Spiral-body-enhanced metal-based or polymer-based composite and preparation method

Abstract

The invention provides a spiral-body-enhanced metal-based or polymer-based composite and a preparation method. The composite is formed by distributing an array formed by a plurality of spiral enhancing bodies in a metal matrix and combining the surface-modified spiral enhancing bodies with the metal matrix in a metallurgical manner. The metal matrix is made of frequently-used electronic packaging metal materials such as Al, Cu and Ag. The spiral enhancing bodies are formed by depositing diamond on a spiral-body-shaped substrate through a chemical vapor deposition method to obtain lining supporting diamond spiral bodies, and graphene or carbon nanotubes grow in the direction perpendicular to the surface to obtain a spiral diamond heat conductor structure with a vertical-array graphene wall or a carbon nanotube forest on the surface. The high-heat-conductivity composite is obtained by distributing the spiral enhancing bodies in the metal matrix to form an array and adding enhancing particles to further improve the heat conductivity. The composite can be used as electronic packaging, heat sink materials and the like, and the packaging problems of high-temperature, high-frequency and high-power electronic devices are solved.

Description

Technical field: [0001] The invention discloses a spiral reinforced metal matrix or polymer composite material and a preparation method thereof, belonging to the technical field of composite material preparation. Background technique: [0002] Thermal management materials are materials used to dissipate heat generated by electronic components or systems in a timely manner to ensure system stability and reliability, mainly including electronic packaging materials and heat sink materials. Electronic packaging materials are materials with high thermal conductivity, low thermal expansion coefficient, good mechanical support, physical protection, electrical connection, heat dissipation and moisture resistance, external field shielding, size transition and stable component parameters. It is the sealing body of integrated circuits . With the rapid development of electronic information technology, electronic instruments are rapidly developing in the direction of high performance, l...

AI Technical Summary

Problems solved by technology

Almost most of the existing research results are focused on diamond particle reinforced metal matrix composites, but the obtained thermal conductivity is far from expected

In 2004, O. Beffort and others used the traditional pressure infiltration method to prepare diamond particle reinforced aluminum matrix composites, but the thermal conductivity of the composites was only 130W / (m K)

[0004] Patent application number 201510660439.1 discloses a helical wire reinforced metal matrix composite heat sink material and its preparation method. However, this kind of composite material has the following disadvantages: (1) The amount of reinforcement phase prepared on the linear surface is low, and the contact with the metal matrix is ​​linear. Contact, the contact area is small, and the thermal conductivity is limited; (2) The linear reinforcement has low strength, and the helical reinforcement is easy to break during high-pressure forming (such as high-pressure infiltration) with the metal

[0005] Theoretically, the thermal conductivity of the diamond / metal matrix composite should be between the diamond and the metal matrix, which will greatly improve the thermal conductivity of the composite; but in practice, the thermal conductivity of diamond / aluminum is often less than 300W / (m· K), while the thermal conductivity of diamond / copper composites is often less than 400W / (m K)

This is because the wettability of diamond, aluminum, and copper is extremely poor, and the loose combination of the two phases will cause many structural defects and voids, resulting in a large thermal resistance at the interface of the composite material.

At the same time, according to the heat conduction theory, the diamond particle reinforced copper matrix composite material belongs to the series heat conduction mode, there is a binder phase between the grains, and a large number of interfaces brings additional interface thermal resistance, which leads to unsatisfactory thermal conductivity.

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