Diamond multi-wire electric spark discharge cutting method and diamond multi-wire electric spark discharge cutting wire cutting device

A cutting device and spark discharge technology, which is applied in the field of diamond cutting, can solve the problems of micro-cracks on the surface of semiconductor silicon wafer processing, difficulty in improving the processing technology level, and single function, so as to improve processing quality and material surface performance, and increase material removal rate , the effect of reducing scratches

Pending Publication Date: 2019-12-20
QINGDAO GAOCE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Although the existing diamond multi-wire electric discharge cutting method and wire cutting device are simple in structure and easy to operate, they have a single function, and the single processing method leads to low efficiency in actual use, and it is easy to cause microscopic appearance on the processed surface of semiconductor silicon wafers. Therefore, we propose a diamond multi-wire electric discharge cutting method and a wire cutting device

Method used

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  • Diamond multi-wire electric spark discharge cutting method and diamond multi-wire electric spark discharge cutting wire cutting device
  • Diamond multi-wire electric spark discharge cutting method and diamond multi-wire electric spark discharge cutting wire cutting device
  • Diamond multi-wire electric spark discharge cutting method and diamond multi-wire electric spark discharge cutting wire cutting device

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Embodiment 1

[0033] The invention proposes a diamond multi-wire cutting composite electric discharge wire cutting process method. The principle of diamond wire EDM multi-wire cutting is as follows: figure 1As shown, the middle side of the main body 14 of the cutting device is provided with a No. 1 cutting roller 1, a side of the No. 1 cutting roller 1 is provided with a No. 2 cutting roller 10, and the front end of the No. 1 cutting roller 1 is provided with a No. 1 driving spindle 7. The front end of No. 2 cutting roller 10 is provided with No. 2 driving main shaft 8, the rear end outer surface of No. 1 cutting roller 1 is provided with No. 1 driven main shaft 4, and the rear end outer surface of No. 2 cutting roller 10 is provided with No. 2 driven main shaft. 6. The outer surface of the upper middle part of the main body 14 of the cutting device is provided with a P-type silicon rod 2. On the basis of the diamond wire multi-wire cutting machine, the silicon material and the diamond wire...

Embodiment 2

[0035] Such as image 3 As shown, the diamond wire is initially wound on the take-up and take-up wheel, then wound to the two processing rollers through the wire arranging wheel, the tension wheel and the guide wheel, and finally wound to the take-up and unwinding On the wire wheel, the diamond wire reciprocates, and the cutting wire network formed between the processing roller and the processing roller cuts the silicon material into silicon wafers by grinding.

Embodiment 3

[0037] Such as Figure 4 As shown, the instantaneous high temperature generated by the pulsed spark discharge between the reciprocating molybdenum wire or the single-wire moving copper wire and the workpiece is used to realize the brittle cracking and erosion of the silicon material caused by local gas flow, melting or thermal stress to achieve the purpose of processing. The electrode wire starts from the wire drum and winds back to the wire drum through the guide wheel, guide wheel and guide wheel. The negative electrode of the pulse power supply is connected to the electrode wire, and the positive electrode of the pulse power supply is connected to the silicon material. The electrode wire moves in one direction (copper wire) or reciprocating (molybdenum wire). The silicon material cutting is realized by using the electric discharge between the electrode wire and the silicon material.

[0038] The present invention is a combination of diamond multi-wire cutting and electric d...

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Abstract

The invention discloses a diamond multi-wire electric spark discharge cutting wire cutting device. The diamond multi-wire electric spark discharge cutting wire cutting device comprises a cutting device body. A first cutting roller is arranged on one side of the middle of the cutting device body, and a second cutting roller is arranged on one side of the first cutting roller. A first driving spindle is arranged at the front end of the first cutting roller, and a second driving spindle is arranged at the front end of the second cutting roller. A first driven spindle is arranged on the outer surface of the rear end of the first cutting roller. According to the diamond multi-wire electric spark discharge cutting wire cutting device, a fixing abrasive diamond wire saw and electric spark wire cutting are combined, then the diamond wire saw and electric spark combined machining is generated, the machining efficiency of diamond multi-wire cutting photovoltaic silicon wafers is further improved, and the machining cost is reduced. In order to solve the machining quality problems of micro cracks on the machined surfaces of diamond wire multi-wire cutting machining semiconductor silicon wafersand the like, the electric spark discharge machining is added on the basis of diamond wire multi-wire cutting so as to achieve the improvement of the quality of the machined surfaces.

Description

technical field [0001] The invention relates to the technical field of diamond cutting, in particular to a diamond multi-wire electric spark discharge cutting method and a wire cutting device. Background technique [0002] Diamond is commonly known as "diamond", which is what we often call the original body of diamond. It is a mineral composed of carbon element, which is an allotrope of carbon element. Diamond is the hardest substance that exists naturally in nature. Diamond has a wide range of uses, such as: handicrafts, cutting tools in industry. Graphite can form artificial diamond under high temperature and high pressure, and it is also a precious gemstone. Due to the highest hardness, diamond cutting and processing must be carried out with diamond powder or laser (such as 532nm or 1064nm wavelength laser). The density of diamond is 3.52g / cm. The refractive index is 2.417 (under 500 nm light wave), and the dispersion rate is 0.044. [0003] In the actual use process, t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04B28D5/00
CPCB28D5/045B28D5/0058
Inventor 仇健葛任鹏
Owner QINGDAO GAOCE TECH CO LTD
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