118 results about "Thermodynamic state" patented technology

The invention discloses a fully-electric ultra-high speed injection molding PVT (Pressure Volume Temperature) online measurement and control method. By using a melt metered through plasticization in a cylinder as an object, a thermodynamic state (P0, T0, V0) of a highly-compressed melt before injection as a control starting point and the thermodynamic state (P1, T1, V1) of the melt in the cylinder after injection molding as a control ending point, through online detection of a PVT relation characteristic of a polymer in an ultra-high speed injection molding process, by depending on a high-pressure control system and a high-response executing mechanism of a fully-electric ultra-high speed injection molding machine and using the PVT relation characteristic of the ultra-high speed injection molded polymer as the guidance, precision control of ultra-high speed injection molding is realized. The fully-electric ultra-high speed injection molding PVT online measurement and control method has the advantages of high control precision and high cost performance.

The invention discloses a thermodynamic diagram processing method and device. The method includes acquiring thermodynamic diagram data of a webpage, wherein the thermodynamic diagram at least comprises browse data of the webpage; acquiring a preset time interval; determining the polymerization granularity of the polymerization conducted on the thermodynamic diagram data; forming the thermodynamic diagram data sequence according to the polymerization granularity and the thermodynamic diagram data; sequentially generating a plurality of thermodynamic diagrams according to the time interval and the thermodynamic data sequence, wherein the plurality of thermodynamic diagrams form a dynamic thermodynamic diagram. By means of the method and device, the problem in the prior art that the static thermodynamic diagram can be generated only according to the thermodynamic diagram presentation period, and the change conditions of access data in various time intervals of one period cannot be reflected visually is solved.

The invention relates to a measuring system for measuring a density of a medium flowing in a process line, said medium being variable regarding its thermodynamic state, especially at least being proportionally compressible, along an imaginary axis of flow of the measuring system. The measuring system comprises at least one temperature sensor that is located in a temperature measuring point and that primarily reacts to a local temperature, theta, of a medium flowing past, said temperature sensor supplying at least one temperature measurement signal that is influenced by the local temperature of the medium to be measured, at least one pressure sensor that is located in a pressure measuring point and that primarily reacts to a local, especially static, pressure, p, of a medium flowing past, said pressure sensor supplying at least one pressure measurement signal that is influenced by the local pressure, p, in the medium to be measured, and at least one electronic measuring unit that at least temporarily communicates with at least the temperature sensor and the pressure sensor. The electronic measuring unit generates a provisional density value, using the temperature measurement signal and at least the pressure measurement signal, said density value representing a density which the flowing medium only apparently has in a virtual density measuring point that is especially interspaced from the pressure measuring point and / or the temperature measuring point along the axis of flow at a defined distance. The electronic measuring unit further generates at least temporarily at least one especially digital density value, which is different from the provisional density value, using the provisional density value and at least one correctional density value that depends on a flow speed of the medium and on the local temperature prevailing in the temperature measuring point, said correctional value being determined during operation time.

The invention relates to a method and device for Ball Array of the soldered ball in BGA Ball Grid Array Package technology, which belongs to technical field of electronic packing. The invention is to inject the inert gases into the crucible and the vacuum gas tight chamber and makes the crucible and the vacuum gas tight chamber achieve the stable differential pressure by pressure control system, and makes the metal melt ejected from a tiny nozzle of the crucible in the form of laminar jet. The vibration generated from piezoelectric oscillator perturbates the metal jet and makes it fractured into the even liquid drop, and then obtains the real-time size parameters aided by the monitoring system and computer analysis to feedback control the frequency of the oscillator and reduce the difference in size between the generated molten drop and the preset molten drop. The invention can correctly place the even solder ball in the appropriate thermodynamic state on the substrate preconfigured with the positions of the solder ball, which has the advantages of short process flow, good quality of product and greatly lowering the equipment investment.