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Method and apparatus for manufacturing electronic assemblies, electronic assemblies manufactured by the method or in the apparatus

A technology of equipment and electronic components, which is applied in the manufacture of electronic assembly and equipment. The use of this or in the field of electronic assembly manufactured in this equipment can solve the problem of expensive construction of RFID semiconductor components, and achieve the effect of increasing production and reducing costs.

Inactive Publication Date: 2011-12-07
MUEHLBAUEHR AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the production of RFID semiconductor components requires anisotropic conductive films and additional metal foils, the construction of RFID semiconductor components is undoubtedly expensive

Method used

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  • Method and apparatus for manufacturing electronic assemblies, electronic assemblies manufactured by the method or in the apparatus
  • Method and apparatus for manufacturing electronic assemblies, electronic assemblies manufactured by the method or in the apparatus
  • Method and apparatus for manufacturing electronic assemblies, electronic assemblies manufactured by the method or in the apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0096] Shown in the figure is an example of a process chain of the above-mentioned method (variation method), in particular also for roller-to-roll processing of flexible substrates to flexible carriers (substrates) filled with small electronic components.

[0097] exist Figure 1 to Figure 3 In the method flow shown in, in order to produce semiconductor element 1 (see image 3 ), the chip 2 is placed contactlessly as an electronic component on a carrier substrate 3 , here in the form of a flexible film substrate 4 .

[0098] Will Figure 1 to Figure 3 split into upper side view Figure 5 and the plan view shown under this upper side view Image 6 , and proceed from left to right in the direction of arrow 7.

[0099] figure 1 It is a square fingerprint (footprint) area 8 formed on the film substrate 4 , and the area shape of the fingerprint area is adapted to the area shape of the chip 2 . Chip 2 is an electrical or electronic component part.

[0100] The surface 9 of t...

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PUM

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Abstract

A method of producing an electronic module with at least one electronic component and one carrier. A structure is provided on the carrier so that the electronic component can take a desired target position relative to the structure. The structure is coated with a liquid meniscus suitable for receiving the electronic component. Multiple electronic components are provided at a delivery point for the electronic components. The carrier, with the structure, is moved nearby and opposite to the delivery point, where the delivery point delivers one of the electronic components without contact, while the structure on the carrier is moving near the delivery point, so that after a phase of free movement the electronic component at least partly touches the material, and the carrier, with the structure, is moved to a downstream processing point, while the electronic component aligns itself to the structure on the liquid meniscus.

Description

technical field [0001] A method for producing an electronic module is presented here. In the method, electronic components are placed on a carrier substrate. The carrier substrate may be flexible. A device for producing electronic modules is also proposed here. Finally, an electronic module is also described with a carrier substrate, for example made of a flexible foil substrate, around which electronic components are folded or arranged, and electronic components A foldable region on or from the carrier substrate. Background technique [0002] Currently, gripping and placing robots that work mechanically grip smaller electronic components such as active and passive devices such as resistors, capacitors, power semiconductors ( Transistors, thyristors, triacs), light-emitting devices (LEDs) and other semiconductor chips, and on a suitable wiring carrier, in multi-dimensional space (vertical, lateral, angular position, etc.) Positioned to produce electronic modules. The s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60G06K19/077H01L21/98
CPCH01L2924/01006H01L24/32H01L2224/81801H01L2924/01082H01L2224/27013H01L2924/01046H01L2224/7565H01L2224/92H01L2924/01027H01L24/90H01L2924/01005H01L2924/01065H01L2924/01033H01L25/50H01L2224/81143H01L2924/01047H01L2924/01019H01L2924/01013H01L2224/83192H01L2924/14H01L2924/014H01L2224/83051H01L24/29H01L2924/19043H01L2224/2919H01L2924/19041H01L2924/01029H01L24/75H01L2224/83143H01L2924/07811H01L24/83H01L2224/838H01L2924/0665H01L33/62H01L2224/83002H01L2924/12042H01L2924/1301H01L2924/13033Y10T29/53174Y10T29/53178Y10T29/53265Y10T29/53539Y10T156/10Y10T156/1744H01L2224/27H01L2224/83H01L2924/00G06K19/077H01L21/70
Inventor 迈克尔·马克思·穆勒荷尔弗里德·扎贝尔汉斯·皮得·孟瑟
Owner MUEHLBAUEHR AG
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