adhesive

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preparation example Construction

[0055] The present invention further proposes a preparation method for preparing the above-mentioned epoxy adhesive for OLED frame encapsulation, which comprises the following steps:

[0056] Step 1: Weighing according to parts by weight: 50-80 parts of epoxy resin; 5-10 parts of epoxy thinner; 5-10 parts of toughening agent; 20-40 parts of filler; 1-5 parts of photoinitiator; 0.1-1 parts of oxygen agent; 0.3-3 parts of auxiliary agent;

[0057] Step 2: Add epoxy resin, epoxy diluent, toughener, photoinitiator, antioxidant, and additives into the container, use a high-speed disperser to stir and disperse evenly, then add filler while stirring, and then disperse at a high speed Stir for 2-3 hours until the mixture is even;

[0058] Step 3: Use a three-roll mill to grind the evenly stirred glue solution on three rolls, and grind it twice until the fineness of the filler is uniform.

[0059] The properties of the above-mentioned epoxy adhesive for OLED frame packaging are: visc...

preparation Embodiment 1

[0061] Weigh the following components:

[0062] Epoxy resin: 50g (alicyclic epoxy resin of brand UVR-6110),

[0063] Epoxy diluent: 5g (oxetane of brand CURALITE OX),

[0064] Toughening agent: 5g (polyol of grade CAPA4101),

[0065] Filler: 20g (19g of talc powder of grade HTP1, 1g of meteorological silica of grade H20)

[0066] Photoinitiator: 3g (brand Uyracure-261 aryl ferrocene salt initiator),

[0067] Antioxidant: 0.1g (antioxidant of brand antioxidant 1076),

[0068] Auxiliary: 0.3g (0.1g of defoamer of brand BYK067A; 0.1g of dispersant of brand BYK9076, 0.1g of coupling agent of brand KBM-403).

[0069] According to the above preparation method, add materials, mix, stir and disperse, and three-roll grinding, until it is uniform, then degassing and subpackaging to obtain the product.

preparation Embodiment 2

[0071] Weigh the following components:

[0072] Epoxy resin: 60g (brand TTA182 cycloaliphatic epoxy resin),

[0073] Epoxy diluent: 6g (3g of oxetane of brand CURALITE OX; 3g of aliphatic glycidyl ether of brand JD-350),

[0074] Toughening agent: 6g (brand JA-782 polyol),

[0075] Filler: 30g (28g of talc powder of grade HTP2, 2g of meteorological silica of grade AEROSIL R792)

[0076] Photoinitiator: 2g (onium salt initiator of brand Uyracure-250),

[0077] Antioxidant: 0.5g (the brand is the antioxidant of antioxidant CA),

[0078] Auxiliary: 1.5g (0.5g of defoamer of brand BYK141; 0.5g of dispersant of brand BYK2155, 0.5g of coupling agent of brand KBM-503).

[0079] According to the above preparation method, add materials, mix, stir and disperse, and three-roll grinding, until it is uniform, then degassing and subpackaging to obtain the product.

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Abstract

The invention discloses an epoxy adhesive for OLED frame encapsulation and a preparation method of the epoxy adhesive. The epoxy adhesive is prepared from the following components in parts by weight:50-80 parts of epoxy resin, 5-10 parts of epoxy diluents, 5-10 parts of flexibilizer, 20-40 parts of filler, 1-5 parts of photoinitiator, 0.1-1 part of antioxidant and 0.3-3 parts of additive. The epoxy resin is one or a mixture of more of cycloaliphatic epoxy resin and bisphenol F epoxy resin. The epoxy diluent is one or a mixture of more of oxetane and aliphatic glycidyl ether. The photoinitiator is a cationic photoinitiator which comprises an iron-arene photoinitiator and a hexafluorophosphate photoinitiator. The epoxy adhesive adopts a curing way that ultraviolet exposure and heating are conducted in sequence, has the advantages of less curing agent residue, less volatile component residue, low curing temperature, strong bonding force, boiling resistance, water vapor resistance, oxygenbarrier performance and the like, and reaches the halogen-free standard.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to an epoxy adhesive for OLED frame packaging. Background technique [0002] With the rapid development of the electronics and information industries, OLED (organic light-emitting diode, organic light-emitting diode) display unique features such as fast response, wide-screen viewing angle, etc. It is widely used in electronic products such as mobile phones, car stereos and televisions. [0003] The new OLED-based flexible organic light-emitting display technology (Flexible OLED, FOLED) has a screen that can be bent or even folded. This technology also enables the rapid development of OLED display technology and has become a cutting-edge technology in the electronic information industry. [0004] OLED displays use organic light-emitting materials, do not require a backlight source, and actively emit light. However, because organic light-emitting materials have very hig...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08
CPCC08K2003/2241C08K2003/265C08L2203/206C09J11/04C09J11/06C09J11/08C09J163/00C08K13/02C08K5/053C08K3/34C08K3/36C08K5/1345C08L9/00C08K3/26C08L9/02C08K3/22
Inventor 戚仁宏
Owner SHENZHEN FISHER NEW MATERIALS CO LTD
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