65 results about "Spacer coupling" patented technology

A packaged microchip has a base, at least one spacer coupled to the base, and first and second microchips mounted to the at least one spacer. The at least one spacer is configured to substantially prevent leakage current between the first and second microchips.

The invention is a method of transporting a pipe mounted within a plurality of brackets, each bracket having a body, an arm coupled to the body, a support guide located within the arm and configured to provide support to the pipe, a base coupled to the body and configured to attach a platform, the base further configured to provide support to the body, a spacer coupled to the body and configured to maneuver the bracket, wherein each bracket is configured to maintain support for the pipe while the bracket is maneuvered by the spacer. The method comprises the following. Position the plurality of brackets with the spacer proximate to the transporting surface. Set the spacer of each of the plurality of brackets on the transporting surface.

An apparatus for conveying conveyable material. The apparatus includes a plurality of cars joined together by a plurality of spacers. The spacers couple the cars a fixed distance apart to form a shuttle. The shuttle is guided along a track between a first position and a second position. In the first position, the shuttle is aligned with a first group of supports. The shuttle in the first position receives conveyable material from the supports. The shuttle in the second position is aligned with a second group of supports. The shuttle disposes the conveyable material from each of the cars carrying the conveyable material to the second group of supports. A drive means repeatedly drives the shuttle between the first position and the second position. The cars remain the fixed distance apart during the driving between the first position and the second position.

In one aspect, the invention provides a method for planarizing a circular disc-type semiconductor wafer or other substrate. The method includes the steps of pressing a retaining ring surrounding the wafer against a polishing pad at a first pressure; pressing a first peripheral edge portion of the wafer against the polishing pad with a second pressure; and pressing a second portion of the wafer interior to the peripheral edge portion against the polishing pad with a third pressure. The second pressure may be provided through a mechanical member in contact with the peripheral edge portion; and the second pressure may be a pneumatic pressure against a backside surface of the wafer. Desirably, the pneumatic pressure is exerted through a resilient membrane, or is exerted by gas pressing directly against at least a portion of the wafer backside surface. A carrier or subcarrier for a CMP apparatus that includes: a plate having an outer surface; a first pressure chamber for exerting a force to urge the plate in a predetermined direction; a spacer coupled to a peripheral outer edge of the plate; a membrane coupled to the plate via the spacer and separated from the plate by a thickness of the spacer; and a second pressure chamber defined between the membrane and the plate surface for exerting a second force to urge the membrane in a third predetermined direction. Substrate, such as a semiconductor wafer, processed or fabricated according to the invention.

An integrated circuit device including a die with a substrate with a first surface and a second surface opposite the first surface is provided. The die includes at least one circuit element positioned on the first surface. Formed on the second surface, is a wetting feature that includes an array of spaced-apart nanoscale structures and / or an array of spaced-apart microscale structures. The wetting feature also includes a wettability coating applied to at least a portion of the second surface. The integrated circuit device includes a spacer coupled to the die adjacent to the second surface. In addition, an injector plate is coupled to the spacer. The injector plate includes at least one microjet and at least one exit hole defined through the injector plate. The at least one exit hole is positioned adjacent to the at least one microjet.

A cable backplane system includes a backplane having a plurality of openings and mounting blocks proximate the openings. A cable rack is coupled to a rear of the backplane that includes a tray, spacers coupled to the tray and cable connector assemblies held by corresponding spacers. Each cable connector assembly has a plurality of cables extending between cable connectors. The cable connectors are received in corresponding openings and held in position relative to the backplane by the spacers. Locking assemblies are held by the tray and have a latch proximate to a front edge of the tray configured to interact with a corresponding one of the mounting blocks to lockably couple the tray to the backplane. The locking assemblies each have an actuator at a rear of the tray that is actuated by an installer to lock and unlock the latch with the mounting block.

A connector assembly includes a housing, a plurality of contact modules received in the housing, and a pin spacer coupled to the contact modules. Each contact module has a plurality of contacts each including a pin extending from a bottom of the corresponding contact module. The pin spacer has a plurality of pin holes extending through the pin spacer. The pin holes receive corresponding pins for mounting to the circuit board. The pin spacer holds relative positions of the pins. The pin spacer has side edges at opposite sides of the pin spacer and lugs extending from the top of the pin spacer proximate to the sides of the pin spacer. The lugs block entry into a space defined between the bottoms of the contact modules and the top of the pin spacer.

The present disclosure relates to a gas insulated switchgear (GIS), and more particularly, a structure of a bus in a GIS. A structure of a three-phase integrated bus in a GIS according to one exemplary embodiment, in a bus of a gas insulated switchgear comprising an enclosure (10), three phase conductors (30, 40, 50) inserted in the enclosure, and spacers coupled to both sides of the enclosure to fix the three phase conductors, is characterized in that the three phase conductors are arranged in a shape of inverted triangle, wherein a conductor (30) located at a lower side, of the three phase conductors, is formed in a shape of straight pipe, and has a branch bus (35) upwardly extending from its middle portion, and wherein each of two conductors (40, 50) located at an upper end of the inverted triangle, of the three phase conductors, has both side portions formed in a shape of straight pipe and a middle portion (42, 52) outwardly curved.

A window well assembly for buildings and the like include at least a first well unit and a second well unit each having opposite first and second flanges at opposite ends of a retaining wall of each unit for securing the well units to a sub-grade foundation of the building. Preferably, the assembly has a plurality of releasable spacer couplings that are mated and carried between well units when the assembly is in a stored state, and has indexing features that are mated and carried between well units when the assembly is in an assembled state.

A battery cell module includes a battery cell, a sliding repeating element, and a guide rail. The repeating element is disposed adjacent the battery cell. A gap is defined between the battery cell and the repeating element. The repeating element has a main body with at least one spacer coupled thereto. The guide rail cooperates with the at least one spacer and permits the repeating element to move with an expansion of the battery cell. The cooperation of the guide rail with the at least one spacer thereby militates against an overcompression of the battery cell.

A cable backplane system includes a backplane having a plurality of openings extending between a front and a rear of the backplane. The backplane has mounting locations proximate the openings. Mounting blocks are coupled to the front of the backplane at corresponding mounting locations. The mounting blocks are secured to the backplane by fasteners. A cable rack is coupled to the rear of the backplane and has a tray with a frame surrounding a raceway and spacers coupled to the tray. The spacers hold corresponding cable connectors and are secured to corresponding mounting blocks to position the spacers and cable connector assemblies relative to the backplane. The cable connectors are received in corresponding openings in the backplane and are held in position relative to the backplane by the spacers and mounting blocks.

A cable backplane system includes a tray having a frame with side walls surrounding a raceway. The side walls extend to a front edge of the frame. The tray includes spacers coupled to the tray located proximate to the front edge. Cable connectors are held by corresponding spacers in position relative to the backplane. The cable backplane system includes an electromagnetic radiation (EMR) absorber extending along an opening in the tray to suppress the propagation of EMR into or out of the tray.