Novel heat-radiating molding composition for portable electronic product shell

Abstract

The invention discloses a novel heat-radiating molding composition for a portable electronic product shell. The novel heat-radiating molding composition comprises 34.5-87.5wt.% of polycarbonate or / and polyestercarbonate, 10-35wt.% of heat-conducting material, 2-30wt.% of impact modifier and at least 0.1% of additive. During processing, raw materials are mixed well at high speed, melt-extruded through a screw extruder and then granulated through a granulator, and generated granules are dried in an oven and then subjected to injection molding. The composition is exquisite in material use and scientific in preparation method; by adding heat-conducting glass fiber with a graphene coating or adding a little amount of carbon fiber into the heat-conducting glass fiber, the composition is enabled to be heat-conductive, high strength is maintained, and the composition is suitable for thin-wall products and economically feasible; by adding oxidants TPSIV and TPU, strength and tenacity of the composition are improved, the composition is enabled to be slight in touch feel and good in hand feel, and better client experience is brought about.

Description

technical field [0001] The invention belongs to the field of polymer materials, and in particular relates to a novel heat-dissipating molding composition used for casings of portable electronic products. Background technique [0002] In addition to changing our lives, portable electronic devices have also affected many industries, raising the quality and experience requirements for consumer devices. Portable electronic devices have brought new challenges to components in terms of miniaturization, rugged design, and aesthetics. The requirements of the small form factor have brought challenges to companies that are trying to assemble all components into smaller, thinner and smarter portable electronic devices. At the same time, there are safety hazards caused by heat generation during product use. Reduce customer comfort experience. [0003] Improving the performance of electronic product casing materials includes improving the heat dissipation performance of the material and...

AI Technical Summary

Problems solved by technology

[0002] In addition to changing our lives, portable electronic devices have also affected many industries, raising the quality and experience requirements for consumer devices. Portable electronic devices have brought new challenges to components in terms of miniaturization, rugged design, and aesthetics. The requirements of the small form factor have brought challenges to companies that are trying to assemble all components into smaller, thinner and smarter portable electronic devices. At the same time, there are safety hazards caused by heat generation during product use. Reduce customer comfort experience

[0003] Improving the performance of electronic product casing materials includes improving the heat dissipation performance of the material and improving the hand feel of the material. To improve the heat dissipation performance of the material, heat-conducting materials can be added to form a heat-conducting path. The commonly used heat-conducting filler, alumina, etc., has the characteristics of a large amount of addition. This will result in poor strength and cannot be made into thin-walled products; there are also pitch-based carbon fiber products used for heat conduction, which have better heat conduction effect, but the cost of carbon fiber is expensive, which makes it impossible to be widely used; the way to improve the material feel is generally in-process The way of using thermoplastic elastomer lagging or spraying elastomer paint on the outer layer needs to be improved