32results about How to "Improve routability" patented technology

A method of fault tolerant operation of field programmable gate arrays (FPGAs), whether as an embedded portion of a system-on-chip or other application specific integrated circuit, utilizing incremental reconfiguration during normal on-line operation includes configuring an FPGA into a self-testing area and a working area. Within the self-testing area, programmable interconnect resources of the FPGA are tested for faults. Upon the detection of one or more faults within the interconnect resources, the faulty interconnect resources are identified and a determination is made whether utilization of the faulty interconnect resources is compatible with an intended operation of the FPGAs. If the faulty interconnect resources are compatible with the intended operation of the FPGA, utilization of the faulty interconnect resource is allowed to provide fault tolerant operation of the FPGA. If the faulty interconnect resources are not compatible with the intended operation of the FPGA, on the other hand, a multi-step reconfiguration process may be initiated which attempts to minimize the effects of each reconfiguration on the overall performance of the FPGA. In an alternate embodiment, the entire FPGA may be configured as one or more self-testing areas during off-line testing, such as manufacturing testing.

A high-frequency BGA device (500) with the chip (501) assembled by metal bumps (503) on an insulating substrate (502) with conductive vias (505) and metal traces (504). Chip bumps which serve the high frequency signal terminals are attached directly to the lands (510) on the vias in order to minimize parasitic electrical parameters such as inductance, resistance, and IR drops, thus achieving the required 0.1 nH inductance for each chip terminal. Chip bumps which serve the remaining chip terminals are attached to pads on certain substrate traces. In both cases, the bumps can be attached reliably because the lands on the vias and the pads on the traces are plated with additional metal layers (511, 512), which provide extra thickness as well as a metallurgically suitable surface.

A system is employed for modifying a hierarchical description of a design to reveal the data flow of the design. The modified design provides a more favorable input for block placement. In one embodiment, the modifications includes any one of or a combination of moving hard macros to a higher level of the hierarchical description of the design, flattening modules that are bigger than a threshold, and / or flattening star blocks. Up to three clustering strategies are employed as part of the flattening process, including name-based clustering, external connection based clustering and gate clustering.

Wirelength in a net of an integrated circuit design is reduced by forming clusters of sinks to be interconnected, inserting a buffer at each cluster, and providing branch connections between clusters by connecting a sink of one cluster to a buffer of another cluster, to create a buffer tree spanning all sinks. The buffers are inserted at a point on a respective bounding box of a cluster that is closest to a source for the net. A sink that provides a branch connection to the buffer of another cluster is the closest sink to that buffer (except for those sinks in the cluster). Clusters may be formed by examining different pairs of the sinks with different bounding boxes, and identifying one of the pairs whose bounding box has a lowest half-perimeter as the best pair for clustering.

An insulating sheet-like substrate (601), which has on one surface (601a) a first patterned metal layer (605) with a first (603a) and a second (603b) array of contact pads. The pads of the first array have a first pitch center-to-center, and each pad has a first perimeter. The pads of the second array have a second pitch center-to-center, and each pad has the first perimeter. The substrate has on its other surface (601b) a second patterned metal layer (606) with a third array (607) of contact pads, which has the first pitch center-to-center, and each pad has a third perimeter. Conductive vias (640) between the first and the second metal layers connect contact pads and have a fourth perimeter; the vias are placed in interstitial locations so that the fourth perimeter does not intersect with the first and third perimeters. Vias in interstitial locations can be provided by disposing the first array and the third array so that the first and third perimeters of respective contact pads are concentrically aligned.

A system is employed for modifying a hierarchical description of a design to reveal the data flow of the design. The modified design provides a more favorable input for block placement. In one embodiment, the modifications includes any one of or a combination of moving hard macros to a higher level of the hierarchical description of the design, flattening modules that are bigger than a threshold, and / or flattening star blocks. Up to three clustering strategies are employed as part of the flattening process, including name-based clustering, external connection based clustering and gate clustering.

An FPGA architecture has top, middle and low levels. The top level of the architecture is an array of the B16x16 tiles arranged in a rectangular array and enclosed by I / O blocks on the periphery. On each of the four sides of a B16x16 tile, and also associated with each of the I / O blocks is a freeway routing channel. A B16x16 tile in the middle level of hierarchy is a sixteen by sixteen array of B1 blocks. The routing resources in the middle level of hierarchy are expressway routing channels M1, M2, and M3 including groups of interconnect conductors. At the lowest level of the semi-hierarchical FPGA architecture, there are block connect (BC) routing channels, local mesh (LM) routing channels, and direct connect (DC) interconnect conductors to connect the logic elements to further routing resources. Within the B1 block, a horizontal BC routing channel is disposed between two upper and two lower clusters of devices, and a vertical BC routing channel is disposed between two clusters of devices on the left side of the B1 block and two clusters of devices on the right side of the B1 block. The BC routing channel forms intersections with the inputs and outputs of the devices in the clusters. The horizontal BC routing channel forms a first diagonally hardwired connection with a routing channel that effectively sends the horizontal BC routing channel in a vertical direction. A second diagonally hardwired connection pairwise shorts the horizontal and vertical BC routing channels to provide dual accessibility to the logic resources in the B1 block from more than one side. Disposed between the first diagonally hardwired connection and the second diagonally hardwired connection is a BC splitting extension which provides a programmable one-to-one coupling between the interconnect conductors of the horizontal BC routing channel on either side of the BC splitting extension.

An FPGA architecture has top, middle and low levels. The top level is an array of B16×16 tiles enclosed by I / O blocks. The routing resources in the middle level are expressway routing channels including interconnect conductors. At the lowest level, there are block connect routing channels, local mesh routing channels, and direct connect interconnect conductors to connect the logic elements to further routing resources. Each B1 block includes four clusters of devices. Each of the clusters includes first and second LUT3s, a LUT2, and a DFF. Each of the LUT3s have three inputs and one output. Each of the LUT2s have two inputs and one output. Each DFF has a data input and a data output. In each of the clusters the outputs of the LUT3s are multiplexed to the input of DFF, and symmetrized with the output of the DFF to form two outputs of each of the clusters.

An embedded capacitor structure in a circuit board and a method for fabricating the same are proposed. The circuit board is formed with a first circuit layer on at least one surface thereof, wherein the first circuit layer has at least one first electrode plate for the capacitor structure. Then, a dielectric layer is formed on the first circuit layer and made flush with the first circuit layer. The dielectric layer has a relatively low dielectric constant and good fluidity to effectively fill the spaces between patterned traces of the first circuit later. A capacitive material is deposited on the dielectric layer and the first circuit layer. Finally, a second circuit layer is formed on the capacitive material and has at least one second electrode plate corresponding to the first electrode plate, together with the capacitive material disposed in-between, to form the capacitor structure.

The present invention discloses a structured ASIC layout architecture, which includes a fixed body region and a programmable layout region. The fixed body region includes a tunnel wire or multiple tunnel wires for providing a function capability or multiple function capability. The programmable layout region is disposed on the fixed body region and is connected to the fixed body region, wherein the programmable layout region utilizes the tunnel wires of the fixed body region to propagate electrical signals.

The disclosed embodiments describe single-instruction processors that operates upon messages received from a network interface. A single-instruction processor comprises a register file, a functional unit, a bus connecting the register file and the functional unit, and a format decoder that receives messages from a network interface. This single-instruction processor supports a single instruction type (e.g., a “move instruction”) that specifies operands to be transferred via the bus. During operation, the format decoder is configured to write a parameter from a received message to the register file. A move instruction moves this parameter from the register file to the functional unit via the bus. The functional unit then uses the parameter to perform an operation.

A package structure and a method of fabricating the same are provided. The method includes forming a first wiring layer on a carrier board, forming a plurality of first conductors on the first wiring layer, encapsulating the first wiring layer and the first conductors with a first insulating layer, forming a second wiring layer on the first insulating layer, forming a plurality of second conductors on the second wiring layer, encapsulating the second wiring layer and the second conductors with a second insulating layer, and forming at least one opening in the second insulating layer. The at least one opening extends to a second surface of the first insulating layer, such that at least one electronic component can be disposed in the at least one opening. With forming two insulating layers first followed by forming the at least one opening, there is no need to stack or laminate the substrate that already has an opening, and the electronic component is free of displacement due to any compression. Therefore, a package structure thus fabricated has an increased yield rate.

A method and system for improving call routing in a PNNI network using crankback messaging. A destination logical group node (LGN) blocked crankback procedure is used by entry border nodes, in the event of a failed connection attempt, to instruct preceding routing capable nodes to route the connection over another link. If the entry border node is in the lowest level peer group a Succeeding End Blocked (SEB) crankback message is sent to the preceding routing-capable node. If the entry border node is not in the lowest level peer group, a destination LGN blocked crankback message is sent to the preceding routing-capable node wherein the message has special information to signal the routing node that the link into the destination LGN is blocked.

A logic block in a field programmable gate array comprises a plurality of clusters of logic devices. At least one of the logic devices in each of the clusters has an input or an output. A first set of interconnect conductors enters the logic block from a first side and forming a programmable intersection with the input or the output of at least one of the logic devices in each of the clusters. A second set of interconnect conductors enters the logic block from a second side and forming a programmable intersection with the input or output of one of the logic devices in each cluster, the first set of interconnect conductors forming a pairwise hardwired connection with the second set of interconnect conductors. An interconnect conductor splitting extension is disposed between the first set of interconnect conductors and the second set of interconnect conductors.

A semiconductor package and a fabrication method thereof are provided, in which a ground pad on a chip is electrically connected to a ground plane on a substrate by means of an electrically-conductive wall formed over a side surface of the chip and an electrically-conductive adhesive used for attaching the chip to the substrate. Therefore, a wire-bonding process is merely implemented for power pads and signal I / O (input / output) pads on the chip without having to form ground wires on the ground pads for electrical connection purposes. This benefit allows the use of a reduced number of bonding wires and simplifies wire arrangement or routability. And, a grounding path from the chip through the electrically-conductive wall and electrically-conductive adhesive to the substrate is shorter than the conventional one of using ground wires, thereby reducing a ground-bouncing effect and improving electrical performances of the semiconductor package.

A novel design and method of fabricating a semiconductor device. In a preferred embodiment, the present invention is a flip chip package including a BT substrate. On the side of the substrate facing the die, thin traces are formed of an enhanced conductive material. Conductive bumps such as eutectic solder balls are then mounted on the traces, and the die mounted to the bumps. The die then packaged and mounted to a printed circuit board using, for example, a ball grid array.

A mask-programmable logic device includes a macrocell having an external input / output port for “place-and-route” programming by addition of metallization layers. A programmable “fixed” layer allows the external input / output port to be isolated from the remainder of the macrocell so that it “floats,” allowing signals to be routed through the external input / output port when the macrocell is not in use, to reduce routing blockages. The macrocell also may have at least one internal input / output port, potentially connected to different logic circuits, and a programmable “fixed” layer that can be used to control which internal input / output port is connected to the external input / output port. By thus allowing multiple logic circuits to share a single external input / output port, routing blockages are reduced.

A computer implemented method, data processing system, and computer program product for reworking a plurality of cells initially placed in a circuit design. An expander allocates cells to tiles. The expander determines a high detailed routing cost tile class, wherein the high detailed routing cost tile class is a class of tiles that has high detailed routing costs. The expander selects a cell within a tile of the high detailed routing cost tile class to form a selected cell in a selected tile. The expander applies multiple techniques to reposition these cells at new locations to improve the detailed routability. The expander can place an expanded bounding box around the selected cell, wherein the bounding box extends to at least one tile adjacent the selected tile, and repositions the selected cell within the bounding box to form a modified design to improve the detailed routability. The expander may also inflate and legalize those cells.

A package structure and a method of fabricating the same are provided. The method includes forming a first wiring layer on a carrier board, forming a plurality of first conductors on the first wiring layer, encapsulating the first wiring layer and the first conductors with a first insulating layer, forming a second wiring layer on the first insulating layer, forming a plurality of second conductors on the second wiring layer, encapsulating the second wiring layer and the second conductors with a second insulating layer, and forming at least one opening in the second insulating layer. The at least one opening extends to a second surface of the first insulating layer, such that at least one electronic component can be disposed in the at least one opening. With forming two insulating layers first followed by forming the at least one opening, there is no need to stack or laminate the substrate that already has an opening, and the electronic component is free of displacement due to any compression. Therefore, a package structure thus fabricated has an increased yield rate.