LED chip unit and LED device, and manufacturing methods thereof
A technology for LED chips and LED devices, applied in electrical components, semiconductor devices, circuits, etc., can solve the problems of product quality and reliability decline, low LED chip bonding efficiency, etc., to improve the bonding efficiency, quality and reliability. performance, cost reduction
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[0048] In order to make the object, technical solution and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below through specific implementation manners in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0049]This embodiment provides a method for making an LED chip unit. The prepared LED chip unit consists of at least two Micro LED chips or Mini LED chips (it should be understood that it can also be an ordinary-sized LED chip or a large-sized LED chip. chip) composed of LED chip units, the LED chip unit obtained by the manufacturing method of the LED chip unit provided in this embodiment can make it possible to directly place multiple LED chip units at a time in the process of bonding LED chips The LED chip is transferred to the corresponding position on ...
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