39results about How to "Improved Threshold Voltage Distribution" patented technology

Erase and program methods of a flash memory device including MLCs for increasing the program speed are described. In the erase method, MLCs are pre-programmed so that a voltage range in which threshold voltages of MLCs are distributed can be reduced. Therefore, a fail occurrence ratio can be reduced when erasing MLCs, the threshold voltage distribution of MLCs can be improved and an overall program time can be shortened in a subsequent program operation.

A method of reprogramming a nonvolatile memory device, comprising setting up bit lines of selected memory cells according to logic values of first and second latches of a page buffer connected to the bit lines, supplying a program pulse to the selected memory cells, performing a program verify operation on the selected memory cells using the first and second latches, and performing a predictive program operation on the selected memory cells according to a result of the program verify operation. In the predictive program operation, bit lines of the selected memory cells are setup according to a logic value of a third latch of the page buffer that corresponds to each of the selected memory cells.

Embodiments of the present invention enable threshold voltage distribution of a plurality of electrode layers to be improved by configuring each of the plurality of electrode layer maintains to have different physical structures or materials, etc., thereby enhancing credibility during a process of maintaining stores data and a reading process.

A method of reprogramming a nonvolatile memory device, comprising setting up bit lines of selected memory cells according to logic values of first and second latches of a page buffer connected to the bit lines, supplying a program pulse to the selected memory cells, performing a program verify operation on the selected memory cells using the first and second latches, and performing a predictive program operation on the selected memory cells according to a result of the program verify operation. In the predictive program operation, bit lines of the selected memory cells are setup according to a logic value of a third latch of the page buffer that corresponds to each of the selected memory cells.

Erase and program methods of a flash memory device including MLCs for increasing the program speed are described. In the erase method, MLCs are pre-programmed so that a voltage range in which threshold voltages of MLCs are distributed can be reduced. Therefore, a fail occurrence ratio can be reduced when erasing MLCs, the threshold voltage distribution of MLCs can be improved and an overall program time can be shortened in a subsequent program operation.

A semiconductor memory device and a method of operating the same perform a program loop, including a program operation and a program verification operation based on a sub-verification voltage smaller than a target verification voltage and the target verification voltage, to the memory cells until a threshold voltage of the memory cells is greater than the target verification voltage. A positive voltage, supplied to the bit line of the memory cell of which the threshold voltage is higher than the sub-verification voltage, is increased whenever the program operation is performed, and thus a threshold voltage distribution of the memory cells may be improved.

A semiconductor memory device includes a memory unit including a first memory block and a second memory block, a power supply unit suitable for applying a plurality of operating voltages to one of first global lines or second global lines, a switching circuit suitable for switching the first global lines and first internal global lines in response to a first control signal and switching the second global lines and second internal global lines in response to a second control signal, and a pass circuit suitable for electrically connecting the first internal global lines to word lines and selection lines of the first memory block and electrically connecting the second internal global lines to word lines and selection lines of the second memory block in response to a block selection signal.

In a non-volatile memory device and methods of forming and operating the same, one memory transistor includes sidewall selection gates covering both sidewalls of a floating gate when the floating gate and a control gate are stacked. The sidewall selection gates are in a spacer form. Since the sidewall selection gates are in a spacer form on the sidewall of the floating gate, the degree of integration of cells can be improved. Additionally, since the side wall selection gates are disposed on both sidewalls of the floating gate, a voltage applied from a bit line and a common source line can be controlled and thus conventional writing / erasing errors can be prevented. Therefore, distribution of threshold voltage can be improved.

The present invention relates to a semiconductor memory device and an operating method thereof. The semiconductor memory device may include at least two memory blocks sharing a row decoder, and a peripheral circuit performing a read operation on a selected memory block, between the at least two memory blocks, wherein the peripheral circuit applies a discharge voltage to an unselected memory block, between the at least two memory blocks, for a preset time after a period in which a read voltage is applied to the selected memory block is terminated.

The present invention relates to a semiconductor memory device and an operating method thereof. The semiconductor memory device may include at least two memory blocks sharing a row decoder, and a peripheral circuit performing a read operation on a selected memory block, between the at least two memory blocks, wherein the peripheral circuit applies a discharge voltage to an unselected memory block, between the at least two memory blocks, for a preset time after a period in which a read voltage is applied to the selected memory block is terminated.

A semiconductor memory device and a method of operating the same perform a program loop, including a program operation and a program verification operation based on a sub-verification voltage smaller than a target verification voltage and the target verification voltage, to the memory cells until a threshold voltage of the memory cells is greater than the target verification voltage. A positive voltage, supplied to the bit line of the memory cell of which the threshold voltage is higher than the sub-verification voltage, is increased whenever the program operation is performed, and thus a threshold voltage distribution of the memory cells may be improved.

A method of reprogramming a nonvolatile memory device, comprising setting up bit lines of selected memory cells according to logic values of first and second latches of a page buffer connected to the bit lines, supplying a program pulse to the selected memory cells, performing a program verify operation on the selected memory cells using the first and second latches, and performing a predictive program operation on the selected memory cells according to a result of the program verify operation. In the predictive program operation, bit lines of the selected memory cells are setup according to a logic value of a third latch of the page buffer that corresponds to each of the selected memory cells.

A semiconductor memory device and a method of operating the same are disclosed. The semiconductor memory device includes a memory cell array configured to include memory cells, a peripheral circuit configured to perform an erase operation and a soft program operation and a control circuit configured to control the peripheral circuit so that the memory cells are programmed though a hot carrier injection HCI method when the soft program operation is performed.

A soft program method in a non-volatile memory device for performing a soft program step so as to improve threshold voltage distribution of an erased cell is disclosed. The soft program method in a non-volatile memory device includes performing a soft program for increasing threshold voltages of memory cells by a given level, wherein an erase operation is performed about the memory cells, performing a verifying operation for verifying whether or not a cell programmed to a voltage more than a verifying voltage is existed in each of cell strings, and performing repeatedly the soft program untilit is verified that whole cell strings have one or more cell programmed to the voltage more than the verifying voltage.

A non-volatile memory device includes a first sensing line, a first word line, a depletion channel region, and impurity regions. The first sensing line and the first word line are formed adjacent to each other in parallel on a substrate. The first sensing line and the first word line have a tunnel oxide layer, a first conductive pattern, a dielectric layer pattern and a second conductive pattern sequentially stacked on the substrate. The depletion channel region is formed at an upper portion of the substrate under the first sensing line. The impurity regions are formed at upper portions of the substrate exposed by the first sensing line and the first word line.

A memory device and an operating method of the memory device is disclosed. The memory device includes a memory cell array including a plurality of memory blocks. The memory device further includes a peripheral circuit for performing an erase voltage application operation, a first erase verify operation, and a second erase verify operation on a selected memory block among the plurality of memory blocks. The memory device also includes a control logic for setting a start erase voltage of an erase operation, based on a result of the first erase verify operation, and controlling the peripheral circuit to perform the second erase verify operation when it is determined that the first erase verify operation on the selected memory block has been passed.

In a non-volatile memory device and methods of forming and operating the same, one memory transistor includes sidewall selection gates covering both sidewalls of a floating gate when the floating gate and a control gate are stacked. The sidewall selection gates are in a spacer form. Since the sidewall selection gates are in a spacer form on the sidewall of the floating gate, the degree of integration of cells can be improved. Additionally, since the side wall selection gates are disposed on both sidewalls of the floating gate, a voltage applied from a bit line and a common source line can be controlled and thus conventional writing / erasing errors can be prevented. Therefore, distribution of threshold voltage can be improved.

A method of operating a semiconductor memory device may include increasing threshold voltage of memory cells by performing an LSB program operation on the memory cells having first state, decreasing threshold voltage of memory cells to be programmed to second state of the memory cells to a level lower than a first level in unit of a memory cell for an MSB program operation, and increasing threshold voltage of memory cells to be programmed to third state of the memory cells to a level higher than a second level, which is higher than the first level, in unit of a memory cell for an MSB program operation.

A gate of a transistor includes a gate oxide layer formed on a semiconductor device, a first conductive layer pattern including polysilicon doped with boron and formed on the gate oxide layer, a diffusion preventing layer pattern including amorphous silicon formed by a chemical vapor deposition process using a reaction gas having trisilane (Si3H8) and formed on the first conductive layer pattern, and a second conductive layer pattern including metal silicide and formed on the diffusion preventing layer pattern. Since a gate of PMOS transistor includes a diffusion preventing layer having an excellent surface morphology, diffusion of impurities is sufficiently prevented. Thus, the threshold voltage of PMOS transistor may be reduced and threshold voltage distribution may be improved.

The invention discloses a method for improving the threshold voltage distribution of a device, comprising the following steps: the first step, core NMOS halo ion implantation and LDD ion implantation; the second step, I / O NMOS LDD ion implantation; the third step, LDD fast Thermal annealing, the temperature of the rapid thermal annealing is 950° C.; the fourth step, core PMOS halo ion implantation and LDD ion implantation; the fifth step, I / O PMOS LDD ion implantation. The method of the invention can greatly reduce the fluctuation of the NMOS threshold voltage with the length of the channel, thereby increasing the process window and improving the characteristics of the device. The invention is applicable to the NMOS device manufacturing process in the semiconductor manufacturing process.