1194results about "Variable resistance transducer microphones" patented technology

A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit, substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.

The interior cabin of a vehicle is provided with a vehicular sound-processing system that comprises an interior rearview mirror assembly, the mirror assembly including a mirror housing and a reflective element. An accessory is located in the interior cabin. The interior rearview mirror assembly comprises a user-interaction site for a wireless communication system, the wireless communication system communicating with the accessory. The user-interaction site comprises at least one microphone for producing an audio output in response to detection of vocal input of a human speaker in the interior cabin with the vehicle cabin noise superimposed thereon. Preferably, the user-interaction site further comprises at least one manually operated control input. The restricted-range wireless communication system preferably comprises one of a radio frequency restricted-range wireless communication system and an infrared restricted-range wireless communication system. Signals indicative of the vocal input detected at the user-interaction site of the interior mirror assembly are wirelessly broadcast to the accessory located in the interior cabin of the vehicle.

A microphone has a substrate including an acoustically transparent substrate region, a lid with an acoustically transparent lid region, and a membrane which is held by a membrane carrier between the lid and the substrate. The acoustically transparent substrate region or the acoustically transparent lid region is provided with at least one impedance hole sized so that an acoustic impedance of the impedance hole is larger than an acoustic impedance of the acoustically transparent region of the respective other region of substrate region and lid region.

A microphone system has a base with at least one electrical port for electrically communicating with an external device. The system also has a solid metal lid coupled to the base to form an internal chamber, and a silicon microphone secured to the lid within the chamber. The lid has an aperture for receiving an audible signal, while the microphone is electrically connected to the electrical port of the base.

A communications headset for use with a wireless telephone comprises a mount and a first and second attachment shaped to secure itself to the mount, wherein the first attachment is configured to secure itself around the ear of a user and wherein the second attachment includes a top portion to secure itself to the frame of a pair of glasses worn by the user. Optionally, the mount includes a slot formed through the housing of the communication headset and the first and second attachments include a downwardly dependent leg shaped and sized for receipt in the slot. Also optionally, the mount and the first and second attachment are secured to one another using a magnet attached to either of the housing or the attachments.

A headset having game, chat and microphone audio signals is provided with a programmable signal processor for individually modifying the audio signals and a memory configured to store a plurality of user-selectable signal-processing parameter settings that determine the manner in which the audio signals will be altered by the signal processor. The parameter settings collectively form a preset, and one or more user-operable controls can select and activate a preset from the plurality of presets stored in memory. The parameters stored in the selected preset can be loaded into the signal processor such that the sound characteristics of the audio paths are modified in accordance with the parameter settings in the selected preset.

A side-ported MEMS microphone package defines an acoustic path from a side of the package substrate to a microphone die disposed within a chamber defined by the substrate and a lid attached to the substrate. Optionally or alternatively, a circuit board, to which the microphone package is mounted, may define an acoustic path from an edge of the circuit board to a location under the microphone package, adjacent a bottom port on the microphone package. In either case, the acoustic path may be a hollow passage through at least a portion of the substrate or the circuit board. The passage may be defined by holes, channels, notches, etc. defined in each of several layers of a laminated substrate or circuit board, or the passage may be defined by holes drilled, molded or otherwise formed in a solid or laminated substrate or circuit board.

A microphone system implements multiple microphones on a single base. To that end, the microphone system has a base, and a plurality of substantially independently movable diaphragms secured to the base. Each of the plurality of diaphragms forms a variable capacitance with the base and thus, each diaphragm effectively forms a generally independent, separate microphone with the base.

MEMS microphone packages and fabrication methods thereof are disclosed. A MEMS microphone package includes a cavity that houses a MEMS sensing element, an IC chip and other passive elements supported by a common substrate. The cavity is formed by a top cover member, a housing wall surrounds and supports the top cover member and the common substrate supports the housing wall. A conductive casing encloses and surrounds the cavity, and is electrically connected to a common analog ground lead on a PCB board. The top cover member and the housing wall are non-conductive. And the conductive casing is not connected directly to the ground leads of the package. An acoustic absorption layer is sandwiched between the conductive casing and the cavity which is formed by the top cover member, the housing wall and the substrate.

A self calibrating dipole microphone formed from two omni-directional acoustic sensors. The microphone includes a sound source acoustically coupled to the acoustic sensors and a processor. The sound source is excited with a test signal, exposing the acoustic sensors to acoustic calibration signals. The responses of the acoustic sensors to the calibration signals are compared by the processor, and one or more correction factors determined. Digital filter coefficients are calculated based on the one or more correction factors, and applied to the output signals of the acoustic sensors to compensate for differences in the sensitivities of the acoustic sensors. The filtered signals provide acoustic sensor outputs having matching responses, which are subtractively combined to form the dipole microphone output.

A microphone comprises a housing defining an inner volume and including a first exterior surface with an aperture leading to the inner volume. The microphone includes a transducing assembly within the housing for converting sound into an electrical signal. A sound inlet plate defines, typically in combination with the first exterior surface, a passageway for transmitting sound to the aperture The passageway receives the sound from an opening in the sound inlet plate. The opening is offset from the location at which the aperture is positioned on the exterior surface. The sound inlet plate is made very thin so that it does not extend substantially away from the housing.

A MEMS microphone package is disclosed. The MEMS microphone package comprises a housing, a MEMS die and an ASIC chip. The housing includes a base, a sidewall extending from the base, and a cover supported by the sidewall for forming a receiving space. The housing defines an acoustic hole for receiving external sound waves. The MEMS die is accommodated in the housing and the MEMS die defines a plurality of first conductive pads. The ASIC chip is accommodated in the housing and the ASIC chip defines a plurality of second conductive pads.

A silicon condenser microphone package includes a transducer unit, a substrate, and a cover. The substrate includes an upper surface transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and either the cover or the substrate includes an aperture.

An apparatus includes first and second microphone arrangements, arranged to output first and second signals respectively and is operable in a first mode and a second mode. In the first mode, an output signal is generated based on the second signal and a third signal, where the second signal and, optionally, the first signal, can be used to compensate for ambient noise, for example, for noise cancellation when a telephone call is relayed through a speaker. In the second mode, an output signal is generated based on the first and second signals. In this manner, the combination of the first and second microphone arrangements provides a directional sensitivity that can pick up sound from a remote source, for example, in an audio or video recording session. The apparatus may include a sensor to allow automatic switching between one or more of modes, directional sensitivity patterns and types of recording session.

An acoustic receiver comprises means for converting an input audio signal into an acoustic signal. The receiver has a housing having a plurality of sides that surround the converting means. One of the sides include an output port for broadcasting the acoustic signal. A jacket fits around the housing and has sections for engaging the sides. The sections are generally flat. The jacket may also form a gap with a corresponding side surface of the housing. A printed circuit board can be located within the gap. The printed circuit board including electronics for processing said input audio signal.

A vehicle overhead audio system, an electromagnetic transducer assembly for use therein and a computer system programmed with a graphic software control for changing the audio system's signal level and delay are provided where a headliner of the vehicle is a loudspeaker of the system thereby replacing many other loudspeakers and being invisible to the occupants. The headliner is driven in multiple zones that effect proper imaging for all occupants. Supplemental high frequency and subwoofer speakers and signal processing circuitry are included in one aspect of the invention.

A tooth microphone apparatus worn in a human mouth that includes a sound transducer element in contact with at least one tooth in mouth, the transducer producing an electrical signal in response to speech and a means for transmitting said electrical signal from the sound transducer to an external apparatus. The sound transducer can be a MEMS accelerometer, and the MEMS accelerometer can be coupled to a signal conditioning circuit for signal conditioning. The signal conditioning circuit can be further coupled to a transmitter. The transmitter can be an RF transmitter of any type, an optical transmitter, or any other type of transmitter. In particular, it can be a bluetooth device or a device that transmits into a Wi-Fi network or any other means of communication. The transmitter is optional.

A vehicle interior rearview mirror assembly (10) comprises an accessory (24), a reflective element (18) and a bezel (20). The mirror assembly may define portions of a pocket (23) that at least partially receives and secures the accessory therebetween when the reflective element is at least partially received in the bezel. The mirror assembly (11) may include a microphone (124) and an acoustic cover (126) positioned at least partially over one or more inlet ports (124j, 124k) of the microphone. The acoustic cover may include an outer air flow limiting layer (130b) that substantially limit air flow therethrough and a diffusing material (130a) that may space and support the outer layer from the inlet ports to substantially diffuse air flow that penetrates the outer layer. An acoustic barrier (132) may be positioned between a pair of inlet port of the microphone to enhance the directivity of the microphone.

The present invention relates to a microphone that includes a housing and a diaphragm and backplate located with the housing. The housing has a sound port for receiving the sound. The diaphragm undergoes movement relative to the backplate, which it opposes, in response to the incoming sound. The backplate has a charged layer with a first surface that is exposed to the diaphragm and a second surface opposite the first surface. The backplate further includes a conductor for transmitting a signal from the backplate to electronics in the housing. The conductor faces the second surface of the charged layer. To minimize the charge degradation created by contact with or infiltration of foreign materials, the first surface, the second surface, or both surfaces of the charged layer includes a protective layer thereon.

The invention relates to a microphone assembly comprising a housing, a microphone element within the housing, a base element, contacting elements, a removable element, and connecting means. The housing is configured such that it may be opened and re-closed. The base element is positioned inside the housing and comprises one or more first electrical conductors. The base element comprises one or more first conducting surface parts connected to one or more of the first conductors. The contacting elements facilitate electrical contact between one or more of the first conductors and one or more conductors positioned outside the housing. The removable element is positioned within the housing and comprises one or more second electrically conductive surface parts. The connecting means provides an easily breakable / removable electrical connection between a first surface part and a second surface part.

The present invention provides a miniature MEMS microphone comprising a single-ended transducer element connected to an amplifier providing a differential electrical output at terminals arranged at a substantially plane exterior surface. The differential or balanced output signal provides a miniature microphone exhibiting a high dynamic range and a reduced susceptibility to EMI. The microphone is adapted for surface mounting thus the extra output terminal required is still suitable for low cost mass production. In preferred embodiments the transducer element and amplifier are silicon-based. The microphone may have a plurality of separate single-ended transducer elements connected to separate amplifiers providing separate differential outputs. The microphones according to the invention are advantageous for applications within for example hearing aids and mobile equipment.

A microphone assembly includes a cover, a base coupled to the cover, a microelectromechanical system (MEMS) device disposed on the base. An opening is formed in the base and the MEMS device is disposed over the opening. The base includes a barrier that extends across the opening and is porous to sound. The remaining portions of the base do not extend across the opening.

An elastic shield comprising an acoustic channel having a sound inlet and a sound outlet, and a hollow portion being adapted to at least partly surround a miniature microphone, or alternatively, arranged to follow an outer contour of a miniature microphone. The present invention further relates to a miniature microphone assembly comprising a miniature microphone having a sound inlet, and an elastic shield comprising an acoustic channel having a sound inlet and a sound outlet, the elastic shield further comprising a hollow portion housing at least part of the miniature microphone in a manner so that the sound outlet of the acoustic channel is aligned with the sound inlet of the miniature microphone.

The robustness of hearing aid devices in terms of electromagnetic disturbances and chemically aggressive surroundings should be improved. For this purpose, provision is made to equip a hearing aid apparatus with optical microphones. Since no metal parts must be used for these optical micro-phones, corrosion can be largely excluded. Furthermore, no EMC problems occur as a result of the optical signal processing.

A microphone having an optical component for converting the sound-induced motion of the diaphragm into an electronic signal using a diffraction grating. The microphone with inter-digitated fingers is fabricated on a silicon substrate using a combination of surface and bulk micromachining techniques. A 1 mm×2 mm microphone diaphragm, made of polysilicon, has stiffeners and hinge supports to ensure that it responds like a rigid body on flexible hinges. The diaphragm is designed to respond to pressure gradients, giving it a first order directional response to incident sound. This mechanical structure is integrated with a compact optoelectronic readout system that displays results based on optical interferometry.

A silicon based microphone sensing element and a method for making the same are disclosed. The microphone sensing element has a diaphragm with a perforated plate adjoining each side or corner. The diaphragm is aligned above one or more back holes created in a conductive substrate wherein the back hole has a width less than that of the diaphragm. Perforated plates are suspended above an air gap that overlies the substrate. The diaphragm is supported by mechanical springs with two ends that are attached to the diaphragm at a corner, side, or center and terminate in a rigid pad anchored on a dielectric spacer layer. A first electrode is formed on one or more rigid pads and a second electrode is formed at one or more locations on the substrate to establish a variable capacitor circuit. The microphone sensing element can be embodied in different approaches to reduce parasitic capacitance.

Method and apparatus are disclosed for damping the resonance frequency in a microphone. The method and apparatus of the invention involve providing an elastomeric frame to support the backplate. The elastomeric frame forms a substantially air tight seal around the backplate. A hole is formed in the backplate and a cover having an opening therein is placed over the hole in the backplate. The frequency response of the microphone may then be controlled by precisely controlling the size, shape, and / or location of the opening in the cover overlaying the hole. The cover may also serve as an electrical contact to other components in the microphone.