Water-resistant inorganic bonding agent

A technology of inorganic adhesives and deionized water, which is applied in the direction of inorganic adhesives, adhesives, and polymer adhesive additives. Problems such as low temperature, achieve significant modification effect, low cost, and reduce shrinkage

Inactive Publication Date: 2013-05-01
韩敏杰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the three composite methods have improved water resistance and mechanical properties to a certain extent, the composition, structure and properties of phosphate and silicate are different, and the composite is more difficult. In addition, due to the difference in linear expansion coefficient, it is easier to damage the glue at high temperature. layer, reduced strength
Phosphate-based inorganic adhesives are too brittle, and the heat-resistant temperature is not high (about 900°C), so they are not suitable for plane bonding; while silicate-based inorganic adhesives have the lowest cost, the simplest operation process, and the largest amount of industrial use, so they are suitable for silicate-based inorganic adhesives. The research on the modification of adhesives has very important social value and practical significance. Most silicate-based inorganic adhesives use water-soluble alkali metal silicates as adhesives. Although the plane bonding strength and heat resistance have been improved, but Water resistance is poor, so it cannot be used for bonding in high humidity environment

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] 1) Grind quartz sand and boron nitride into powder, pass through a 200-mesh sieve for later use;

[0047] 2) Weigh 20 parts by weight of acetone, then add 16 parts by weight of cellulose acetate into it, stir thoroughly for 15 minutes to make a cellulose acetate solution, and seal it for later use;

[0048] 3) Add 1 part by weight of dimethylolbutyric acid, 1 part by weight of dihydroxyphenylacetic acid and 5 parts by weight of N,N-dimethylformamide into a 250ml round bottom flask protected by dry nitrogen, and stir well For 10 minutes, add 3 parts by weight of 1,6-hexamethylene diisocyanate, 1 part by weight of diphenylmethane diisocyanate and 0.06 parts by weight of dibutyltin dilaurate, stir and react at 75-100°C for 60 minutes, and depressurize The solvent is removed by distillation to obtain a polyurethane prepolymer;

[0049] 4) Add the polyurethane prepolymer prepared in step 3) to an organic amine solution prepared by 4 parts by weight of triethanolamine and 25...

Embodiment 2

[0053] 1) Grind quartz sand and boron nitride into powder, pass through a 200-mesh sieve for later use;

[0054] 2) Weigh 25 parts by weight of acetone, then add 20 parts by weight of cellulose acetate, stir thoroughly for 30 minutes to make a cellulose acetate solution, and seal it for later use;

[0055] 3) Add 1 part by weight of dimethylolbutyric acid, 2 parts by weight of dihydroxyphenylacetic acid and 6 parts by weight of N,N-dimethylformamide into a 250ml round-bottomed flask protected by dry nitrogen, and stir well After 15 minutes, add 5 parts by weight of 1,6-hexamethylene diisocyanate, 2 parts by weight of diphenylmethane diisocyanate and 0.08 parts by weight of dibutyltin dilaurate, stir and react at 80°C for 100 minutes, and distill off under reduced pressure. Remove the solvent to obtain a polyurethane prepolymer;

[0056] 4) Add the polyurethane prepolymer prepared in step 3) to an organic amine solution prepared by 5 parts by weight of triethanolamine and 40 p...

Embodiment 3

[0060] 1) Grind quartz sand and boron nitride into powder, pass through a 200-mesh sieve for later use;

[0061] 2) Weigh 30 parts by weight of acetone, then add 24 parts by weight of cellulose acetate into it, stir thoroughly for 45 minutes to make a cellulose acetate solution, and seal it for later use;

[0062] 3) Add 2 parts by weight of dimethylolbutyric acid, 3 parts by weight of dihydroxyphenylacetic acid and 8 parts by weight of N,N-dimethylformamide into a 250ml round bottom flask protected by dry nitrogen, and stir well In 20 minutes, add 6 parts by weight of 1,6-hexamethylene diisocyanate, 3 parts by weight of diphenylmethane diisocyanate and 0.09 parts by weight of dibutyltin dilaurate, stir and react at 100°C for 180 minutes, and distill off under reduced pressure. Remove the solvent to obtain a polyurethane prepolymer;

[0063] 4) Add the polyurethane prepolymer prepared in step 3) to an organic amine solution prepared by 5 parts by weight of triethanolamine and...

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Abstract

The invention relates to a water-resistant inorganic bonding agent, which comprises the following components in parts by weight: 4-8 parts of quartz sand, 2-3 parts of boron nitride, 110-140 parts of 35-55 mass percent potassium silicate aqueous solution, 16-24 parts of cellulose acetate, 20-30 parts of acetone, 3-6 parts of 1,6-hexamethylene diisocyanate, 1-3 parts of diphenylmethane diisocyanate, 1-2 parts of dimethylolbutanoicacid, 1-3 parts of dihydroxyphenylacetic acid, 5-8 parts of N,N-dimethylfomamide, 0.06-0.09 part of dibutyltin dilaurate, 4-5 parts of trolamine, 0.8-1.3 parts of barium chloride, 5-9 parts of calaium strarate and 25-48 parts of deionized water. The water-resistant inorganic bonding agent disclosed by the invention has high flexibility, water resistance and strong bonding force, and is environment-friendly and nontoxic.

Description

technical field [0001] The invention relates to a water-resistant inorganic adhesive, in particular to a water-resistant inorganic adhesive with good flexibility, water resistance and strong adhesion. [0002] Background technique [0003] In the 1990s, my country's adhesive industry entered a new stage of rapid development. In the 21st century, from 2004 to 2009, the output of adhesives increased from 227,000 tons to 3.7928 million tons, with an average annual growth rate of more than 10%. The 10,000-ton mark. In recent years, with the development of my country's refractory materials, military industry, aviation and other industries, there is an urgent need for a large number of adhesives that can be used in high temperature environments. [0004] After decades of production experience summarization and systematic theoretical research, the emulsion polymerization production technology has developed maturely. In the field of high molecular polymer preparation, due to the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J1/02C09J11/04C09J11/08C08G18/76C08G18/73C08G18/32
Inventor 韩敏杰
Owner 韩敏杰
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