The invention provides a die bonder. The die bonder comprises a rack, a support feeding
assembly, a support transferring
assembly, a
crystal ring feeding
assembly, a
crystal ring rotating assembly, a
crystal jacking assembly, a crystal ring transferring assembly, a suction
nozzle, a
wafer fixing swing arm assembly, a suction
nozzle receiving and feeding assembly and a material receiving assembly. A support can be supplied to the support transferring assembly through the support feeding assembly, a crystal ring on the crystal ring feeding assembly can be transferred to the crystal ring transferring assembly through the crystal ring transferring assembly, the used crystal ring on the crystal ring rotating assembly is removed, and a
wafer on the crystal ring can be ejected to a
wafer supply position through the wafer ejecting assembly. The wafer at the wafer supply position can be transferred to the support transferring assembly through the suction
nozzle and the wafer fixing swing arm assembly, and wafer fixing operation of the wafer and the support is completed. The synchronous operation of feeding and discharging of the crystal ring can be realized through the crystal ring transferring assembly, the
waiting time of feeding and discharging of the crystal ring is reduced, and the improvement of the
die bonding efficiency is facilitated. Moreover, the suction nozzle can be automatically replaced through the suction nozzle receiving and supplying assembly, time and labor are saved, and the efficiency is high.