Microelectro-mechanical systems (MEMS) microphone package device and MEMS packaging method thereof

Abstract

A MEMS microphone package device includes a MEMS microphone chip as an integrated circuit chip. An acoustic sensing structure is embedded in the integrated circuit chip. An adhesive structure adheres on outer sidewall of the microphone chip. A bottom portion of the adhesive structure protrudes out from first surface of the microphone chip and adheres on a surface of a substrate, having interconnection structure, to form a first seal ring. A space between the acoustic sensing structure and the substrate and sealed by the first seal ring forms a second chamber. A cover adheres to top portion of the adhesive structure, covering over the cavity on the second surface of the microphone chip. The top portion of the adhesive structure forms as a second seal ring. A space between the cover and the second surface of the microphone chip and sealed by the second seal ring forms a first chamber.

Description

BACKGROUND[0001]1. Field of Invention[0002]The present invention relates to MEMS microphone package device and MEMS packaging method.[0003]2. Description of Related Art[0004]The Silicon MEMS microphone chip, such as MEMS microphone, has been proposed to form a microphone with rather reduced volume and then can be easily implemented into the large system.[0005]FIG. 1 is a drawing, schematically illustrating a conventional MEMS microphone after packaging. In FIG. 1, a Silicon MEMS microphone chip 52 and an integrated circuit chip 56 are implemented on the substrate 50 with proper wire bonding. The substrate functions as a circuit board for communicating between the Silicon MEMS microphone chip 52 and the integrated circuit chip 56. The Silicon MEMS microphone chip 52 can sense an acoustic source received from an acoustic aperture 62 of a cap 58 and convert the acoustic source into electric signal. In order to process the sensing signal, the integrated circuit chip 56 receives the sens...

AI Technical Summary

Benefits of technology

The invention provides a way to make a small and single-chip MEMS microphone package. The package includes a silicon microphone chip, a substrate, an adhesive structure, and a cover. The chip is embedded in the substrate and has a cavity on its surface to receive acoustic signals. The adhesive structure adheres to the chip and forms a seal with the substrate to create two chambers connected acoustically. The cover is attached to the top of the adhesive structure to seal over the chip's cavity. The packaging method involves adhering the chips to a substrate and forming an adhesive structure to create two seals. The covers are then attached to the chips to form two separate devices. The invention allows for smaller and more efficient MEMS microphone packaging.

Problems solved by technology

Further the package size is relatively large.

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