A kind of LED solid crystal dispensing system and method

Abstract

The invention discloses an LED (Light Emitting Diode) die bonding and dispensing system and method. The LED die bonding and dispensing system comprises a carrier guide rail, two carriers which are arranged on the carrier guide rail to reciprocate along the carrier guide rail and are used for loading tablets, a dispensing system which is arranged at one side of the carrier guide rail and is used for dispensing the tablets on the carriers, and a die bonding system which is arranged at the other side of the carrier guide rail and is used for carrying out die bonding on the tablets on the carriers, wherein the dispensing system is independent, and the die bonding system carries out die bonding on the tablet on one carrier while the dispensing system carries out dispensing on the tablet on the other carrier. The LED die bonding and dispensing system is provided with the die bonding system, two carriers and the independent dispensing system, and dispensing and die bonding cannot grab one station, so that a series connection on a timing sequence is changed into a parallel connection, and when the carriers change the tablets, the carriers and the dispensing system have a series relation on the time sequence, so that a die bonding period is not occupied, and the die bonding efficiency is greatly improved.

Description

Technical field [0001] The invention relates to the field of die-bonding packaging equipment, and in particular to an LED die-bonding dispensing system and method. Background technique [0002] In the existing die bonding machine, the work flow is: the carrier moves to a die-fixing point → the dispensing system dispenses the dot → the die-bonding system solidifies the point → the carrier moves to the next die-attach point → Repeat the above process to complete the dispensing and solidification action of the entire blank → carrier replacement material → continue the dispensing and solidification action of the blank. As the speed requirements of the die bonder are getting higher and higher, the process highlights two areas for improvement. First, dispensing and die bonding need to occupy the same station. The improvement of the efficiency of one action (dispensing or die bonding) will be restricted by the other action, which will greatly limit the efficiency of the die bonder. im...

AI Technical Summary

Problems solved by technology

First, glue dispensing and die bonding need to occupy the same station, and the improvement of the efficiency of one action (glue dispensing or die bonding) will be restrained by the other action, which will greatly limit the efficiency of the die bonder improve

In order to meet the current market demand for efficiency, most current die bonders need to have two sets of glue dispensing and die bond systems, which brings problems of high cost and bulky

Second, too much time is occupied by the loading and changing of blanks

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