33results about How to "Shorting of contact" patented technology

An optoelectronic device with a Group III Nitride active layer is disclosed that comprises a silicon carbide substrate; an optoelectronic diode with a Group III nitride active layer; a buffer structure selected from the group consisting of gallium nitride and indium gallium nitride between the silicon carbide substrate and the optoelectronic diode; and a stress-absorbing structure comprising a plurality of predetermined stress-relieving areas within the crystal structure of the buffer structure, so that stress-induced cracking that occurs in the buffer structure occurs at predetermined areas rather than elsewhere in the buffer structure.

A local interconnection wiring structure method for forming the same reduces the likelihood of a short between a local interconnection layer of gate electrodes and an active region by forming a common aperture so as to have a determined aperture between the local interconnection layer and the active region on an insulation film of a semiconductor substrate. Methods of forming the local interconnection wire can include forming a first etching mask pattern that has a size longer than a length between inner ends of adjacent gate electrodes formed on a semiconductor substrate and covered with an insulation film. The etching mask simultaneously has a length the same as or shorter than the length between outer ends of the gate electrodes. The insulation film exposed in the first etching mask pattern is subsequently etched so that the insulation film remains higher than a highest height of the gate electrodes, so as to form a recess pattern. The first etching mask pattern is then removed and a second etching mask pattern is formed so as to partially expose the insulation film provided within the recess pattern. The insulation film within the recess pattern is etched to form apertures for exposing a partial surface of the gate electrodes. The second etching mask pattern is then removed. The recess pattern and the apertures are then filled with conductive material to form a local interconnection layer for connecting between the gate electrodes.

The protective circuit module includes a substrate, electronic components mounted on the substrate for constituting a protective circuit, a molding formed on the substrate to enclose the electronic components, and terminal plates connected to appropriate portions of the substrate for connecting the protective circuit to a rechargeable battery. The molding includes a cover surface oriented opposite to the substrate and projections integrally formed on the cover surface to project therefrom.

A wire-bonding method and a semiconductor package using the same are provided. The semiconductor package includes a carrier; a chip mounted on the carrier; a plurality of first wires and second wires alternatively arranged in a stagger manner, with a wire loop of each second wire being downwardly bent to form a deformed portion so as to provide a height different between the wire loops of each first wire and each second wire, wherein the first and second wires electrically connect the chip to the carrier; and an encapsulant for encapsulating the chip, the first wires, the second wires and a portion of the carrier. The height difference between the wire loops of each first wire and each second wire increases a pitch between adjacent first and second wires thereby preventing the wires from contact and short circuit with each other due to wire sweep during an encapsulation process.

The protective circuit module includes a substrate, electronic components mounted on the substrate for constituting a protective circuit, a molding formed on the substrate to enclose the electronic components, and terminal plates connected to appropriate portions of the substrate for connecting the protective circuit to a rechargeable battery. The molding includes a cover surface oriented opposite to the substrate and projections integrally formed on the cover surface to project therefrom.

An ink-jet head has a flexible printed circuit and a head main body, and further has a reinforcement that is located between drive-signal terminals arranged adjacent to one another and a constant-potential-signal terminal. The drive-signal terminals and the constant-potential-signal terminal are formed on a terminal-formed face of an energy applier included in the head main body. The flexible printed circuit has an electrode-formed face on which a constant-potential-signal electrode to be bonded to the constant-potential-signal terminal with a metal bond and drive-signal electrodes to be bonded to the drive-signal terminals with a metal bond. The reinforcement is in contact with and interposed between the terminal-formed face and the electrode-formed face so that the terminal-formed face and the electrode-formed face are spaced apart from each other.

The present invention relates to an electro-rheological fluid comprising particles of at least one inorganic or organic material suspended in a polar liquid crystalline medium, the use of such electro-rheological fluid in an haptic device, an haptic device itself, a method of the production of such haptic device and the use of such haptic device in electro-optical devices.