Radiating packaging structure and manufacturing method thereof

Abstract

A heat dispersion encapsulation structure and its method are provided, which is characterized in that: place and connect a semiconductor wafer to a wafer bearing component; position a heat dispersion component with a interference face layer on its surface on the semiconductor wafer, so as to form a complete encapsulation glue body that wraps the semiconductor wafer and the heat dispersion component; then, cut the wafer bearing component and the encapsulation glue body according to the preset dimension of the encapsulation structure and form a bevel at the top brim of the encapsulation glue body, so as to partially expose the brim of the heat dispersion component; then, remove the encapsulation glue body on the interference face layer and form the encapsulation glue body that covers the interference face layer by keeping a spacing elevation between the encapsulation glue body and the top face of the interference face layer. Meanwhile, because the cutting path of the cutting operation does not pass the heat dispersion component, the invention is able to prevent the problem of flash and wearing of cutter due to the direct cutting of the heat dispersion component by the cutter, thus reducing the cutting cost.

Description

technical field [0001] The invention relates to a heat dissipation packaging structure and a manufacturing method thereof, in particular to a semiconductor packaging structure with heat dissipation parts and a manufacturing method thereof. Background technique [0002] With the demand for thinner, thinner and smaller electronic products, semiconductor packages integrating semiconductor chips with high-density electronic components and electronic circuits have gradually become the mainstream of packaging products. However, since the semiconductor package generates high heat during operation, if the heat of the semiconductor chip is not released immediately, the accumulated heat will seriously affect the electrical function and product stability of the semiconductor chip. On the other hand, in order to prevent the internal circuit of the package from being polluted by external water and dust, the surface of the semiconductor chip must be covered with an encapsulant to insulate...

AI Technical Summary

Problems solved by technology

[0007] However, in the aforementioned semiconductor package manufacturing method, during the cutting step, because the cutting tool continues to cut through the heat sink, and because the heat sink is generally made of metal materials such as copper and aluminum, when cutting with a diamond cutting knife , will cause the peripheral material of the heat sink to produce uneven sharp-edged edges (or burrs) due to pulling, which will affect the appearance of the package, and will also cause too much loss of the cutting tool, resulting in a significant increase in cost, and the production efficiency cannot be greatly improved.

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