57results about "Solid state device transducers" patented technology

A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalisation of the air volumes above and below the membrane.

A MEMS microphone includes a first diaphragm element, a counter electrode element, and a low pressure region between the first diaphragm element and the counter electrode element. The low pressure region has a pressure less than an ambient pressure.

A microphone having an optical component for converting the sound-induced motion of the diaphragm into an electronic signal using a diffraction grating. The microphone with inter-digitated fingers is fabricated on a silicon substrate using a combination of surface and bulk micromachining techniques. A 1 mm×2 mm microphone diaphragm, made of polysilicon, has stiffeners and hinge supports to ensure that it responds like a rigid body on flexible hinges. The diaphragm is designed to respond to pressure gradients, giving it a first order directional response to incident sound. This mechanical structure is integrated with a compact optoelectronic readout system that displays results based on optical interferometry.

An audio sensing device having a resonator array and a method of acquiring frequency information using the audio sensing device are provided. The audio sensing device includes a substrate having a cavity formed therein, a membrane provided on the substrate and covering the cavity, and a plurality of resonators provided on the membrane and respectively sensing sound frequencies of different frequency bands.

Disclosed herein is a multi-cantilever MEMS sensor functioning as a mechanical sensor having a plurality of cantilevers, replacing a conventional DSP based sound source localization algorithm and reducing production cost when the MEMES sensor applied to mass-produced robots, a manufacturing method thereof, a sound source localization apparatus using the multi-cantilever MEMS sensor and a sound source localization method using the sound source localization apparatus. The multi-cantilever MEMS sensor comprises a plurality of cantilevers 100 each of which includes a piezoresistor 20 and a sensing part 30 for sensing a predetermined signal generated according to the piezoresistor 20l; and a terminal T for detecting the signal generated according to the piezoresistor 20, wherein one end of each cantilever is a free end and the other end thereof is a fixed end of each cantilever, the piezoresistor 20 and the sensing part 30 are formed at the fixed end, and the free ends of the plurality of cantilevers 100 have different lengths. A method of manufacturing the multi-cantilever MEMS sensor is provided. Furthermore, a method of using the multi-cantilever MEMS sensor and a sound source localization apparatus are provided.

An assembly (220) includes a MEMS die (222) and an integrated circuit (IC) die (224) attached to a substrate (226). The MEMS die (222) includes a MEMS device (237) formed on a substrate (242). A packaging process (264) entails forming the MEMS device (237) on the substrate (242) and removing a material portion of the substrate (237) surrounding the device (237) to form a cantilevered substrate platform (246) suspended above the substrate (226) at which the MEMS device (237) resides. The MEMS die (222) is electrically interconnected with the IC die (224). A plug element (314) can be positioned overlying the platform (246). Molding compound (32) is applied to encapsulate the die (222), the IC die (224), and substrate (226). Following encapsulation, the plug element (314) can be removed, and a cap (236) can be coupled to the substrate (242) overlying an active region (244) of the MEMS device (237).

A capacitive transducer has a back plate including a fixed electrode, a diaphragm facing the back plate with an air gap interposed therebetween, the diaphragm acting as a movable electrode, at least a first stopper of a first protruding length, and a second stopper of a second protruding length. The first and second stoppers protrude from at least either the surface on the back plate near the air gap or the surface on the diaphragm near the air gap. The first stopper is provided at a position corresponding to a first position on the diaphragm. The second the stopper is provided at a position corresponding to a second position on the diaphragm. An amount of displacement of the diaphragm at the first position is greater than an amount of displacement of the diaphragm at the second position. The protruding length of the first stopper is shorter than the protruding length of the second stopper.

An external clock signal having a first frequency is received. A division ratio is automatically determined based at least in part upon a second frequency of an internal clock. The second frequency is greater than the first frequency. A decimation factor is automatically determined based at least in part upon the first frequency of the external clock signal, the second frequency of the internal clock signal, and a predetermined desired sampling frequency. The division ratio is applied to the internal clock signal to reduce the first frequency to a reduced third frequency. The decimation factor is applied to the reduced third frequency to provide the predetermined desired sampling frequency. Data is clocked to a buffer using the predetermined desired sampling frequency.

A micromechanical sound transducer arrangement includes an electrical printed circuit board (1) having a front side (VS) and a rear side (RS). A micromechanical sound transducer structure (3) is applied to the front side (VS) using the flip-chip method. The printed circuit board (1) defines an opening (5) for emitting soundwaves (S) in the region of the micromechanical sound transducer structure (3).

Provided are a MEMS microphone and a formation method thereof. The formation method comprises: providing a first substrate comprising a first surface and a second surface, wherein, the first substrate comprises at least one conductive layer, which is located at a side of the first surface of the first substrate; providing a second substrate comprising a third surface and a fourth surface, wherein, the second substrate comprises a second base and a sensitive electrode, and comprises a sensitive area, in which the sensitive electrode is located at a side of the third surface of the second substrate; fixing the first surface of the fist substrate and the third surface of the second substrate each other; thereafter, removing the second base, and forming a fifth surface opposite to the third surface of the second substrate; forming an empty cavity between the first substrate and the sensitive area of the second substrate; and forming, from a side of the fifth surface of the second substate, a first conductive plug penetrating to the at least one conductive layer. The MEMS microphone is improved in performance and reliability, is reduced in size, and is lowed in process cost.

A MEMS transducer configured to operate as a microphone, the MEMS transducer comprising a flexible membrane, the flexible membrane having a first surface and a second surface, wherein the first surface of the flexible membrane is fluidically isolated from the second surface of the flexible membrane. Also, a MEMS device comprising a MEMS transducer, an electronic device comprising a MEMS transducer and/or a MEMS device, and a method for forming a MEMS device.

A miniature microphone comprising a diaphragm compliantly suspended over an enclosed air volume having a vent port is provided, wherein an effective stiffness of the diaphragm with respect to displacement by acoustic vibrations is controlled principally by the enclosed air volume and the port. The microphone may be formed using silicon microfabrication techniques and has sensitivity to sound pressure substantially unrelated to the size of the diaphragm over a broad range of realistic sizes. The diaphragm is rotatively suspend for movement through an arc in response to acoustic vibrations, for example by beams or tabs, and has a surrounding perimeter slit separating the diaphragm from its support structure. The air volume behind the diaphragm provides a restoring spring force for the diaphragm. The microphone's sensitivity is related to the air volume, perimeter slit, and stiffness of the diaphragm and its mechanical supports, and not the area of the diaphragm.

The invention relates to the technical field of display devices and discloses a display panel, a preparation method of the display panel, a display device and a health monitoring method of the display device. The display panel comprises a substrate and a sonic sensor arranged on the substrate. According to the technical scheme, the sonic sensor is directly formed on the substrate, the sonic sensor can be formed while other structures of the display panel are prepared, and the preparation efficiency of the display device is improved; meanwhile, the thickness of the formed display device is reduced, and thin type development of the display device is convenient.

A micro-electrical-mechanical system (MEMS) microphone includes a MEMS structure, having a substrate, a diaphragm, and a backplate, wherein the substrate has a cavity and the backplate is between the cavity and the diaphragm. The backplate has multiple venting holes, which are connected to the cavity and allows the cavity to extend to the diaphragm. Further, an adhesive layer is disposed on the substrate, surrounding the cavity. A cover plate is adhered on the adhesive layer, wherein the cover plate has an acoustic hole, dislocated from the cavity without direct connection.

A MEMS microphone package device includes a MEMS microphone chip as an integrated circuit chip. An acoustic sensing structure is embedded in the integrated circuit chip. An adhesive structure adheres on outer sidewall of the microphone chip. A bottom portion of the adhesive structure protrudes out from first surface of the microphone chip and adheres on a surface of a substrate, having interconnection structure, to form a first seal ring. A space between the acoustic sensing structure and the substrate and sealed by the first seal ring forms a second chamber. A cover adheres to top portion of the adhesive structure, covering over the cavity on the second surface of the microphone chip. The top portion of the adhesive structure forms as a second seal ring. A space between the cover and the second surface of the microphone chip and sealed by the second seal ring forms a first chamber.

A dual diaphragm microphone can be used to reduce or eliminate a component of the output signal due to acceleration of the microphone. The dual diaphragm microphone can include a first sound-detecting component including a first diaphragm spaced apart from a first electrode and configured to generate a first signal and a second sound-detecting component including a second diaphragm spaced apart from a second electrode and configured to generate a second signal. The first sound-detecting component and the second sound-detecting component are oriented in opposite directions and include electronic circuitry configured to sum the first and second output signals to generate a combined output signal substantially unaffected by acceleration of the microphone.