The invention belongs to the technical field of camera modules, and particularly relates to a manufacturing process of a periscopic
camera module shell, which at least comprises the following steps:
etching: placing a base material subjected to
coating,
exposure and development treatment in an
etching solution for
etching treatment to obtain a substrate with a light through hole, and forming a chamfer structure on the inner side edge of the light through hole; film plating: plating an absorbing film layer on the substrate by adopting a
plasma sputtering film plating process, and in the film plating process, shielding a non-film-plating region by using a jig, so that the absorbing film
layers are attached to the film plating region and the chamfering structure; bending is conducted, specifically,
stamping and bending operation is conducted on the coated substrate, and a shell frame is obtained; and the shell frame obtained in the third step is subjected to
laser welding, and the needed shell is obtained. Compared with the prior art,
light reflection of the light through hole can be reduced to the maximum extent under the dual effects of reducing the reflection area and reducing the
reflectivity, so that
stray light is inhibited, the thickness of the film layer is small and controllable, and the
image quality and definition of the camera are improved.