Heat shield resistant to extreme high temperature and strong impact and manufacturing method thereof

Abstract

The invention discloses a heat insulation protection device for protecting special electronic products from extreme high-temperature environments (such as ground fire, explosion or airplane crash) and strong impact. The heat insulation protection device generally mainly comprises an outer shell, an outer cavity heat insulation layer, an inner shell and an inner cavity heat insulation layer. Some small equipment or structural bodies only comprise two parts, namely an outer shell and an outer cavity heat insulation layer. The outer shell is made of titanium alloy or special steel which is high in specific strength, high in compression resistance and penetration resistance and high in melting point. The outer cavity heat insulation layer is a powder material integrally formed through high-pressure mold pressing, the material has a shape-stabilized phase change material with low thermal conductivity and a high-temperature phase change characteristic, and the main components of the material comprise an inorganic particle material, a phase change shape-stabilized material, an endothermic oxide, inorganic fibers and a mixed resin adhesive. The inner cavity shell is made of titanium alloy, stainless steel or refractory fiber materials with high modulus and high heat capacity. The material of the inner cavity heat insulation layer does not need compression molding, and the components can be the same as those of the outer cavity heat insulation layer or other phase change materials.

Description

technical field [0001] The invention belongs to the field of thermal management, and in particular relates to a heat shield capable of withstanding high heat flux fire and strong impact, and capable of maintaining safe storage and operation of internal storage devices or electrical products, and a manufacturing method thereof. Background technique [0002] Electronic products are heat-sensitive devices, and an increase in ambient temperature directly leads to an increase in device temperature. All electronic components have a certain temperature range for normal operation or storage. Once the temperature limit is exceeded, it will directly lead to its state change, damage, and even self-burning. Therefore, the thermal protection of electronic products is particularly important. [0003] The thermal protection for some high-power or heat-sensitive electronic products is extremely difficult even in the daily working environment, which has long plagued relevant experts and sch...

AI Technical Summary

Problems solved by technology

However, the disadvantages of this method are also obvious. First, the phase change point temperature of alcohol wax or fat wax-based phase change material is relatively low, and it is easy to flow, which will cause the phase change of the heating device in the daily working environment. And change the initial package state, resulting in difficulties in the daily maintenance and repair of heating devices; secondly, the phase change latent heat and heat capacity of alcohol wax or fat wax based phase change materials are not too high, and the endurance time under extreme high temperature conditions is relatively short , once the phase transition of all the materials occurs, the temperature of the materials rises very quickly

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