Die bonding method for automatic quartz alignment by image recognition

Abstract

A high-speed die bond method for crystal by automatic image recognition is characterized in that the die bond method comprises the following steps: (1) a wafer platform and a circuit board platform realize driving in X and Y direction, the two platforms all select a Bonder Head position moving up and down as an origin of coordinate, all the origins automatically reset to zero when starting up; (2) image data are input into a computer which is responsible for analyzing, computing and processing the input images, the computer can process a plurality of groups of image data at the same time and match and compute the deviation of coordinates of corresponding points in each group based on the requirements; (3) movement to the place right under the Bonder Head or right above the Bonder Head is carried out according to the regulated time sequence, the wafer is pressed and mounted on the circuit board, thus completing die bond. The method has the advantages that the automatic position controlof computer is adopted, the Bonder Head does not need reciprocation, the die bond efficiency is high, a plurality of groups of die bond images can be processed simultaneously, the cost is saved and the requirement of improving the die bond speed and accuracy is met.

Description

technical field [0001] The invention relates to a high-speed crystal-bonding method, in particular to a high-speed crystal-bonding method for automatic image recognition alignment. Background technique [0002] With the increasingly urgent requirements for energy saving and emission reduction worldwide, the application of semiconductor lighting projects is becoming more and more extensive. At present, there are two known methods of die bonding at home and abroad: one is artificial die bonding under a microscope, which is inefficient; the other is automatic die bonding using an automatic die bonder. The working principle of various automatic die bonding machines is to use the Bangtou to take the crystal and then move to the bonding position for die bonding. Although the structure of the Bangtou system is different, it is far from the crystal picking position to the bonding position. Distance movement, crystal bonding accuracy and speed are severely restricted, and various au...

AI Technical Summary

Problems solved by technology

At present, there are two well-known crystal bonding methods at home and abroad: one is artificial crystal bonding under a microscope, which is inefficient; the other is to use automatic crystal bonding machines to automatically bond crystals

The working principle of various automatic die bonding machines is to use the Bangtou to take the crystal and then move to the bonding position for die bonding. Although the structure of the Bangtou system is different, it is far from the crystal picking position to the bonding position. Distance movement, crystal bonding accuracy and speed are severely restricted, and various auxiliary motion mechanisms are complex in structure and poor in stability

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