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Microelectro-mechanical systems (MEMS) microphone package device and MEMS packaging method thereof

A technology for micro-electromechanical systems and packaging components, which is used in electrical components, semiconductor electrostatic transducers, electrostatic transducer microphones, etc., and can solve the problem of large size of packaging

Inactive Publication Date: 2016-06-22
SOLID STATE SYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, the size of the package is relatively large

Method used

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  • Microelectro-mechanical systems (MEMS) microphone package device and MEMS packaging method thereof
  • Microelectro-mechanical systems (MEMS) microphone package device and MEMS packaging method thereof
  • Microelectro-mechanical systems (MEMS) microphone package device and MEMS packaging method thereof

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Embodiment Construction

[0059] In the present invention, a silicon MEMS microphone chip has an integrated circuit embedded in the same chip. The silicon MEMS microphone chip is a single chip on the package. The silicon MEMS microphone chip can be adhered to the substrate using an adhesive structure to form a completely hermetically sealed space except for the acoustic hole for receiving ambient sound sources.

[0060] Several examples are provided below to describe the present invention, but the present invention is not limited to the illustrated examples.

[0061] image 3 A schematic cross-sectional structure diagram of a micro-electro-mechanical system microphone package element is shown according to an embodiment of the present invention. refer to image 3 , the MEMS microphone package component 120 includes a substrate 100 as a base. The substrate 100 has an interconnection structure 104 . The interconnect structure 104 has a plurality of connection pads, such as metal pads, on both surface...

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Abstract

The present invention discloses a microelectro-mechanical systems (MEMS) microphone package device and a MEMS packaging method thereof. A MEMS microphone package device includes a MEMS microphone chip as an integrated circuit chip. An acoustic sensing structure is embedded in the integrated circuit chip. An adhesive structure adheres on outer sidewall of the microphone chip. A bottom portion of the adhesive structure protrudes out from first surface of the microphone chip and adheres on a surface of a substrate, having interconnection structure, to form a first seal ring. A space between the acoustic sensing structure and the substrate and sealed by the first seal ring forms a second chamber. A cover adheres to top portion of the adhesive structure, covering over the cavity on the second surface of the microphone chip. The top portion of the adhesive structure forms as a second seal ring. A space between the cover and the second surface of the microphone chip and sealed by the second seal ring forms a first chamber.

Description

technical field [0001] The invention relates to a micro-electro-mechanical system (micro-electro-mechanical system, MEMS) microphone packaging component and a packaging method thereof. Background technique [0002] Silicon MEMS microphone chips, such as MEMS microphones, have been proposed to form a large number of microphones with a reduced size, and thus can be easily installed in a large system. [0003] figure 1 A schematic diagram of a traditional packaged MEMS microphone is shown. refer to figure 1 , the silicon MEMS microphone chip 52 and the integrated circuit chip 56 are arranged on a substrate 50, and there are suitable bonding wires therebetween for connection. The substrate acts as a circuit substrate for communication between the silicon MEMS microphone chip 52 and the integrated circuit chip 56 . The silicon MEMS microphone chip 52 can sense the sound source received by the sound hole 62 of the cap 58 and convert the sound source into an electrical signal. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04H04R31/00
CPCH04R31/00H04R2201/003H04R19/005H04R19/04H04R23/006
Inventor 谢聪敏李建兴钟志贤陈咏伟刘志成
Owner SOLID STATE SYST
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