72 results about "Liquid meniscus" patented technology

A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parallel to the first surface. The system and method of moving the meniscus can also be used to move the meniscus along an edge of a substrate.

A modular capillary pump loop (CPL) cooling system and associated components. The modular CPL cooling system transfers heat from high-power circuit components, such as microprocessors disposed within computer chassis, to other locations within or external to the chassis, where the heat can be more easily removed. In various embodiments, the CPL cooling system includes one or more evaporators connected to one or more condensers via flexible liquid transport and vapor transport lines. A wicking structure, such as a volume of sintered copper, is disposed within each condenser. The wicking structure draws working fluid (e.g., water) in a liquid state into the evaporator based on a capillary mechanism and a pressure differential across a meniscus/vapor interface on an upper surface of the wicking structure. As the liquid meniscus is evaporated, additional fluid is drawn into the evaporator. The working fluid is then condensed back into a liquid in the condenser.

An image forming apparatus includes a recording head, a head driving control circuit, and a dummy ejection control circuit. The dummy ejection control circuit controls a first dummy ejection operation to eject droplets to a non-image-forming area per a constant length of a continuous medium and second dummy ejection operation to eject droplets not contributing to image formation to an image forming area. The head driving control circuit applies a first non-ejection pulse to pressure generators corresponding to a non-ejection nozzle of the plurality of nozzles to vibrate a meniscus of liquid in the non-ejection nozzle without ejecting liquid droplets, and applies a second non-ejection pulse, which vibrates the meniscus of liquid greater than the first non-ejection pulse, to pressure generators corresponding to non-ejection nozzles of the plurality of nozzles to vibrate a meniscus of liquid in the non-image-forming area.

A system and method for planarizing and controlling non-uniformity on a patterned semiconductor substrate includes receiving a patterned semiconductor substrate. The patterned semiconductor substrate having a conductive interconnect material filling multiple features in the pattern. The conductive interconnect material having an overburden portion. A bulk of the overburden portion is removed and a remaining portion of the overburden portion has a non-uniformity. The non-uniformity is mapped, optimal solution determined and a dynamic liquid meniscus etch process recipe is developed to correct the non-uniformity. A dynamic liquid meniscus etch process, using the dynamic liquid meniscus etch process recipe, is applied to correct the non-uniformity to substantially planarize the remaining portion of the overburden portion.

The invention discloses a heat pipe liquid absorbing core capillary flow measuring method and device based on infrared image observation. The measuring method includes the steps that one end of a liquid absorbing core is fixed through a liquid absorbing core fixing assembly, the liquid absorbing core is moved through a moving and adjusting assembly, the other end of the liquid absorbing core is immersed in a liquid working medium, the flowing process of the liquid meniscus in the liquid absorbing core is accurately monitored through a glass cover hole by the adoption of a thermal infrared imager, and a monitoring record is processed to quantitatively obtain the capillary flow distance and flow speed. By using the characteristic that display effects of infrared images are different due to the emissivity difference of the liquid working medium, a metal matrix of the liquid absorbing core and a porous medium, defects of a traditional capillary flow measuring method are overcome, the heat pipe liquid absorbing core capillary flow measuring method is particularly suitable for quantitatively and accurately monitoring the capillary flow of the colorless clear liquid in the heat pipe liquid absorbing core, experimental devices are simple, measurement accuracy is high, a reliable means is provided for testing and estimating capillary performance of the heat pipe liquid absorbing core, and the expansion of the infrared thermography from a traditional thermal measurement field to the capillary flow application field is achieved.

The invention discloses a device and method for measuring an internal contact angle of a high-temperature and high-pressure capillary tube. The device comprises a steel body, the capillary tube and a second fluid injecting pump, wherein the steel body is provided with a through hole, and observation windows are sealed at two ends of the through hole respectively; one end of the capillary tube is arranged in the through hole of the steel body in a penetrating manner, and the other end of the capillary tube is connected with a first fluid injecting pump through a first fluid injecting pipeline; the second fluid injecting pump is connected with a second fluid injecting pipeline, and the second fluid injecting pipeline extends into the through hole of the steel body. According to the device and method for measuring the internal contact angle of the high-temperature and high-pressure capillary tube, various gases can be measured, capillary tubes with different internal diameters can be freely replaced, and the purpose of measuring the contact angle of a gas-liquid meniscus surface under the oil deposit condition is realized.

In a liquid ejection apparatus, having: a liquid ejection head having, a nozzle plate having a nozzle to eject liquid, a cavity to reserve liquid ejected form a ejection hole of the nozzle, a pressure generating device to form a meniscus of the liquid, and a ejecting voltage applying device to apply a ejection voltage to the liquid in the nozzle; a operation control device to control application a drive voltage to drive the pressure generating device and application of the ejection voltage by the ejection voltage applying device; and a counter electrode opposite to the liquid ejection head; wherein in the liquid ejection device in which the liquid is ejected by a static electric attraction force generated between the liquid in the nozzle to which a voltage is applied by the ejection voltage applying device and the counter electrode, and by a pressure generated in the nozzle, the pressure generating device to form the liquid meniscus forms the meniscus having a height of equal to or more than 1.3 times a radius of the nozzle on the ejection hole of the nozzle.

A method of forming a dynamic liquid meniscus includes forming a meniscus at a first size, the meniscus being formed between a proximity head and a first surface and changing the meniscus to a second size by modulating a flow through at least one of a set of ports on the proximity head. A system for modulating flow through the ports in a proximity head is also described.

Apparatus, methods and systems for physically confining a liquid medium applied over a semiconductor wafer include a first and a second chemical head that are disposed to cover at least a portion of a top and an underside surface of the semiconductor wafer. Each of the first and the second chemical heads include an angled inlet conduit at a leading edge of the respective chemical heads to deliver liquid chemistry into a pocket of meniscus in a single phase. The pocket of meniscus is defined over the portion of the top and underside surface of the semiconductor wafer covered by the chemical heads and is configured to receive and contain the liquid chemistry applied to the surface of the semiconductor wafer as a meniscus. A step is formed at a leading edge of the first and second chemical heads along an outer periphery of the pocket of meniscus to substantially confine the meniscus of the liquid chemistry within the pocket of meniscus. The step covers at least a portion of the pocket of meniscus and the step's height is sufficient to preserve confinement characteristic of the meniscus. An inner return conduit is defined within the pocket of meniscus at a trailing edge of the respective chemical heads and is used to remove the liquid chemistry from the surface of the semiconductor wafer in a single phase after the cleaning process.

A device and method for holding a substrate, e.g., a semiconductor wafer, during a process, e.g., a liquid meniscus process, the substrate having a first side and a second side. The device includes one or more holding components, e.g., fingers, configured to contact a second side of the substrate without significantly contacting the first side of the substrate. At least one of the holding components may be configured to be moved during the process so as to prevent the at least one holding components from effecting the process, e.g., contacting the liquid meniscus. Such an arrangement may be employed when the substrate includes a top side having at least one structure or feature thereon, it being desirable that the holding components avoid contact with the structures or features during the process.

A lithography system and a lithography method is provided for increasing reliability and efficiency of immersion lithography. By varying a scan speed between a wafer and an optical component depending on at least one process parameter during exposure of the wafer, loosening of a fluid meniscus during the relative movement of the optical component and the wafer is avoided.

A method for cleaning the surface of a semiconductor wafer is disclosed. A first cleaning solution is applied to the wafer surface to remove contaminants on the wafer surface. The first cleaning solution is removed with some of the contaminants on the wafer surface. Next, an oxidizer solution is applied to the wafer surface. The oxidizer solution forms an oxidized layer on remaining contaminants. The oxidizer solution is removed and then a second cleaning solution is applied to the wafer surface. The second cleaning solution is removed from the wafer surface. The cleaning solution is configured to substantially remove the oxidized layer along with the remaining contaminants.

This invention discloses methods and apparatus for providing a variable aperture insert into a lens. A liquid crystal layer may be used to provide a variable aperture function and in some examples. In other examples, electrochromic, photochromic, liquid meniscus or electroactive elastomeric devices may form a light blocking element of a variable aperture insert. In some examples, an ophthalmic lens is cast-molded from a silicone hydrogel including a variable aperture insert.